JPS6133436U - Lead frame conveyance device - Google Patents

Lead frame conveyance device

Info

Publication number
JPS6133436U
JPS6133436U JP11732084U JP11732084U JPS6133436U JP S6133436 U JPS6133436 U JP S6133436U JP 11732084 U JP11732084 U JP 11732084U JP 11732084 U JP11732084 U JP 11732084U JP S6133436 U JPS6133436 U JP S6133436U
Authority
JP
Japan
Prior art keywords
lead frame
conveyance device
plate
frame conveyance
frame transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11732084U
Other languages
Japanese (ja)
Other versions
JPH054277Y2 (en
Inventor
隆文 木塚
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP11732084U priority Critical patent/JPS6133436U/en
Publication of JPS6133436U publication Critical patent/JPS6133436U/en
Application granted granted Critical
Publication of JPH054277Y2 publication Critical patent/JPH054277Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reciprocating Conveyors (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２図は側面
図、第３図は本考案で使用したプレートを示す正面図で
ある。 Ｉ， ｎ， ＩＩＩ・・・ヒータブロックステージ、
４・・・リードフレーム搬送用プレート、５・・・リー
ドフレーム、６・・・プレートの保持板、７・・・プレ
ートの凹部。FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is a front view showing a plate used in the present invention. I, n, III... heater block stage,
4... Lead frame conveyance plate, 5... Lead frame, 6... Plate holding plate, 7... Recessed portion of plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 温度の異なるヒーターブロックステージに半導体デバイ
スのν−ドフレームを横送りにて搬送するリードフレー
ム搬送機構において、前記ヒーターブロックステージに
沿って、リーデフレーム搬送用プレートを移動可能に設
置し、該プレートに、リードフレームを嵌合、保持させ
る凹部を設けたことを特徴どするリードフレーム搬送機
構。In a lead frame transport mechanism that transversely transports a ν-dead frame of a semiconductor device to a heater block stage having a different temperature, a lead frame transport plate is movably installed along the heater block stage, and a lead frame transport plate is installed on the plate. , a lead frame transport mechanism characterized by having a recess into which a lead frame is fitted and held.
JP11732084U 1984-07-31 1984-07-31 Lead frame conveyance device Granted JPS6133436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11732084U JPS6133436U (en) 1984-07-31 1984-07-31 Lead frame conveyance device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11732084U JPS6133436U (en) 1984-07-31 1984-07-31 Lead frame conveyance device

Publications (2)

Publication Number Publication Date
JPS6133436U true JPS6133436U (en) 1986-02-28
JPH054277Y2 JPH054277Y2 (en) 1993-02-02

Family

ID=30676234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11732084U Granted JPS6133436U (en) 1984-07-31 1984-07-31 Lead frame conveyance device

Country Status (1)

Country Link
JP (1) JPS6133436U (en)

Also Published As

Publication number Publication date
JPH054277Y2 (en) 1993-02-02

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