JPS6135233B2 - - Google Patents
Info
- Publication number
- JPS6135233B2 JPS6135233B2 JP52016058A JP1605877A JPS6135233B2 JP S6135233 B2 JPS6135233 B2 JP S6135233B2 JP 52016058 A JP52016058 A JP 52016058A JP 1605877 A JP1605877 A JP 1605877A JP S6135233 B2 JPS6135233 B2 JP S6135233B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy resin
- acid
- bisphenol
- hydrogenated bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 33
- 239000003822 epoxy resin Substances 0.000 claims description 26
- 229920000647 polyepoxide Polymers 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 17
- 229920001225 polyester resin Polymers 0.000 claims description 12
- 239000004645 polyester resin Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 7
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- -1 isopentyl glycol Chemical compound 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- IBFJDBNISOJRCW-UHFFFAOYSA-N 3-methylphthalic acid Chemical compound CC1=CC=CC(C(O)=O)=C1C(O)=O IBFJDBNISOJRCW-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- QPKOBORKPHRBPS-UHFFFAOYSA-N bis(2-hydroxyethyl) terephthalate Chemical compound OCCOC(=O)C1=CC=C(C(=O)OCCO)C=C1 QPKOBORKPHRBPS-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、特に耐候性に優れた塗膜を形成する
粉体塗料用のエポキシ・ポリエステル系樹脂組成
物に関するものである。
周知の如く、ビスフエノールAのグリシジルエ
ーテル型エポキシ樹脂とカルボキシル基含有ポリ
エステル樹脂とを樹脂成分とするいわゆるエポキ
シ・ポリエステル系粉体塗料から得られる塗膜
は、耐蝕性、機械的性能に優れているが、耐候性
に劣つているため、短時間の暴露で光沢が著しく
低下し、黄変する欠点があつた。
本発明者等は、鋭意研究の結果、エポキシ樹脂
の鎖中にビスフエノールA核と水添ビスフエノー
ルA核を特定比率で含有させることにより、上記
欠点が改良できることを見い出し本発明に到つた
のである。
本発明は同一分子中に、つまり得られるエポキ
シ樹脂の分子鎖中にビスフエノールA核と水添ビ
スフエノール核とをモル比5/95〜40/60の比率で
含有するエポキシ樹脂とカルボキシル基含有ポリ
エステル樹脂とから成る粉体塗料用樹脂組成物に
関するものである。かゝる組成物から成る粉体塗
料用の硬化塗膜は、耐候性に優れているばかり
か、エポキシ・ポリエステル系本来の優れた耐蝕
性、機械的性質を有している。
使用するエポキシ樹脂中のビスフエノールA核
と水添ビスフエノールA核とのモル比は5/95〜4
0/60であり、より好ましくは10/90〜30/70の範囲
である。そして上記モル比が5/95より小さくなる
と、粉体塗料の耐ブロツキング性、硬化性が低下
するようになるし、また40/60より大きくなると
塗膜の耐候性が低下するようになるので好ましく
ない。エポキシ樹脂の環球法軟化点は60〜130℃
が適当であるし、またエポキシ当量は500〜3000
が適当である。そしてエポキシ樹脂の主鎖の結合
様式には制限がなく、エーテル結合のみでも良い
し、エーテル結合にエステル結合が加わつてもか
まわない。
かかるエポキシ樹脂を製造するには種々の方法
〓〓〓〓〓
がある。例えば水添ビスフエノールAのグリシジ
ルエーテル型エポキシ樹脂をビスノールAまたは
水添ビスフエノールAと反応させる方法、水添ビ
スフエノールAのグリシジルエーテル型エポキシ
樹脂及びビスフエノールAのグリシジルエーテル
型エポキシ樹脂の混合物をビスフエノールAまた
は水添ビスフエノールAと反応させる方法、水添
ビスフエノールAのグリシジルエーテル型エポキ
シ樹脂及びビスフエノールAのグリシジルエーテ
ル型エポキシ樹脂の混合物を多価カルボン酸また
は多価アルコールとゲル化に注意して反応させる
方法、これら方法により得たエポキシ樹脂を多価
カルボン酸または多価アルコールとゲル化に注意
して反応させる方法がある。これら方法におい
て、水添ビスフエノールAを反応成分として使用
する場合には三弗化硼素の如きルイス酸を触媒と
し、その他の場合は塩基性化合物を使う。
カルボキシル基含有ポリエステル樹脂は、カル
ボキシル基を多数有しているものを指す。それは
線状構造でも分岐構造でも良いが、カルボキシル
基を多数含有する点で分岐構造、特に1分子当り
2.5個以上のカルボキシル基を有する分岐構造の
ものが好ましい。酸価について言えば通常20〜
150KOHmg/g(単位を省略する)、より好まし
くは30〜100であり、また環球法軟化点は70〜150
℃が適当である。
かゝるポリエステル樹脂を製造するには、周知
の方法をいずれも採用することができる。使用で
きる酸原料の例には、テレフタル酸、イソフタル
酸、フタル酸、メチルフタル酸、トリメリツト
酸、ピロメリツト酸、アジピン酸、セバシン酸、
コハク酸、マレイン酸、フマル酸、テトラヒドロ
フタル酸、メチルテトラヒドロフタル酸、ヘキサ
ヒドロフタル酸およびこれらの反応性誘導体等が
