JPS6133816A - Mobile jig for cutting lead wire of electron circuit package - Google Patents

Mobile jig for cutting lead wire of electron circuit package

Info

Publication number
JPS6133816A
JPS6133816A JP15295284A JP15295284A JPS6133816A JP S6133816 A JPS6133816 A JP S6133816A JP 15295284 A JP15295284 A JP 15295284A JP 15295284 A JP15295284 A JP 15295284A JP S6133816 A JPS6133816 A JP S6133816A
Authority
JP
Japan
Prior art keywords
substrate
printed circuit
circuit board
lead wire
circuit package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15295284A
Other languages
Japanese (ja)
Inventor
Shuzo Ushimi
牛見 修三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15295284A priority Critical patent/JPS6133816A/en
Publication of JPS6133816A publication Critical patent/JPS6133816A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0473Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To cut a lead wire at uniform length by stable supporting a substrate through a process of engagingly locking/pushing the circumferential edge of the substrate by means of an engagingly locking member supported movably in plane direction on a frame body transported to the cutting tool side, and bringing the retaining tool for the frame body in contact with the surface of substrate. CONSTITUTION:A printed substrate 1 is engagingly locked and supported by locking parts 7a, 5a of a frame member and held by pushing force of a leaf spring 9. In addition, its circumferential edge is supported by a guide pin 15, while the surface of substrate 1 is maintained flat due to contact force of a retaining tool 17 restricting any bend liable to occur on the substrate 1. Both pin 15 and retaining tool 7 are vertically movable and also shiftable on a horizontal plane, accordingly any bend on the substrate can be almost perfectly prevented. Therefore, by moving the frame body toward cutting edge 3 side under this condition, a lead wire 2a can be cut out uniformly.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は電子回路パッケージのリード線の余分長を切断
するために該パッケージを切断刃具側に搬送する搬送治
具に係シ、特に多種類の電子回路パッケージに適用可能
な電子回路パッケージのリード線切断用搬送治具に関す
るものである。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a conveying jig for conveying an electronic circuit package to a cutting tool side in order to cut the excess length of the lead wire of the package, and particularly relates to a conveying jig that conveys the package to a cutting tool side in order to cut the excess length of the lead wire of the electronic circuit package. The present invention relates to a transport jig for cutting lead wires of electronic circuit packages that can be applied to electronic circuit packages.

〔発明の背景〕[Background of the invention]

第3図に示す如く、電子回路パッケージはプリント基板
1と、これに搭載される各種の電子部品2とから形成さ
れる。電子部品2のリード線2αは多少長目に形成され
、はんだ付は後に不要なリード線が切断刃具3により切
断される。
As shown in FIG. 3, the electronic circuit package is formed from a printed circuit board 1 and various electronic components 2 mounted thereon. The lead wire 2α of the electronic component 2 is formed to be somewhat long, and the unnecessary lead wire is cut off by the cutting tool 3 after soldering.

電子回路パッケージを切断刃具3側に搬送する治具とし
ては各種のものがあるが、従来技術では第4図に示すも
のが普通採用されているが、プリント基板1のそQが発
生することにょシリード線2αの不整枦生ずる欠点があ
ると共に、プリント基板1の形状、寸法の変化に円滑に
対応できない欠点が有った。
There are various types of jigs for conveying the electronic circuit package to the cutting tool 3 side, but in the conventional technology, the one shown in FIG. There is a drawback that the series lead wire 2α is irregularly formed, and there is also a drawback that changes in the shape and dimensions of the printed circuit board 1 cannot be smoothly accommodated.

