JPS61296987A - Laser beam machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser processing apparatus that can perform taper processing on a workpiece.

[Technical Background of the Invention and Problems Therewith] Conventionally, when a thick plate is cut by a laser processing device, the laser cutting surface is always perpendicular to the surface of the workpiece W, as shown in FIG.

However, in the case of cutting a thick plate, the cut surface is at an angle of θ (1 in the figure) with respect to the surface of the workpiece W, as shown in
represents a normal vector on the surface of the workpiece W. ) In some cases, it may be desired to perform taper cutting to form a shape. However, there is still no laser processing apparatus that directly satisfies these requirements.

[Object of the Invention] The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a laser processing apparatus capable of tapering a workpiece.

[Structure of the Invention] The present invention provides a laser processing device equipped with a laser oscillation device, a laser beam condensing device for a workpiece, and an X-Y positioning device for a workpiece. In addition to providing a work table with a movement mechanism,
A laser processing apparatus characterized by being provided with a distance adjustment device for adjusting the relative distance between the work table and the laser beam focusing device, the laser processing device rotating the precession mechanism by a predetermined angle to control the workpiece. For example, (f) laser cutting is performed with a taper of a predetermined angle in any direction of 360 degrees around the vertical axis.

[Embodiment of the Invention] FIG. 1 shows the entire laser processing apparatus according to an embodiment of the invention, in which a laser power supply section 1, an NC control device 3, an arm section 5, a desk 7, and a work area support 9 are integrated. It is assembled exactly.

A laser oscillation device 11 is built into the arm portion 5, and a laser beam bending device 13 is attached to the tip of the laser oscillation device 11. Further, a laser processing head 15 is provided below the bending device 13, and a focusing device (not shown) for focusing a laser beam onto the workpiece W is housed here.

The desk 7 is provided for an operator to perform NG programming work, and a heat exchanger (not shown) for water cooling the laser oscillation device 11 is housed inside the desk 7.

A work area 17 is provided on the work area support 9. Further, an air filter (not shown) is built in the work area support 9 to filter the metal mist generated in the work area 17 and exhaust it as clean air.

The work area 17 includes a laser beam sealing force bar 1
9 is equipped with a work handling mechanism and a laser beam transmission mechanism according to the type of processing. As a workpiece handling mechanism, a workpiece X-Y positioning device 21 and a taper machining tool @23 for supporting the workpiece W are provided.

The details of the work area 17 will be explained based on FIG.
The laser beam guided by the laser beam guide bar 25 from the laser oscillation device 11 is bent downward at right angles by the laser beam bending device 13 and guided to the processing head 15.

At the lower end of the processing head 15 is a nozzle 27 for ejecting auxiliary gas.
is installed. The laser processing head 15 and nozzle 27 are inserted into the laser beam shield cover 19 so as to face each other above the taper processing device 23.

An X-axis table 29 is provided inside the laser beam ceiling cover 19, and an X-axis stage 3 inside the X-axis table 29 is provided.
1 is driven in the X-axis direction by a motor 33. A Y-axis peripheral table 35 is mounted on this X-axis exit stage 31. A Y-axis stage 37 is provided within this Y-axis table 35, and a motor 39
It is designed to be driven in the Y-axis direction by. Furthermore, a plate 41 is attached on the Y-axis stage 37. The two X-axis tables, the Y-axis peripheral table 35, and the plate 41 constitute an X-Y positioning device 21.

A taper processing device 23 including a furnace 43 is mounted on the plate 41 . This taper processing device 23
A more detailed explanation will be given based on FIGS. 3 and 4. A base plate 45 is placed on the plate 41 in FIG.
A worm 47 is provided on this base plate 45, and this worm 47 is rotationally driven by a motor 49. A casing 51 is provided on the side of the worm 47, and this casing 51
A worm wheel 53 that meshes with the worm 47 is housed inside. A female screw is provided inside the worm wheel 53, and the screw 55 meshes with the female screw. Therefore, the worm 4 driven by the motor 49
The rotational movement of the screw 7 is converted into the vertical movement of the screw 55 in the Z-axis direction.

A block 57 is attached to the upper part of the screw 55, and a plate 59 is attached to the top of this block 57. There are also 6 worms on top of the 5 plates.
1 is provided and is rotationally driven by a motor 63. A worm wheel 67 housed in a casing 65 is provided on the side of the worm 61.
It meshes with 1.

A rotor 69 is mounted on the worm wheel 67. The upper surface of the rotor 69 is configured to be inclined by a predetermined angle θ, and slidably supports a slide bush 71 provided at the center of the bottom surface of the furnace 43 (7).

A cone 73 having an apex angle of 2θ is attached to the side surface of the furnace 43, and is inserted into a cylindrical hole 77 of a block 75 attached to the plate 59.

In this way, the taper processing device 23 including the furnace 43 is constructed on the XY positioning device 21.