ある。またアルコール原料の例には、エチレング
リコール、プロピレングリコール、1,3―ブタ
ンジオール、1,4―ブタンジオール、1,6―
ヘキサンジオール、ジエチレングリコール、ジプ
ロピレングリコール、1,4―シクロヘキサンジ
メタノール、ネオペンチルグリコール、イソペン
チルグリコール、ビスヒドロキシエチルテレフタ
レート、水添ビスフエノールA、水添ビスフエノ
ールAAのアルキレンオキサイド付加物、トリメ
チロールエタン、トリメチロールプロパン、グリ
セリン、ペンタエリスリトール、2,2,4―ト
リメチルペンタン―1,3―ジオール等があり、
モノエポキシ化合物もグリコールとして使用でき
る。特に好ましい結果を得るためには、使用する
全酸原料のうち芳香族多価カルボン酸を少くとも
70モル%、また使用する全アルコール原料のうち
炭素数4以上の脂肪族多価アルコールを少くとも
40モル%、シクロヘキサン環を有する多価アルコ
ールを3〜30モル%の割合でそれぞれ使用するの
が良い。
本発明組成物は、既述のエポキシ樹脂とポリエ
ステル樹脂とから成るものであるが、それらの配
合比としては、オキシラン基とカルボキシル基と
の当量比が0.5〜2.0好ましくは0.6〜1.5になる範
囲が好ましい。かゝる組成物は、硬化性が良いの
で、150℃以上好ましくは160〜230℃の温度で硬
化するが、加熱温度を下げたり加熱時間を短縮す
るために、必要に応じて第3級アミン、イミダゾ
ール誘導体、カルボン酸の金属塩化合物を添加使
用することができる。特にイミダゾール誘導体を
使用すると、厚塗りしてもピンホールの発生を抑
制できるので非常に有利である。また組成物に
は、ブロツクポリイソシアネート化合物を硬化剤
として併用することもできる。
粉体塗料を調製するには、本発明組成物に、流
動調整剤、顔料その他の充填剤、添加剤等を配合
し、溶融混練後固化させてから微粉砕する方法が
適している。
以下に本発明を実施例に従つて説明する。文中
の部は重量部を示す。
エポキシ樹脂1の合成
エポキシ当量480の水添ビスフエノールAジグ
リシジルエーテル型エポキシ樹脂900部とエピク
ロン850(大日本インキ化学工業製、エポキシ当
量180のビスフエノールAジグリシジルエーテル
型エポキシ樹脂)100部から成る混合物をN―メ
チルモルホリン2部の存在下にビスフエノール
A158部と120℃で3時間反応させて、軟化点93
゜、エポキシ当量1150、ビスフエノールA核と水
添ビスフエノールA核のモル比26/74のエポキシ
樹脂1を得た。
エポキシ樹脂2の合成
エポキシ樹脂1の調製時に使用した水添ビスフ
エノールタイプのエポキシ樹脂950部とエピクロ
〓〓〓〓〓
ン850 50部から成る混合物をN―メチルモルホリ
ン2部の存在下にビスフエノールA100部と120℃
で2時間反応させた後、アジピン酸37部を添加し
同温度で2時間反応させて、軟化点88゜、エポキ
シ当量1350、ビスフエノールA核と水添ビスフエ
ノールA核のモル比16/84のエポキシ樹脂2を得
た。
ポリエステル樹脂1の合成
ネオペンチルグリコール1046部、1,4―シク
ロヘキサンジメタノール119部、ジメチルテレフ
タレート1000部および酢酸亜鉛11部から成る混合
物を、生成するメタノールを反応系外に除去しな
がら150℃で1時間、210℃で2時間反応させた
後、トリメチロールプロパン47部、テレフタル酸
800部およびジプチルスズオキサイド1.5部を追加
して同温度で4時間、240℃で10時間反応させ、
ついで反応混合物を180℃に降温して無水トリメ
リツト酸313部を添加して同温度で3時間反応さ
せて、軟化点125゜、酸価62のポリエステル樹脂
1を得た。
ポリエステル樹脂2の合成
ネオペンチルグリコール1777部、1,4―シク
ロヘキサンジメタノール310部、1,6―ヘキサ
ンジオール70部、ジメチルテレフタレート1830
部、テレフタル酸1407部、および無水トリメリツ
ト酸316部からポリエステル樹脂1の合成と同様
の操作で反応を行なつて、軟化点120℃、酸価42
のポリエステル樹脂2を得た。
実施例
第1表に示した比率で各成分(使用量は部単位
である)をドライブレンドした後、ブス社製コニ
ーダーPR―46を用いて溶融混練してから微粉砕
し150メツシユ金網を通して白色粉体塗料を得
た。この塗料を静電吹付法によりリン酸亜鉛処理
鋼板に塗布し、180℃で15分間焼付けた。膜厚約
60ミクロンにおける塗膜性能は第1表に示す通り
であつた。
比較例 1
実施例1において、エポキシ樹脂1の代りに同
量のエピクロン4050(大日本インキ化学工業製、
エポキシ当量950のビスフエノールAのグリシジ
ルエーテル型エポキシ樹脂)を使用し、同様にし
て粉体塗料及び硬化塗膜を得た。
上記各例で得た粉体塗料及び硬化塗膜の性能を
第1表に示す。
The present invention particularly relates to an epoxy-polyester resin composition for powder coatings that forms a coating film with excellent weather resistance. As is well known, coating films obtained from so-called epoxy-polyester powder coatings containing bisphenol A glycidyl ether type epoxy resin and carboxyl group-containing polyester resin as resin components have excellent corrosion resistance and mechanical performance. However, due to its poor weather resistance, it had the drawback of significantly decreasing gloss and yellowing after short exposure. As a result of intensive research, the present inventors have discovered that the above drawbacks can be improved by containing bisphenol A nuclei and