すなわち、第4図に示す如く、プリント基板1はその対
峙する周縁部を搬送手段のプーリ4に挾持され、水平に
支持される。プーリ4を回転することにより、その摩擦
力によシブリント基板1は水平移動し切断刃具3側に搬
送され、リード線2aが切断される。上記摩擦力を負荷
するためにはプーリ4をプリント基板1側に押圧する必
要があ夛、このために第5図に示す如くプリント基板1
にそりが生ずる。このためリード線2αの切断長にバラ
ツキが生じ、製品品質を低下させる。一方、プリント基
板10幅寸法が変化した場合には第4図に示す如くプー
リ4を位置Aから位置Bに移動して対応するが、上記の
そりが更に大きくなる欠点が生ずる。更に第6図に示す
如くプリント基板1の周縁がプーリ4によシ均一に保持
される場合はよいが、第7図の如くプリント基板1の形
状によってはプーリ4が不均等に周縁に係合する場合が
あり、上記そりが更に助長され、プリント基板1も円滑
に搬送されない。これを防止するにはプーリ4の位置を
その都度変化させねばならず、段取時間が長くなると共
に、場合により調整不能となる欠点が生じる。
That is, as shown in FIG. 4, the printed circuit board 1 is supported horizontally by having its opposing peripheral edges clamped by pulleys 4 of the conveying means. By rotating the pulley 4, the shiblint board 1 is horizontally moved by the frictional force and is conveyed to the cutting tool 3 side, and the lead wire 2a is cut. In order to apply the above-mentioned frictional force, it is necessary to press the pulley 4 against the printed circuit board 1 side.For this purpose, as shown in FIG.
Warpage occurs. For this reason, the cutting length of the lead wire 2α varies, which deteriorates the product quality. On the other hand, when the width dimension of the printed circuit board 10 changes, the pulley 4 is moved from position A to position B as shown in FIG. Furthermore, as shown in FIG. 6, it is good if the peripheral edge of the printed circuit board 1 is held uniformly by the pulleys 4, but as shown in FIG. 7, depending on the shape of the printed circuit board 1, the pulley 4 may engage the peripheral edge unevenly. In some cases, the above-mentioned warpage is further exacerbated, and the printed circuit board 1 is not transported smoothly. In order to prevent this, the position of the pulley 4 must be changed each time, resulting in a disadvantage that setup time becomes longer and adjustment becomes impossible in some cases.

〔発明の目的〕[Purpose of the invention]

本発明は上記欠点を解決するもので、その目的はプリン
ト基板の形状、寸法に係りなく、均一のリード長切断が
確保されると共に、段取時間を低減し得る電子回路パッ
ケージのリード線切断用搬送治具を提供することにある
The present invention solves the above-mentioned drawbacks, and its purpose is to cut lead wires of electronic circuit packages, which can ensure uniform lead length cutting regardless of the shape and dimensions of the printed circuit board, and reduce setup time. The purpose of this invention is to provide a transport jig.

〔発明の概要〕[Summary of the invention]

本発明は上記目的を達成するために、上記プーリの如き
搬送手段に支持され切断刃具側に搬送されるフレーム本
体を設け、該フレームに平面方向に移動可能に係止部材
を支持し該係止部材でプリント基板の周縁を係止してこ
れを水平に支持すると共に、該係止部材の少なくとも1
つにその係上部を上記プリント基板側に押圧する付勢手
段全保合せしめ、該プリント基板を安定把持し、かつ上
記フレーム本体に押え具を水平面方向に位置調整可能に
支持し、紋押え具の一端部を上記プリント基板の表面に
当接するように形成される電子回路パッケージのリード
線切断用搬送治Kを特徴としたものである。
In order to achieve the above object, the present invention provides a frame body that is supported by a conveying means such as the pulley and conveyed to the cutting tool side, and a locking member is supported on the frame so as to be movable in a plane direction, and the locking member is The member locks the peripheral edge of the printed circuit board to support it horizontally, and at least one of the locking members
and a biasing means for pressing the engaging part toward the printed circuit board, stably grips the printed circuit board, and supports a presser on the frame body so that its position can be adjusted in a horizontal direction, The present invention is characterized by a transport jig K for cutting lead wires of an electronic circuit package, which is formed so that one end thereof is in contact with the surface of the printed circuit board.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を図面に基づき説明する。 Embodiments of the present invention will be described below based on the drawings.

捷ず、本実施例の概要を第2図によシ説明する。Without further ado, the outline of this embodiment will be explained with reference to FIG.

