JPS61296899A - Ultrasonic oscillator - Google Patents

Ultrasonic oscillator

Info

Publication number
JPS61296899A
JPS61296899A JP14007085A JP14007085A JPS61296899A JP S61296899 A JPS61296899 A JP S61296899A JP 14007085 A JP14007085 A JP 14007085A JP 14007085 A JP14007085 A JP 14007085A JP S61296899 A JPS61296899 A JP S61296899A
Authority
JP
Japan
Prior art keywords
layer
sponge
rubber
ultrasonic
packing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14007085A
Other languages
Japanese (ja)
Inventor
Masaki Teshigahara
勅使川原 正樹
Hiroshi Teramoto
寺本 浩志
Nobuo Nakatsuka
中塚 信雄
Mitsutaka Kato
加藤 充孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP14007085A priority Critical patent/JPS61296899A/en
Publication of JPS61296899A publication Critical patent/JPS61296899A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make a packing layer thin and the size of an ultrasonic oscillator compact by forming the packing layer connected and disposed in a rear surface of a piezoelectric body in a laminating structure of a rubber layer and a sponge layer. CONSTITUTION:In a rear surface of a piezoelectric body 1 having electrode layers 11, 12 are formed on a front and a back surfaces, a packing layer 2 on which a rubber layer 21 and a sponge layer 22 are laminated is connected and disposed. As for the sponge layer 22, a sponge of a similar rubber to the rubber layer 21 is used and an ultrasonic reflection in an interface is reduced. Thereby, a strength of the packing layer 2 and an absorptivity of the ultrasonic wave can be improved by the sponge layer 22 and the rubber layer 21, so that the packing layer can be thinned and the ultrasonic oscillator can be made compact.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は超音波距離計、或いは超音波厚み計等に適用す
る超音波振動子に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an ultrasonic vibrator applied to an ultrasonic distance meter, an ultrasonic thickness meter, or the like.

〈発明の概要〉 この発明は、圧電体の背面にゴム層とスポンジ層とを積
層したパッキング層を接合配備してなり、振動子の小型
化、ケース内への支持性および超音波の吸収性の向上を
はかるにある。
<Summary of the Invention> The present invention is constructed by bonding and disposing a packing layer consisting of a rubber layer and a sponge layer on the back surface of a piezoelectric body, thereby reducing the size of the vibrator, supporting it in the case, and absorbing ultrasonic waves. The aim is to improve the

〈発明の概要〉 従来この種超音波振動子として、例えば第3図に示す如
く、圧電体3の背面にゴム等のバンキング層4を接合配
備したものがある。前記パッキング層4は、圧電体3の
両面から発生する超音波のうち、後方に進行する超音波
を吸収し、前方向にのみ超音波が進行しやすくなすと共
に、圧電体3の支持に機能する。
<Summary of the Invention> Conventionally, as this type of ultrasonic transducer, there is one in which a banking layer 4 made of rubber or the like is bonded to the back surface of a piezoelectric body 3, as shown in FIG. 3, for example. The packing layer 4 absorbs the ultrasonic waves that travel backwards among the ultrasonic waves generated from both sides of the piezoelectric body 3, makes it easier for the ultrasonic waves to travel only in the forward direction, and also functions to support the piezoelectric body 3. .

ところが、この種パッキングN4においては、超音波の
吸収性を高めるためにバンキング層4を成る程度厚くす
る必要があり、特に低周波の超音波振動子においては、
この厚みが更に大となる傾向にある。一方、超音波の吸
収性を高める他の方法として、パッキング層4をゴム性
スポンジにて構成することも考えられる。この場合、ゴ
ム勢スポンジが柔軟なため、超音波振動子をケース内に
支持する際、支持性が悪くなる等の不都合を生じる。
However, in this type of packing N4, it is necessary to make the banking layer 4 somewhat thick in order to increase the absorption of ultrasonic waves, especially in a low frequency ultrasonic transducer.
This thickness tends to become even larger. On the other hand, as another method of increasing the ultrasonic absorbability, it is also possible to configure the packing layer 4 with a rubber sponge. In this case, since the rubber sponge is flexible, when supporting the ultrasonic transducer within the case, problems such as poor supportability occur.

〈発明の目的〉 本発明は上記諸問題に鑑み、超音波振動子の小型化、超
音波の吸収性およびケースに対する支持性を向上し得る
新規な超音波振動子を提供することを目的とする。
<Object of the Invention> In view of the above-mentioned problems, an object of the present invention is to provide a novel ultrasonic transducer that can be miniaturized, and has improved ultrasonic absorption and support for a case. .

〈発明の構成および効果〉 上記の目的を達成するため、この発明では、圧電体の背
面に接合配備したバンキング層を、ゴム層とスポンジ層
の積層構造に構成してなる。
<Configuration and Effects of the Invention> In order to achieve the above object, in the present invention, the banking layer bonded to the back surface of the piezoelectric body is configured to have a laminated structure of a rubber layer and a sponge layer.

上記の構成によると、この発明では、超音波の吸収性を
スポンジ層により、またパッキング層の強度をゴム層に
より高め得、以て、パッキング層を薄く形成でき、超音
波振動子の小型化を実現できる所期の目的を達成した効
果を奏する。
According to the above configuration, in this invention, the absorption of ultrasound waves can be increased by the sponge layer, and the strength of the packing layer can be increased by the rubber layer, thereby making it possible to form the packing layer thinly and downsizing the ultrasound transducer. It produces the effect of achieving the desired goal that can be realized.