The taper processing operation by the laser processing apparatus having the above configuration will be described next. First, the operation of the XY positioning device 21 of the work area 17 will be explained. The X-axis circumferential stage 31 and the Y-axis circumferential stage 37 are driven in the X-axis direction and the Y-axis direction by the motors 33 and 39, respectively. The upper plate 41 can be moved in two axes of X and Y directions. In this way, the workpiece W on the furnace 43 can be moved two-dimensionally with respect to the processing head 15 by movement in the two XY axes, and a desired processing position can be brought directly below the processing head 15.

In order to tilt the workpiece W with respect to the laser optical axis and provide a taper θ to the cut surface, the worm 61 is rotated by driving the motor 63, and the rotor 69 on the worm wheel 67 is rotated around the Z axis. The workpiece W is precessed by a predetermined angle and rotated so that the cut surface at a predetermined position of the workpiece W forms an inclination of θ with respect to the normal direction n.

At the same time as this operation, or before or after this operation, the motor 49 is driven to rotate the worm 47 so that the irradiated laser beam from the laser processing head 15 maintains the processing position of the workpiece W and a predetermined interval. The screw 55 is moved up and down by a predetermined distance.

By the above operation, a predetermined portion of the workpiece W can be laser cut with a taper of θ. In addition, when performing taper cutting of each part of this work W,
The adjustment of the axis, the Y axis, the vertical position of the furnace 43, the inclination direction, etc. are programmed in advance in the NC control device 3, and the motor 33.39 is adjusted according to the program.
．． It controls and automatically adjusts the rotation of 49°63.

When tapering the workpiece W as described above, the furnace 43 moves in a undulating manner due to the rotation of the rotor 69, but the conical element 73 moves along the inner circumference of the hole 7r to restrict this movement. .

This operation will be further explained based on FIGS. 5 and 6.

For example, when processing a disk-shaped product with radius r shown in FIG.
It is necessary to always maintain the incident angle of the laser beam at θ with respect to the normal vector n. As shown in FIG. 6, the
・86 points are processing points P.

When laser processing is performed continuously while sequentially positioning at (r, o), processing trajectories as shown at T+, T2, . . . T6 are sequentially advanced. Therefore, each point al.

a2. ...In order to perform precession so that the angle of incidence with respect to the normal vector n at a6 is always θ, the position coordinates of the machining starting point pn of the workpiece W must be (×+, V+
), (X2 , 'l'2 >, ... (Xa, V
s), ψn = tan −1[yn/ (2r −xn) ]
The rotation angle Φ of the six rotors is controlled by the equation.

FIG. 7 shows an embodiment of the present invention, and shows means for continuously changing the taper angle. In Fig. 3, the furnace 43 is used to process the workpiece W at the position of the maximum inclination angle θ, but the inclination angle at the processing point is
Use with changes within the range of 10. In other words, when the posture of the workpiece W is fixed at an angle θ with respect to the It is. Therefore, taper processing can be performed by setting the angle of the cut surface at the processing point Pa to any angle between -θ and +θ.

[Effects of the Invention] Since this invention has a work table equipped with a precession mechanism, it is possible to support the work at a predetermined angle with respect to the laser optical axis, and to support the work at a predetermined angle with respect to the laser optical axis. Laser cutting processing can be performed.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a laser processing apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of a work area in the above embodiment, and FIG. 3 is a partially cutaway front view of a work table in the above embodiment. FIG. 4 is a plan view of the work table of the above embodiment;
5 and 6 are explanatory diagrams of the laser cutting operation of the above embodiment, FIG. 7 is a plan view of the work table of another embodiment, and FIG. 8 is a perspective view of the state of cutting a workpiece according to the conventional example. FIG. 9 is a perspective view showing the state of taper processing of the workpiece according to the above embodiment. . 1... Laser power supply section, 3... NC control device, 5...
- Arm part, 7... Desk, 9... Work area support, 11... Laser oscillation device, 13... Bending device, 15... Processing head, 17... Work area, 19...・Laser beam ceiling cover, 2
1... Work drive mechanism, 23... Taber processing device,
25...Beam guide bar, 27...Nozzle, 2...X@ table, 31...X-axis stage, 3
3...Motor, 35...Y-axis table, 37...
・Y-axis stage, 39...Motor, 41...Plate, 43...Furnace, 45...Base plate, 47...Worm, 49...Motor, 51...
・Casing, 53... Worm wheel, 55...
・Screw, 57...Block, 59...Play=1-161...Worm, 63...Motor, 65
...Casing, 67...Worm wheel, 69
...Rotor, 71...Slide bush, 73...
- Cone, 75...block, 77...hole. [-1:・1',, (+. Figure 3 Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] In a laser processing device including a laser oscillation device, a laser beam focusing device for a workpiece, and an X-Y positioning device for the workpiece, a work table equipped with a precession mechanism is provided on the X-Y positioning device, and A laser processing apparatus comprising a distance adjusting device for adjusting a relative distance between the work table and the laser beam focusing device.