JPS61295650A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To compose parallel pitches of terminal parts of an integrated circuit chip closely to miniaturize a thermal head chip so that many chips may be taken from a sheet of material substrate, by putting flexible connection circuits of small length between flexible connection circuits of large length connected with external circuits and the integrated circuit chip. CONSTITUTION:Wirings 2c of flexible connection circuits 2, which are of large length, e.g., 150-300mm, between adhesion terminal parts 2b and connector connection parts 2a, are performed in parallel and the same pitch, as connection terminals 3a in a connector 3 are arranged with the arrangement pitch of 0.3mm or more. In the flexible connection circuits 4 of much smaller length than the flexible connection circuits 2, the wirings 4c of adhesion terminal parts 4a are performed by making electrodes 1b and 1c of an adhesion terminal part 1e in a thermal head 1 to be connected, and the wirings 4c of adhesion terminal parts 4b are performed by making the wirings 2c of adhesion terminal 2b on the connection circuits 2 to be connected. By putting the flexible connection circuits 4 of small length between the flexible connection circuits 2 of large length connected with external circuits and the thermal head chip 1 this way, the flexible connection circuits 4 of small length, even with 100mum or so in parallel pitch of the wirings 4c, can be produced with high productivity and yield, becoming superior in reliability while being used, and therefore the parallel pitches of electrodes 1b and 1c in the thermal head chip 1 can composed, with 100Xm or so of small chips, closely to the adhesion terminal parts 1e.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an integrated circuit device that is composed of a thermal head chip used in a recording/output device such as a word processor and an external thermal head heat generation control circuit. ,
Specifically, an integrated circuit chip having connection terminals lined up at a fine pitch on one side and an external circuit having connection terminals lined up at a coarse pitch corresponding to the connection terminals of the integrated circuit chip are connected to each other with connection terminals lined up at both ends. The present invention relates to an integrated circuit device connected by a flexible connection circuit having a flexible connection circuit.

[Prior art]

The conventional integrated circuit device as described above is disclosed in Japanese Patent Application Laid-open No. 60-38.
As seen in the connection between the serial type thermal head chip and an external circuit shown in Publication No. 176, an adhesive terminal part is formed on one end to connect to the thermal head chip, and the other end is connected to the external circuit. A single flexible connection circuit, such as a flexible printed circuit (FPO) formed with a connector connection portion, was used to connect the integrated circuit chip and an external circuit. Taking the integrated circuit device disclosed in Japanese Unexamined Patent Publication No. 60-38176 as an example, the thermal head device is built into a printer, and the head chip must move left and right across the width of recording paper such as A4 or B4. Therefore, the length of the flexible portion of the above-mentioned FPc that connects the head chip and the heat generating part control circuit board is 1.
It must be long, between 50 and 300 pieces. These long FPCs are made with high productivity and yield,
In order to have excellent reliability during use, the parallel wiring pitch of the FPC must be set to a coarse pitch of 0.3 degrees or more. Therefore, the parallel pitch of the adhesive terminals connected to the thermal RAD chip on one end of the FPC is also fine, 0.3
It's about the size of a seagull. For this reason, thermal head chips can be manufactured with high productivity even if the parallel pitch of signal electrodes, common electrodes, etc. and the pitch of adhesive terminals lined up on one side of the extension of these electrodes are 100 μm or less using semiconductor manufacturing equipment. Despite poor reliability and poor yield,
The parallel pitch of the adhesive terminals had to be about 0.3 brocades, and as a result.

Thermal RAD chips have become larger, and the heat dissipation plates and head holders have also become larger, making the entire thermal head heavier.Furthermore, for those that use thermal transfer ink ribbons, the ribbon cassettes have also become larger, making printers larger and larger.
It also led to complications.

For example, if the thermal radar chip has a 24-dot head, a 0.3-pitch pitch requires a width of at least 0.3 x 26 = 7.13 m, including common electrodes at both ends, and a 2 x 24-dot head, that is, a 24-dot chip. In the case of a dot head with two rows of heat generating parts, at least 0.3 x 48 = 1
4.4 fl plus 3 strips of width for common electrode 17.4
A width of a is required, and the resistor pitch of the heat generating part is 1736.
2
It requires the same width as a 24 dot head.

[Purpose of the invention]

The present invention was made in order to solve the problem that integrated circuit chips are forced to increase in size due to FPC as described above.For example, when the integrated circuit chips are thermal radar chips, x 2 x 24 dot head chips or 48 dot head chips, which are not much different in size from conventional 24 dot printing chips, can print at twice the speed or print with high resolution white characters. The purpose of the present invention is to provide a thermal printer, that is, an integrated circuit device that enables the following.

[Structure of the invention]

The present invention connects an integrated circuit chip having connection terminals lined up at a fine pitch on one side and an external circuit having connection terminals lined up at a coarse pitch corresponding to the connection terminals of the integrated circuit chip with connection terminals lined up at both ends. In an integrated circuit device connected by a flexible connection circuit having A flexible connection circuit with a short length, the parallel pitch of the connection terminals on one end is the same as the coarse connection terminal parallel pitch of the above connection circuit, and the parallel pitch of the connection terminals on the other end is the same as the connection terminals of the external circuit. An integrated circuit device characterized in that it uses a circuit that is connected to a flexible connection circuit having a long length.