〈実施例の説明〉 第1図は本発明にかかる超音波振動子を示す。<Explanation of Examples> FIG. 1 shows an ultrasonic transducer according to the present invention.

該超音波振動子は、前後面に電極層11.12を形成し
た圧電体1の背面に、ゴム層21とスポンジ層22とを
積層したパッキング層2を接合配備したもので、上記ス
ポンジ層22は、ゴムN21と同系ゴムのスポンジを用
い、界面における超音波の反射を小さくすべく考慮して
いる。
This ultrasonic vibrator has a packing layer 2 in which a rubber layer 21 and a sponge layer 22 are laminated on the back side of a piezoelectric body 1 on which electrode layers 11 and 12 are formed on the front and rear surfaces. uses a sponge made of rubber similar to Rubber N21, and considers reducing the reflection of ultrasonic waves at the interface.

第2図は本発明の他の実施例を示す。該実施例では、前
述例と同様、圧電体1の背面に配備したパッキング層2
を、スポンジN22の両側にゴム層21.212を積層
した多層構造となしたもので、この場合、超音波振動子
の指示性が更に向上する。
FIG. 2 shows another embodiment of the invention. In this example, as in the previous example, a packing layer 2 is provided on the back surface of the piezoelectric body 1.
It has a multilayer structure in which rubber layers 21 and 212 are laminated on both sides of the sponge N22, and in this case, the directivity of the ultrasonic transducer is further improved.

本発明は上記の如く、超音波振動子において、圧電体l
の背面に接合配備したパッキング層2をゴム層21とス
ポンジ層22の積層構造となしたから、超音波の吸収性
をスポンジ層22により、またパッキング層2の強度を
ゴム層21により高め得、従って、パッキング層2を薄
くすることが可能となり超音波振動子の小型化、ケース
への支持性を高め得る所期の目的を達成した効果を奏す
る。
As described above, the present invention provides a piezoelectric material l in an ultrasonic transducer.
Since the packing layer 2 bonded and arranged on the back side has a laminated structure of the rubber layer 21 and the sponge layer 22, the absorption of ultrasonic waves can be increased by the sponge layer 22, and the strength of the packing layer 2 can be increased by the rubber layer 21. Therefore, it is possible to make the packing layer 2 thinner, thereby achieving the desired purpose of reducing the size of the ultrasonic transducer and improving its support to the case.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明にかかる超音波振動子の構造図、第2図
は第2実施例を示す図、第3図は従来の超音波振動子の
構造図である。
FIG. 1 is a structural diagram of an ultrasonic transducer according to the present invention, FIG. 2 is a diagram showing a second embodiment, and FIG. 3 is a structural diagram of a conventional ultrasonic transducer.

Claims (1)

【特許請求の範囲】 1 圧電体の背面にパッキング層が接合配備された超音
波振動子であって、前記パッキング層をゴム層とスポン
ジ層の積層構造となしたことを特徴とする。 2 ゴム層とスポンジ層は同系統の材質である特許請求
の範囲第1項記載の超音波振動子。
[Scope of Claims] 1. An ultrasonic transducer in which a packing layer is bonded to the back surface of a piezoelectric body, characterized in that the packing layer has a laminated structure of a rubber layer and a sponge layer. 2. The ultrasonic transducer according to claim 1, wherein the rubber layer and the sponge layer are made of the same material.
JP14007085A 1985-06-25 1985-06-25 Ultrasonic oscillator Pending JPS61296899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14007085A JPS61296899A (en) 1985-06-25 1985-06-25 Ultrasonic oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14007085A JPS61296899A (en) 1985-06-25 1985-06-25 Ultrasonic oscillator

Publications (1)

Publication Number Publication Date
JPS61296899A true JPS61296899A (en) 1986-12-27

Family

ID=15260269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14007085A Pending JPS61296899A (en) 1985-06-25 1985-06-25 Ultrasonic oscillator

Country Status (1)

Country Link
JP (1) JPS61296899A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038027A1 (en) * 1996-12-06 1999-07-29 Shigeyasu Ishida Transmitter for ultrasonic wave emitter
JP2007158468A (en) * 2005-11-30 2007-06-21 Toshiba Corp Ultrasonic probe and ultrasonic image apparatus
JP2012205726A (en) * 2011-03-29 2012-10-25 Toshiba Corp Ultrasonic probe and ultrasonic probe manufacturing method
JP2015028470A (en) * 2013-06-27 2015-02-12 株式会社東芝 Device, method and program for measuring spatial position

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038027A1 (en) * 1996-12-06 1999-07-29 Shigeyasu Ishida Transmitter for ultrasonic wave emitter
JP2007158468A (en) * 2005-11-30 2007-06-21 Toshiba Corp Ultrasonic probe and ultrasonic image apparatus
JP2012205726A (en) * 2011-03-29 2012-10-25 Toshiba Corp Ultrasonic probe and ultrasonic probe manufacturing method
JP2015028470A (en) * 2013-06-27 2015-02-12 株式会社東芝 Device, method and program for measuring spatial position
US10725148B2 (en) 2013-06-27 2020-07-28 Kabushiki Kaisha Toshiba Apparatus, method and program for spatial position measurement

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