JPS613096B2 - - Google Patents

Info

Publication number
JPS613096B2
JPS613096B2 JP52130533A JP13053377A JPS613096B2 JP S613096 B2 JPS613096 B2 JP S613096B2 JP 52130533 A JP52130533 A JP 52130533A JP 13053377 A JP13053377 A JP 13053377A JP S613096 B2 JPS613096 B2 JP S613096B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52130533A
Other languages
Japanese (ja)
Other versions
JPS5462782A (en
Inventor
Morihiro Kada
Akizo Minamide
Koichi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13053377A priority Critical patent/JPS5462782A/ja
Publication of JPS5462782A publication Critical patent/JPS5462782A/ja
Publication of JPS613096B2 publication Critical patent/JPS613096B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13053377A 1977-10-27 1977-10-27 Package method of semiconductor device Granted JPS5462782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13053377A JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13053377A JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5462782A JPS5462782A (en) 1979-05-21
JPS613096B2 true JPS613096B2 (US06368395-20020409-C00050.png) 1986-01-30

Family

ID=15036562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13053377A Granted JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5462782A (US06368395-20020409-C00050.png)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182435U (ja) * 1982-05-28 1983-12-05 セイコーエプソン株式会社 半導体素子の外付け端子構造
JPS5914349U (ja) * 1982-07-19 1984-01-28 パイオニア株式会社 フラツトパツケ−ジic
JPH034043Y2 (US06368395-20020409-C00050.png) * 1984-10-23 1991-02-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5292476A (en) * 1976-01-30 1977-08-03 Texas Instruments Japan Integrated circuit package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5292476A (en) * 1976-01-30 1977-08-03 Texas Instruments Japan Integrated circuit package

Also Published As

Publication number Publication date
JPS5462782A (en) 1979-05-21

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