プリント基板1を水平支持する係止部材は係止具5とガ
イドビン15七から構成され、その係止部5 (t 、
 15αはプリント基板10周縁に係止し、これを支持
する。フレーム本体はフレーム部材6.7と、この間に
架設されるガイド軸20と、ガイド軸12に摺動自在に
支持されるベース12等とから形成される。係止具5お
よびカイトビン15はフレーム本体に水平面方向に沿っ
て移動可能に支持される。甘たフレーム本体はプーリ4
に係合し、これにより図示しない切断刃具側に搬送され
る。係止具5には付勢手段である板バネ9が設けられ、
係止部5aをプリント基板1側に押圧している。1だフ
レーム本体には押え具17が水平方向に位置調整可能に
支持され、その先端部はプリント基板1の表面に当接し
ている。
The locking member that horizontally supports the printed circuit board 1 is composed of a locking tool 5 and a guide bin 157, and the locking portion 5 (t,
15α engages with and supports the peripheral edge of the printed circuit board 10. The frame body is formed from a frame member 6.7, a guide shaft 20 installed between the frame members 6.7, a base 12 slidably supported by the guide shaft 12, and the like. The locking tool 5 and the kite bin 15 are supported by the frame body so as to be movable along the horizontal direction. The sweet frame body is pulley 4
is engaged with the blade, thereby being conveyed to the cutting tool side (not shown). The locking tool 5 is provided with a leaf spring 9 as a biasing means,
The locking portion 5a is pressed against the printed circuit board 1 side. A presser 17 is supported on the frame main body so that its position can be adjusted in the horizontal direction, and its tip is in contact with the surface of the printed circuit board 1.

以上の構成により各種類のプリント基板1がそりを生ず
ることカ〈切断刃具側に搬送吉れる。
The above configuration prevents the various types of printed circuit boards 1 from being warped while being transported to the cutting tool side.

次に、本実施例を更に詳細に説明する。Next, this embodiment will be explained in more detail.

第1図に示す如く、係止部材の係止具5はプリント基板
1の周縁に係止する係止部5αを形成するフレーム部材
8と、ガイド軸20に摺動自在に支持されるホルダー1
1と、ホルダ−11トフレーム部材8間に架設される板
ばね9とから形成される。カイトビン15は上記の如く
その先端部にはプリント基板1の周縁を支える係止部1
5αを形成し、上端部はアーム14の一端側に着脱可能
に支持される。詳しくには、ガイドビン15はアーム1
4の一端側に形成される溝部18に挿入され、抜は止め
用板16により着脱可能に保持される。アーム14の他
端側には長溝19が形成され、ねじ13によりベース1
2に水平方向に移動可能に固定される。なおガイドピン
15は図示の如く搬送方向に対峙し2個配置される。
As shown in FIG. 1, the locking member 5 includes a frame member 8 forming a locking portion 5α that locks on the peripheral edge of the printed circuit board 1, and a holder 1 that is slidably supported on a guide shaft 20.
1 and a leaf spring 9 installed between the holder 11 and the frame member 8. As described above, the kite bin 15 has a locking portion 1 at its tip that supports the periphery of the printed circuit board 1.
5α, and the upper end portion is detachably supported on one end side of the arm 14. In detail, the guide bin 15 is connected to the arm 1.
It is inserted into a groove 18 formed on one end side of 4, and is detachably held by a removal prevention plate 16. A long groove 19 is formed on the other end of the arm 14, and a screw 13 connects the base 1.
2 so as to be movable in the horizontal direction. Note that two guide pins 15 are arranged facing each other in the conveyance direction as shown in the figure.

フレーム本体のフレーム部材7は係止具5と対峙して配
設され、その下端側には係止部5αと同一形状の係止部
7αが形成される。またフレーム部材6はフレーム部材
7と相対向して設けられ、上記した如く両者はプーリ4
により挾持される。プリント基板1は係止部5α、7α
The frame member 7 of the frame body is disposed facing the locking tool 5, and a locking portion 7α having the same shape as the locking portion 5α is formed on the lower end side thereof. Further, the frame member 6 is provided opposite to the frame member 7, and as described above, both are connected to the pulley 4.
held by. The printed circuit board 1 has locking parts 5α and 7α
.

15aにその周縁を係止され、水平に保持される。15a locks its periphery and holds it horizontally.

