JPS6129950A - Displaying method of water's going-out and coming-in - Google Patents

Abstract

PURPOSE:To secure combined state between each wafer easily by displaying not only information of its coming-in, but its going-out in case of displaying combined state between wafers. CONSTITUTION:In case the number of a symbol at a point of contact is many, the renewal of display of the symbol at a point of contact, i.e., of the symbol at an input terminal of wafers, of the other party is performed by operation of a scrawl key. Each time when the display of symbols at the point of contact is renewed, a read-out of the part corresponding to a wafer combined file, i.e., to a coming-in information file 19 is performed to display as a new symbol at a point of contact. When making the display of the symbol at a point of contact about an output terminal 101 of a wafer A, the number 101 given from the file 19 is searched, resulting in finding of 19a and 19b. Therefore, it means that BX1 are CX1 corresponding to a symbol 17 at the point of contact of the wafer A are displayed in a form that they are closed. After that, it lasts until the search of other wafer's input terminal is completed, and it can be identified that which output terminal and which input terminal are combined therewith by displaying symbol at a point of contact in closing.

Description

[Detailed Description of the Invention] [Technical Field to which the Invention Pertains] This invention relates to connection and expansion connection modes between wafers (control blocks), which are basic structural units of software of, for example, a process controller (hereinafter simply referred to as a PC). The present invention relates to a display method for displaying information on a man-machine interface device such as a keyboard display device.

[Prior Art and its Problems] FIG. 3 is a block diagram schematically showing a general program controller. In the figure, 1 is a main memory, 2 is an expanded arithmetic processing unit, 3 is a process input/output unit (PIO), and 4 is a man-machine interface device (M processing unit 2, PIO 3 and MM
I4 are connected to each other via a common path 5. In such a configuration, attempts have been made to create the software using the following procedure.

1) Understand the overall control processing content and apply it to multiple controls (
! Divide into l1 functions.

2) Allocate one control block (wafer) to each control function.

3) Create an inter-control block connection table and specify data transfer between blocks.

4) Select and describe the processing content of each control block (Ueno) by selecting the most appropriate description language for each process.

For example, a sequence table is used for relatively simple sequence control, a problem-oriented language is used for sequence control that involves many complex decisions, and a combination of function modules is used for feedback control or processing that mainly involves analog calculations.
Furthermore, we choose assembler language for very specific control processing.

Software creation is completed through these steps, and a conceptual diagram of this software creation is shown in FIG. That is, as shown in FIG. 4, input data sections (input terminals) 11a to 11d store input data to be processed in control blocks A, B, C, and D assigned to each control function, respectively. , an output data section (output terminal) 12a for storing the results of processing input data; By connecting the output terminals 11a to 11a to lid and the output terminals 12a to 12d on software in correspondence with the control processing content, the entire control processing content is realized. Then, a plurality of control blocks as shown in FIG. 4 (although four control blocks are shown in FIG. 4, it is of course not limited to this number) can be stored in one shelf. are stored to configure a process control device. In addition,
Each of the above wafers or control blocks is specifically
It is stored in the main memory 1 shown in the figure.

By the way, in the PC configured as described above, for the purpose of verifying each wafer, which is the software, it is required to display the bonding state of each wafer through a CRT display device or the like. FIG. 5 is an explanatory diagram for explaining a typical display example in such a case.

Figure 5 shows three wafers A on one screen of a CRT display device.
, B, and C symbolically, and here the input terminals 11a to llc and the output terminal 1 explained in FIG.
2a to 12c1 function description parts 14a to 14c, function description N
In addition to the word type storage units 13a to 13c, wafer code display units 15a to 15c, execution order display units 16a to 16c indicating the execution order of wafer programs, and the like are provided. Note that the output terminals are given serial numbers such as '100'' to 'IOB' according to the wafer execution order.Here, for example, output terminal 101 of wafer A is assigned to wafer B.
Assuming that the input end preload terminal X1 of wafer B is connected to the input terminal X1 of wafer C and the input terminal
1 is displayed respectively, and this relationship is the same for the other output terminals 100, 102, and 103 of wafer A.

That is, each of the input terminals of wafers B and C displays the next light output terminal number (unfinished information) indicating which wafer's output terminal is connected. Therefore, in order to know which wafer's input terminal is connected to the output terminal of the target wafer, it is necessary to artificially create a list and calculate the input terminal number connected to the target wafer's output terminal, that is, the destination information. There are five problems: not only is it complicated to have to search for the wafers, but it is also difficult to understand the bonding pattern between each wafer.

[Purpose of the invention]

This invention was made under such circumstances, and an object of the present invention is to enrich the display contents when displaying the bonding mode between each wafer, and to make it easier to understand the bonding mode between each wafer. shall be.