hydrogenated bisphenol A nuclei in a specific ratio in the epoxy resin chain, and have arrived at the present invention. be. The present invention is directed to an epoxy resin containing a bisphenol A nucleus and a hydrogenated bisphenol nucleus at a molar ratio of 5/95 to 40/60 in the same molecule, that is, in the molecular chain of the obtained epoxy resin, and a carboxyl group-containing The present invention relates to a resin composition for powder coatings comprising a polyester resin. A cured coating film for powder coatings made of such a composition not only has excellent weather resistance, but also has excellent corrosion resistance and mechanical properties inherent to epoxy/polyester systems. The molar ratio of bisphenol A nucleus and hydrogenated bisphenol A nucleus in the epoxy resin used is 5/95 to 4.
It is 0/60, more preferably in the range of 10/90 to 30/70. If the above molar ratio is smaller than 5/95, the blocking resistance and curing properties of the powder coating will be reduced, and if it is larger than 40/60, the weather resistance of the coating film will be reduced, so it is preferable. do not have. The ring and ball softening point of epoxy resin is 60~130℃
is suitable, and the epoxy equivalent is 500 to 3000
is appropriate. There is no restriction on the bonding mode of the main chain of the epoxy resin, and it may be only an ether bond, or an ester bond may be added to the ether bond. There are various methods for producing such epoxy resins.
There is. For example, a method of reacting a glycidyl ether type epoxy resin of hydrogenated bisphenol A with bisnol A or hydrogenated bisphenol A, a method of reacting a glycidyl ether type epoxy resin of hydrogenated bisphenol A, and a mixture of a glycidyl ether type epoxy resin of hydrogenated bisphenol A and a glycidyl ether type epoxy resin of bisphenol A. A method of reacting with bisphenol A or hydrogenated bisphenol A, gelling a mixture of a glycidyl ether type epoxy resin of hydrogenated bisphenol A and a glycidyl ether type epoxy resin of bisphenol A with a polyhydric carboxylic acid or polyhydric alcohol. There is a method in which the reaction is carried out with care, and a method in which the epoxy resin obtained by these methods is reacted with a polyhydric carboxylic acid or a polyhydric alcohol, taking care to avoid gelation. In these methods, a Lewis acid such as boron trifluoride is used as a catalyst when hydrogenated bisphenol A is used as a reaction component, and a basic compound is used in other cases. The carboxyl group-containing polyester resin refers to one having a large number of carboxyl groups. It may have a linear structure or a branched structure, but it has a branched structure because it contains a large number of carboxyl groups, especially a branched structure per molecule.