押え具17は上記の如くその先端部をプリント基板1の
表面に当接すると共に、上端部はアーム21の一端側に
抜は止め用板16により着脱可能に保持される。アーム
21の他端側には長溝22が形成され、これに挿設され
るねじ23によυペース12に水平方向に調整可能に固
定される。なおガイドピン15および押え具17とも、
段付部15h。
The presser 17 has its tip abutted against the surface of the printed circuit board 1 as described above, and its upper end is removably held at one end of the arm 21 by the retaining plate 16. A long groove 22 is formed on the other end of the arm 21, and the arm 21 is fixed to the υ pace 12 so as to be adjustable in the horizontal direction by a screw 23 inserted therein. Note that both the guide pin 15 and the presser 17
Stepped part 15h.

17bと抜は止め用板16の係正により、上下方向に調
整可能に取付は固定される。
17b and the removal stopper plate 16, the installation is fixed so as to be adjustable in the vertical direction.

次に本実施例の作用全説明する。Next, the entire operation of this embodiment will be explained.

上記の如く、プリント基板1はフレーム部材7.8の係
止部7α、5aに係止して支持され、板ばね9にこり抑
圧されて把持される。板ばね9によシ、プリント基板1
にそりが生じようとするがガイドピン15にニジ周縁が
支持されると共に、押え具17の当接力にょシ抑制され
、プリント基板1の表面は平坦に仇持される。カイトピ
ン15および押え具17とも上記の如く上下動可能で、
かつ水平面上に移動可能のため、その調整によシ上記そ
りはほぼ完全に防止される。この状態でフレーム本体を
切断刃具側に移動することによシ、リード線は均一に切
断される。
As described above, the printed circuit board 1 is supported by being engaged with the engagement portions 7α and 5a of the frame member 7.8, and is held firmly and suppressed by the leaf spring 9. Plate spring 9, printed circuit board 1
Although warping tends to occur, the peripheral edge of the printed circuit board 1 is supported by the guide pins 15, and is suppressed by the contact force of the holding tool 17, so that the surface of the printed circuit board 1 is held flat. Both the kite pin 15 and the presser 17 are movable up and down as described above,
In addition, since it is movable on a horizontal plane, the above-mentioned warping can be almost completely prevented by adjusting it. By moving the frame body toward the cutting tool in this state, the lead wires are uniformly cut.

次に、プリント基板1の幅寸法が変化した場合には、係
止具5をガイド軸20に沿って移動調整することによシ
容易に対応することができる。
Next, when the width dimension of the printed circuit board 1 changes, this can be easily handled by adjusting the movement of the locking tool 5 along the guide shaft 20.

捷たプリント基板1の形状が変化しても、プーリ4とフ
レーム本体との係合は変化せず、円滑に移動できると共
に、ガイドビン15オよび押え具17の位置を水平方向
に調整することによりプリント基板1は安定支持され、
かつ上記そりも防止される。従って、各種の形状、寸法
のプリント基板1に対し迅速に対応でき、段取り時間を
大幅に低減することができる。
Even if the shape of the twisted printed circuit board 1 changes, the engagement between the pulley 4 and the frame body does not change, allowing smooth movement and adjusting the positions of the guide pin 15 and the holding tool 17 in the horizontal direction. The printed circuit board 1 is stably supported by
Moreover, the warpage described above is also prevented. Therefore, it is possible to quickly respond to printed circuit boards 1 of various shapes and sizes, and the setup time can be significantly reduced.

本実施例において、フレーム8の付勢手段は上記板ばね
9に限定するものでなく、ガイドピン15、押え具17
の支持機構および調整機構も上記に限定するものでない
。またガイドピン15、押え具17は2個に限らず、付
勢手段も係止具5のみに係合するものでなくともよい。
In this embodiment, the biasing means for the frame 8 is not limited to the leaf spring 9, but also the guide pin 15 and the presser 17.
The support mechanism and adjustment mechanism are not limited to those described above. Further, the number of guide pins 15 and presser tools 17 is not limited to two, and the biasing means does not have to engage only with the locking tool 5.