That is, in the case of a long flexible connection circuit, the parallel wiring pitch must be approximately 0.3 fins or more, as described above, but in the case of a short flexible connection circuit, the present invention A circuit, preferably a connection circuit such as a carrier tape, in which wiring made of copper foil is bonded on a base film such as a polyimide film so that both ends protrude from the base film and serve as adhesive terminals. This is because it is possible to manufacture not only coarse parallel wiring pitches but also fine parallel wiring pitches of about 100 μm with high productivity, yield, and excellent reliability. This invention was made based on the discovery that the parallel pitch of the terminals of an integrated circuit chip can be made finer by using it between a long flexible connection circuit connected to an external circuit and an integrated circuit chip, thereby achieving the above object. It is.

〔Example〕

Hereinafter, the present invention will be explained using illustrated examples.

1 and 2 are a plan view and a cross-sectional view along a wiring circuit showing an example of the integrated circuit device of the present invention.

In the figure, 1 is provided with two heat generating parts 1a arranged side by side,
A thermal head chip in which the signal electrode 1b and the common electrode IC are extended in parallel to one side of the chip, and the exposed surface outside the protective layer 1d is an adhesive terminal part 1e.
1f is a chip substrate. 2 has a connector connecting part 2a formed at one end to be inserted into a connector 3 provided integrally with a thermal head heat generating part control circuit (not shown), and exposes the surface of a wiring 2C made of copper foil on one side at the other end. It is a long flexible connection circuit in which the length between the adhesive terminal part 2b and the connector connecting part 2a is 150 to 300 mm.

The wiring 2c in this connection circuit 2 is provided in parallel with the same pitch as the arrangement pitch of the connection terminals 3a of the connector 3 of 0.3 or more. 2d is a base film made of a film such as polyimide, and 2e is the same. An overlay film consisting of a film, 2F hahes film 2
d is a through connection part connecting the wiring 2C and the contact terminal on the outside of the connector connection part 2a through a contact hole provided in the overlay film 2e. The pitch is the same as the electrode parallel pitch of the thermal head chip 1, the parallel pitch on the other end side is the same as the wiring parallel pitch of the flexible connection circuit 2, and both ends are separated from the base film 4d made of a film such as polyimide. The length of the flexible connection circuit that is taken out and adhered onto the base film 4d is much shorter than that of the flexible connection circuit 2, and both ends of the wiring 4C protrude from the base film 4d. The portions formed by the adhesive terminals are adhesive terminal portions 4a and 4b, respectively. The wiring IJ4c of the adhesive terminal part 4a of the connection circuit 4 is connected to the electrode 1b, IC of the adhesive terminal part 1e of the thermal head 1, and the wiring 4C of the adhesive terminal part 4b of the connection circuit 4 is the wiring of the adhesive terminal 2b of the connection circuit 2. 2C
and respectively connected by soldering etc.

In this way, by using a short flexible connecting circuit 4 such as a carrier tape between the long flexible connecting circuit 2 connected to an external circuit and the thermal head chip l, a short flexible connecting circuit 4 is used. The connection circuit 4 can be produced with a parallel pitch of about 100 μm for the wiring 4C at a high productivity of 1 yield, and has excellent reliability during use. Terminal part 1e
It is possible to make the pitch as fine as about 100 μm.

The present invention is not limited to the illustrated example, and can be applied even if the integrated circuit chip is other than a thermal radar chip, such as an inkjet head chip, and the long flexible connection circuit can be connected to an external circuit using a connector. It may be made by adhesion instead of by adhesive.

〔Effect of the invention〕

As is clear from the above, according to the present invention, it is possible to miniaturize the thermal RAD chip so that more chips can be taken from a single material substrate, and to replace the chip that can print at twice the speed and with high resolution compared to the conventional chip. The size of the printer can be reduced to the same size as a low-speed, low-resolution printing chip, making the printer more compact.

The excellent effect of simplifying the process can be obtained.

[Brief explanation of drawings]

1 and 2 are a plan view and a cross-sectional view along a wiring circuit showing an example of the integrated circuit device of the present invention. 1... Thermal head chip, 1a... Heat generating part, 1b... Signal pole, I
C... Common electrode, 1d... Protective layer, 1e... Adhesive terminal portion, 1. f...Chip board, 2...Long flexible connection circuit, 2a...Connector connection part, 2b...Adhesive terminal part,
2c...Wiring, 2d...Base film, 2e.
...Overlay film, 2f...Through connection part, 3...Connector, 3a
...Connection terminal, 4...Short flexible connection circuit, 4a, 4b...Adhesive terminal part, 4C...Wiring, 4
d...Base film. Patent applicant: Konishiroku Photo Industry Co., Ltd. Figure 1 Figure O

Claims (2)

[Claims] (1) An integrated circuit chip having connection terminals lined up at a fine pitch on one side and an external circuit having connection terminals lined up at a coarse pitch corresponding to the connection terminals of the integrated circuit chip, with connection terminals lined up at both ends. In integrated circuit devices connected by flexible connection circuits, the parallel pitch of the connection terminals at one end is the same as that of the connection terminals of the integrated circuit chip, and the parallel pitch of the connection terminals at the other end is a coarse pitch length. A short flexible connection circuit, the parallel pitch of the connection terminals on one end side is the same as the parallel pitch of the coarse connection terminals of the above connection circuit, and the parallel pitch of the connection terminals on the other end side is the same as the connection terminals of the external circuit. An integrated circuit device characterized by using a circuit consisting of connections with flexible connection circuits having a long length corresponding to a pitch. (2) The integrated circuit device according to claim 1, wherein the short flexible connection circuit is a film carrier tape.