Those with a branched structure having 2.5 or more carboxyl groups are preferred. Regarding acid value, it is usually 20~
150KOHmg/g (unit omitted), more preferably 30-100, and ring and ball softening point 70-150
°C is appropriate. Any known method can be used to produce such polyester resins. Examples of acid raw materials that can be used include terephthalic acid, isophthalic acid, phthalic acid, methylphthalic acid, trimellitic acid, pyromellitic acid, adipic acid, sebacic acid,
Examples include succinic acid, maleic acid, fumaric acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, hexahydrophthalic acid, and reactive derivatives thereof. Examples of alcohol raw materials include ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-
Hexanediol, diethylene glycol, dipropylene glycol, 1,4-cyclohexanedimethanol, neopentyl glycol, isopentyl glycol, bishydroxyethyl terephthalate, hydrogenated bisphenol A, alkylene oxide adduct of hydrogenated bisphenol AA, trimethylolethane , trimethylolpropane, glycerin, pentaerythritol, 2,2,4-trimethylpentane-1,3-diol, etc.
Monoepoxy compounds can also be used as glycols. In order to obtain particularly favorable results, at least one aromatic polyhydric carboxylic acid should be used out of all the acid raw materials used.
70 mol%, and at least aliphatic polyhydric alcohol with 4 or more carbon atoms out of all alcohol raw materials used.
It is preferable to use 40 mol% of the polyhydric alcohol having a cyclohexane ring and 3 to 30 mol% of the polyhydric alcohol having a cyclohexane ring. The composition of the present invention is composed of the above-mentioned epoxy resin and polyester resin, and the blending ratio thereof is such that the equivalent ratio of oxirane group to carboxyl group is 0.5 to 2.0, preferably 0.6 to 1.5. is preferred. Such a composition has good curability and is cured at a temperature of 150°C or higher, preferably 160 to 230°C. However, in order to lower the heating temperature or shorten the heating time, a tertiary amine may be added as necessary. , imidazole derivatives, and carboxylic acid metal salt compounds can be added. In particular, the use of imidazole derivatives is very advantageous because pinholes can be suppressed even when coated thickly. Further, a blocked polyisocyanate compound can also be used as a curing agent in the composition. In order to prepare a powder coating material, a suitable method is to blend the composition of the present invention with a fluidity regulator, pigments and other fillers, additives, etc., melt-knead the composition, solidify it, and then finely pulverize it. The present invention will be explained below based on examples. Parts in the text indicate parts by weight. Synthesis of Epoxy Resin 1 From 900 parts of a hydrogenated bisphenol A diglycidyl ether type epoxy resin with an epoxy equivalent of 480 and 100 parts of Epiclon 850 (manufactured by Dainippon Ink Chemical Industries, bisphenol A diglycidyl ether type epoxy resin with an epoxy equivalent of 180). The mixture was diluted with bisphenol in the presence of 2 parts of N-methylmorpholine.
Reacted with A158 part at 120℃ for 3 hours, softening point 93
Epoxy resin 1 was obtained, having an epoxy equivalent of 1150° and a molar ratio of bisphenol A core to hydrogenated bisphenol A core of 26/74. Synthesis of Epoxy Resin 2 950 parts of the hydrogenated bisphenol type epoxy resin used in the preparation of Epoxy Resin 1 and Epicol
A mixture of 50 parts of N-850 was mixed with 100 parts of bisphenol A in the presence of 2 parts of N-methylmorpholine at 120°C.
After reacting for 2 hours, 37 parts of adipic acid was added and reacted for 2 hours at the same temperature, resulting in a softening point of 88°, epoxy equivalent of 1350, and a molar ratio of bisphenol A nucleus and hydrogenated bisphenol A nucleus of 16/84. Epoxy resin 2 was obtained. Synthesis of Polyester Resin 1 A mixture consisting of 1046 parts of neopentyl glycol, 119 parts of 1,4-cyclohexanedimethanol, 1000 parts of dimethyl terephthalate and 11 parts of zinc acetate was heated to 150°C while removing the methanol produced from the reaction system. After reacting at 210℃ for 2 hours, 47 parts of trimethylolpropane, terephthalic acid
800 parts and 1.5 parts of diptyltin oxide were added and reacted at the same temperature for 4 hours and at 240°C for 10 hours.
The temperature of the reaction mixture was then lowered to 180°C, 313 parts of trimellitic anhydride was added, and the mixture was reacted at the same temperature for 3 hours to obtain polyester resin 1 having a softening point of 125° and an acid value of 62. Synthesis of polyester resin 2 1777 parts of neopentyl glycol, 310 parts of 1,4-cyclohexanedimethanol, 70 parts of 1,6-hexanediol, 1830 parts of dimethyl terephthalate
A reaction was carried out in the same manner as in the synthesis of polyester resin 1 from 1,407 parts of terephthalic acid, and 316 parts of trimellitic anhydride to obtain a softening point of 120°C and an acid value of 42.