〔発明の効果〕〔Effect of the invention〕

以上の説明によって明らかな如く、本発明によればプリ
ント基板の形状、寸法に係りなくプリント基板が水平に
保持されて搬送され、均一のリード長の切断が確保され
ると共に、形状等変更時の段取り時間を低減し得る効果
が上げられる。
As is clear from the above description, according to the present invention, the printed circuit board is held horizontally and transported regardless of its shape and dimensions, ensuring cutting of uniform lead length, and when changing the shape etc. The effect of reducing setup time can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明一実施例の斜視図、第2図は実施例の正
面図、第6図は従来技術の側面図、第4図、第5図は従
来技術の正面図、第6図。 第7図は従来技術の平面図である。 1・・・プリント基板   2・・・電子部品2α・・
・リード線    3・・・切断刃具4・・・プーリ 
     5・・・係止具6.7.8・・・7L/−ム
部  5α、7α、15α・・・係止部9・・・板ばね
      11・・・ホルダー12・・・ペース  
    13.23・・・ねじ14.21・・・アーム
    15・・・ガイドピン15α、17α・・・段
付部   16・・・抜は止め用板17・・・押え具 
     18・・・溝部19.22・・・長溝
Figure 1 is a perspective view of an embodiment of the present invention, Figure 2 is a front view of the embodiment, Figure 6 is a side view of the prior art, Figures 4 and 5 are a front view of the prior art, and Figure 6 is a front view of the prior art. . FIG. 7 is a plan view of the prior art. 1... Printed circuit board 2... Electronic components 2α...
・Lead wire 3... Cutting tool 4... Pulley
5...Locking tool 6.7.8...7L/-m part 5α, 7α, 15α...Locking part 9...Plate spring 11...Holder 12...Pace
13.23...Screw 14.21...Arm 15...Guide pins 15α, 17α...Stepped portion 16...Removal stop plate 17...Press tool
18...Groove 19.22...Long groove

Claims (1)

【特許請求の範囲】[Claims] 電子回路パッケージを水平支持し、搬送手段によりこれ
を切断刃具側に搬送して不要のリード線を切断するため
の搬送治具において、上記電子回路パッケージのプリン
ト基板の周縁に係止しこれを水平支持する係止部材と、
該係止部材を上記プリント基板の水平面方向に移動可能
に支持すると共に上記搬送手段に係合して上記搬送方向
に移動するフレーム本体と、上記係止部材の少なくとも
1つに係合し該係止部材の係止部を上記プリント基板側
に押圧する付勢手段と、上記フレームに水平方向に沿っ
て位置調整可能に支持されると共にその一端側を上記プ
リント基板の表面に当接して配設される押え具とを設け
ることを特徴とする電子回路パッケージのリード線切断
用搬送治具。
In a transport jig for horizontally supporting an electronic circuit package and transporting it to the cutting tool side by a transport means to cut unnecessary lead wires, the electronic circuit package is latched onto the periphery of the printed circuit board of the electronic circuit package and held horizontally. A supporting locking member;
a frame body that supports the locking member so as to be movable in the horizontal direction of the printed circuit board and that engages with the transport means and moves in the transport direction; a biasing means for pressing the locking portion of the locking member toward the printed circuit board; and a biasing means that is supported by the frame so that its position can be adjusted in the horizontal direction, and is disposed with one end thereof in contact with the surface of the printed circuit board. A conveyance jig for cutting lead wires of an electronic circuit package, characterized in that it is provided with a holding tool for cutting lead wires of an electronic circuit package.
JP15295284A 1984-07-25 1984-07-25 Mobile jig for cutting lead wire of electron circuit package Pending JPS6133816A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15295284A JPS6133816A (en) 1984-07-25 1984-07-25 Mobile jig for cutting lead wire of electron circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15295284A JPS6133816A (en) 1984-07-25 1984-07-25 Mobile jig for cutting lead wire of electron circuit package

Publications (1)

Publication Number Publication Date
JPS6133816A true JPS6133816A (en) 1986-02-17

Family

ID=15551744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15295284A Pending JPS6133816A (en) 1984-07-25 1984-07-25 Mobile jig for cutting lead wire of electron circuit package

Country Status (1)

Country Link
JP (1) JPS6133816A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106392176A (en) * 2016-11-30 2017-02-15 无锡市创恒机械有限公司 Circuit board pin shearing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106392176A (en) * 2016-11-30 2017-02-15 无锡市创恒机械有限公司 Circuit board pin shearing device

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