JPS6130085Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a heat dissipation device using a heat panel.

In general, heating devices in facility-type heat radiating devices can be broadly divided into heating devices that use hot water and heating devices that use electric heat.As examples of panel-shaped heating devices, conventional floor heating devices include the following. That is, as shown in FIG. 1, electric floor heating was performed by installing a plurality of panels 7 in a dining room or living room.
However, since the entire surface of the panel 7 is a current-carrying part, there is a risk of electrical leakage, and the wiring work involves connecting each panel 7 separately, which poses problems in terms of construction.

In the case of hot water floor heating, a plurality of panels 9 with water pipes 8 embedded therein are used, as shown in FIG. However, the entire surface of panel 9 is covered with water pipe 8.
There is a high risk of water leakage because the water pipes 8 are buried, and piping work to connect the water pipes 8 of each panel 9 must be done for each panel 9, which poses a problem in terms of construction. However, since the water distribution pipe 8 is long and winding, the pressure loss becomes large and a high-output pipe with a high head is required, which also poses a problem in terms of price.

The present invention has been proposed in view of the above-mentioned points, and uses multiple heat panels connected as a heating panel by providing a heat source to only one heat panel, which saves labor in construction work such as wiring and piping, and also saves water. The purpose of the present invention is to provide a heat dissipation device that aims to improve the efficiency of maintenance by reducing leakage, electric leakage, etc., and to perform safe heating by reducing the number of heat sources used as a heating device, and to efficiently dissipate heat.

An embodiment of the present invention will be described in detail below with reference to the drawings.
In the figure, 6 is a heat pipe. As shown in Figure 3, this heat pipe 6 is pipe-shaped.The inside is evacuated and a heat medium 2 (referred to as working fluid) such as water, Freon, or ammonia is put in, and one end is closed. When heated, it moves as a vapor stream as shown by the arrow in the figure, and at the other end, what used to be vapor is condensed and the latent heat is transferred to the outside. . The condensed heating medium 2 becomes a liquid stream and travels through a portion called a wick 10 on the peripheral wall, returning to one end. The heat pipe 6 is characterized by a high heat transfer rate, and the temperature of each part of the heat pipe 6 is uniform. 3 is a rectangular panel-shaped header-type heat panel on both sides, and a header 4 having the structure of the heat pipe 6, which is a metal panel-shaped container, and a steam flow path 11 are embedded in this heat panel 3. There is. That is, heat panel 3
It consists of headers 4, 4 which have a substantially semicircular cross section and store a heat medium 2 at both ends of the header, and a plurality of pipe-shaped steam passages 11 which connect these two headers 4, 4, as shown in FIG. One header 4 is disposed lower than the other header 4, and the steam passage 11 is inclined. Furthermore, a heat pipe 6 as a heat transfer tube for transferring heat to another heat panel 3 is provided in the header 4, and a heat insulating material 12 is formed over the entire lower part of the heat panel 3.
Similar to the function of the heat pipe 6 described above, these headers 4 and vapor flow paths 11 are heated by heating the heat medium 2 in the header 4.
becomes steam and flows through the steam flow path 11 to another header 4, and the header 4 transfers heat to the outside by latent heat due to condensation. Figures 6 and 7 show a heat panel 3' with a header on one side, and as shown in the figure, the header 4 is buried only in one side of the heat panel 3', and the steam flow path 11 is formed in a striped manner on the other side. are doing. In addition, a heat pipe 6 is provided in the header 4, and a heat medium 2 is placed in the header 4 to form a vapor flow path 1.
1 is a heating medium 2 which is inclined and condenses by emitting latent heat.
is designed to easily flow to header 4. The upper surface of the heat panel 3' includes the header 4 and the steam flow path 11.
heat is transferred evenly.

Thus, as shown in FIG. 8, a plurality of two types of heat panels 3, 3' are laid down. Both side header type heat panels 3 are arranged in parallel, and one side header type heat panel 3' is laid at the side end. A sheathed heater 13 is inserted as a heat source into the header 4 of the heat panel 3 at the end, and heat pipes 6 are disposed through the headers 4 of the heat panels 3 adjacent to each other in the other headers 4. As shown in the figure, the heat panels 3, 3' are connected by a heat pipe 6. The heat medium 2 heated by the sheathed heater 13 turns into steam and moves within the steam flow path 11, where the heat is transferred to the other header 4 and is radiated from the heat panel 3 itself. The heat is then transferred to the adjacent heat panel 3 by the heated heat pipe 61. Further, the heat is radiated from the heat panel 3 itself, and at the same time, the heat is transferred to the adjacent heat panel 3 through the heat pipe 62. This is repeated to radiate heat uniformly from the entire surface of the heat panels 3, 3'.

FIG. 9 shows another embodiment in which only one heat panel 3 is of the header type on both sides, and the other heat panels 3' are of the header type on one side. As shown in the figure, a plurality of heat panels 3, 3' are laid down, heat pipes 6 passing through the headers 4 arranged in parallel are arranged, and a sheathed heater 13 is connected to the other header 4 of the edge heat panel 3. has been established. The heat medium 2 heated by the sheathed heater 13 turns into steam, moves within the steam flow path 11, is transmitted to another header 4, and is further transferred to the header 4 of the adjacent heat panel 3' by the heat pipe 6. The heat is transferred to each heat panel 3' from its header 4 through the vapor flow path 11, and the heat is radiated from the entire surface of the heat panel 3'. Although electric heat from the sheathed heater 13 is used as the above heat source, it is of course possible to use hot water as another heat source.

As mentioned above, the present invention uses a heat pipe in which a heating medium is placed inside a metal pipe that is evacuated, and heat is transferred by the latent heat generated by the evaporation, and a heating medium that evaporates and heat is transferred by the heat from this heat pipe. A heat panel is formed by a header that is integrally formed with the heat pipe and a steam flow path through which steam from the header flows, and the headers between adjacent heat panels are penetrated by the heat pipe and thermally connected. A heat source is installed in the header of one of the heat panels laid down, and heat is generated by heating only one place on the heat panel. Heat can be dissipated uniformly from the entire surface of multiple heat panels via pipes, which simplifies wiring and piping work compared to conventional methods.This also simplifies the construction of heat panels, and further reduces the heat source. Since it is provided at only one location on one heat panel, it is possible to provide a safe and efficient heat dissipation device.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a conventional example using electric floor heating, Fig. 2 is a block diagram of the same hot water type floor heating as above, and Fig. 3 is an enlarged perspective view of an embodiment of the present invention with the heat pipe cut out. Figure 4 is a perspective view of the double header type heat panel as above, Figure 5 is a sectional view of the same as above, Figure 6 is a perspective view of the one side header type heat panel as above, and Figure 7 is a cross section of same as above. Fig. 8 is a reduced plan view showing a plurality of heat panels installed as above, and Fig. 9 is a reduced plan view showing a plurality of heat panels installed according to another embodiment of the same. is a heat panel, 4 is a header, and 6 is a heat pipe.

Claims (1)

[Scope of utility model registration request] A heating medium is placed inside a metal pipe with a vacuum inside.
A heat pipe that transfers heat by the latent heat generated by the evaporation; a header that stores a heat medium that evaporates and transfers heat due to the heat from the heat pipe; and a header that is integrally formed with the heat pipe; and a steam that allows the steam from the header to flow. A heat panel is formed with the flow path, and a plurality of heat panels are laid by passing through and thermally connecting the header between adjacent heat panels with a heat pipe, and one of the plurality of heat panels laid as described above is A heat dissipation device consisting of a heat source installed in the header of two heat panels.