Polyester resin 2 was obtained. Example After dry-blending each component (the amount used is in parts) in the ratio shown in Table 1, it was melt-kneaded using a Co-kneader PR-46 manufactured by Buss, and then finely ground and passed through a 150-mesh wire mesh to produce a white powder. A powder coating was obtained. This paint was applied to a zinc phosphate treated steel plate by electrostatic spraying and baked at 180°C for 15 minutes. Film thickness approx.
The coating performance at 60 microns was as shown in Table 1. Comparative Example 1 In Example 1, the same amount of Epiclon 4050 (manufactured by Dainippon Ink Chemical Industry Co., Ltd.,
A powder coating and a cured coating film were obtained in the same manner using a glycidyl ether type epoxy resin of bisphenol A having an epoxy equivalent of 950. Table 1 shows the performance of the powder coatings and cured coatings obtained in each of the above examples.
【表】
〓〓〓〓〓
[Table] 〓〓〓〓〓
【表】
〓〓〓〓〓
[Table] 〓〓〓〓〓
Claims (1)
フエノールA核とをモル比5/95〜40/60の比率で
含有するエポキシ樹脂とカルボキシル基含有ポリ
エステル樹脂とから成る粉体塗料用樹脂組成物。1. A resin composition for powder coatings comprising an epoxy resin containing a bisphenol A nucleus and a hydrogenated bisphenol A nucleus in the same molecule at a molar ratio of 5/95 to 40/60 and a carboxyl group-containing polyester resin. .
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1605877A JPS53102331A (en) | 1977-02-18 | 1977-02-18 | Resin composition for powder coating |
DE19782806651 DE2806651C2 (en) | 1977-02-18 | 1978-02-16 | Powder paint composed of an epoxy compound, a carboxyl-containing polyester resin and usual additives |
NL7801855A NL174652C (en) | 1977-02-18 | 1978-02-17 | RESIN MATERIAL FOR POWDER PAINTS. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1605877A JPS53102331A (en) | 1977-02-18 | 1977-02-18 | Resin composition for powder coating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53102331A JPS53102331A (en) | 1978-09-06 |
JPS6135233B2 true JPS6135233B2 (en) | 1986-08-12 |
Family
ID=11905964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1605877A Granted JPS53102331A (en) | 1977-02-18 | 1977-02-18 | Resin composition for powder coating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53102331A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504131A (en) * | 1973-05-17 | 1975-01-17 | ||
JPS50153097A (en) * | 1973-06-04 | 1975-12-09 |
-
1977
- 1977-02-18 JP JP1605877A patent/JPS53102331A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504131A (en) * | 1973-05-17 | 1975-01-17 | ||
JPS50153097A (en) * | 1973-06-04 | 1975-12-09 |
Also Published As
Publication number | Publication date |
---|---|
JPS53102331A (en) | 1978-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5021537A (en) | Polyacetoacetate-containing epoxy resin compositions | |
JPH04214771A (en) | Resin composition for powder coating | |
US4130601A (en) | Resin composition for powder paint | |
US3989679A (en) | Epoxy resin powder composition | |
US5777045A (en) | Polygylcidyl ester-based power coatings | |
EP0751970B1 (en) | Outdoor durable powder coating compositions | |
WO2020089132A1 (en) | Low bake powder coating resins | |
JPS6135233B2 (en) | ||
JP3385487B2 (en) | Resin composition for powder coating | |
CA1317399C (en) | Powdered lacquer, its manufacture and use | |
JPS62260871A (en) | Resin composition for powder coating | |
JP3259150B2 (en) | Resin composition for powder coating | |
JPS6119664B2 (en) | ||
JPS6135232B2 (en) | ||
US5616658A (en) | Process for the production of matt epoxy resin and hybrid powder coatings | |
JPH0329093B2 (en) | ||
JPS5825118B2 (en) | Fun Taiyo Yoji Yushisoseibutsu | |
KR940010345B1 (en) | Epoxy resin modified with polyester and painting composition containing with it | |
JP2662247B2 (en) | Low temperature curing type resin composition for powder coating | |
JPS5829342B2 (en) | Resin composition for powder coating | |
JPS5835546B2 (en) | Polyester resin composition for powder coatings | |
JP3847849B2 (en) | Polyester resin composition for powder coating and powder coating | |
JPS6134475B2 (en) | ||
JPH0120192B2 (en) | ||
JPH0115541B2 (en) |