[Key points of the invention]

This invention displays destination information for each wafer, and more specifically, all input terminals of potential destination wafers are displayed using contact symbols, and The 7 contacts that are actually connected are displayed in a closed state.

[Embodiments of the invention]

FIG. 1 is a flowchart for explaining the present invention in detail, FIG. 2 is an explanatory diagram for explaining a display example based on FIG. 1, and FIG. 2A is a configuration diagram showing an example of a destination information file.

To begin with the conclusion, the feature of this invention is that the destination information is displayed together with the destination information, and here, as shown in FIG. , contact symbols 17a to 17d as shown in the figure representing each input terminal of all related wafers are displayed in correspondence with each other, and contact symbols 17 to be actually connected are displayed in correspondence with each other.
A to 17d are displayed in a closed form. At this time, B determines which input terminal of which wafer the plurality of contact symbols 17a to 17d correspond to.
XI-BX3. It is displayed with predetermined symbols 2 numbers, etc., such as CXI to CX3 (for example, "BXl" indicates wafer B
This indicates that the input terminal is X1. ).

If the number of contact symbols to be displayed is too large to be displayed at one time, the display of the contact symbols, that is, the input terminal symbols of the destination wafer, is updated by operating a key called a scroll key. This is the step (2) in FIG. 1, and the depression of the scroll key is also determined in the step (2). Then, every time the display of the contact symbol is updated, the portion of the wafer connection file (destination information file) 19 shown in FIG. 2A that corresponds to the destination wafer is read (see FIG. 1). Displayed as a new contact symbol.

At this time, if the contents read from the file 19 are as shown in FIG. 2A, and for example, if the contact symbol is displayed for the output terminal 101 of wafer A and 5 is displayed, rl 01J is read from the file 19 in FIG. 2A. A search is performed for the specified number (see ■ in Figure 1), and as a result, the numbers 19a and 19b in Figure 2A are found here (see ■ in Figure 1).
), and the corresponding portion BXI of the contact symbol 17b as shown in FIG. 2(a).

The CXI will be displayed in a closed form (see Figure 1 ■). Note that the operations from (1) onwards are continued until all input terminals of the destination wafer are searched (see (2) in FIG. 1). By displaying the contact symbol as closed in this manner, it becomes possible to identify at a glance which output terminal and which input terminal are connected.

In addition, although the case where the bonding state of wafers, which is the basic unit of PC software, is displayed is explained above, it can be similarly applied to the case where the terminals of general equipment or devices are connected in a predetermined manner. It doesn't even go until 5th.

〔Effect of the invention〕

According to this invention, when displaying the bonding state between wafers, not only the destination information but also the destination information is displayed, so that the bonding state between the wafers can be grasped at a glance. Therefore, there is an advantage that the effort required to find out which wafer's input terminal the output terminal of the wafer is connected to is saved.

[Brief explanation of the drawing]

FIG. 1 is a flowchart for explaining the present invention in detail, FIG. 2 is an explanatory diagram for explaining an example of a package based on FIG. 1, and FIG. 2A is a configuration diagram showing an example of a destination information file. ,
Fig. 3 is a block diagram showing the general configuration of a general process controller, Fig. 4 is a conceptual diagram for explaining the software configuration of the process controller, and Fig. 5 is a diagram of a conventional wafer bonding mode. FIG. 3 is an explanatory diagram for explaining a display example. Description of symbols 1...Main memory, 2...Arithmetic processing unit, 3...7" Process input/output unit (PLO),
4...Man-machine interface device (MMI)
), 5...Common bus, A-D...Wafer, 11a-lid...Input terminal, 12a-1
2d...Output terminal, 13a-13d...
・Function description language type storage section, 14a to 14d...
・Function description section, 15a to 15c...Wafer code display section, 16a to 16c...Execution order display section, 17a to 17d...Contact symbol display section, 1
9...Destination information file. Agent: Patent Attorney Akio NamikiRepresentative: Patent Attorney Kiyoshi Matsuzaki Figure 1, Figure 2. , (a) Figure 3 Figure 4

Claims (1)

[Claims] 1) Each input terminal of each wafer has an input/output terminal for data exchange and is combined in a predetermined manner to form a predetermined program. an information file that stores destination information indicating whether the wafers are to be combined; an arithmetic processing means that extracts the destination information from the information file and executes data transfer processing between the wafers based on the destination information; and a display means for displaying a symbol of each wafer in correspondence with a symbol of each wafer, the destination information representing which output terminal of each wafer is connected to which input terminal of which wafer is obtained from the information file. A method for displaying wafer destinations and destinations, characterized in that an extraction means is provided to extract the destination information, and the destination information is displayed together with the destination information. 2) The destination information includes contact symbols and terminal numbers corresponding to each input terminal of all wafers to be bonded,
2. The wafer destination and destination display method according to claim 1, wherein the contact symbols corresponding to the input terminals to be coupled are displayed as closed.