JPS61294819A - Coating equipment - Google Patents

Abstract

PURPOSE:To prevent the reverse surface of a semiconductor substrate from being contaminated with photoresist by making the spin chuck as large as the semiconductor substrate, and incorporating therein a spin chuck which is a little smaller than the spacing between the belts for conveying the semiconductor substrate. CONSTITUTION:Two spin chucks 2, 3 having different diameters, large and small, are provided. The central portion of the spin chuck 3 of the large diameter is hollowed out into the shape of a disk to form an opening, the spin chuck 2 of the small diameter is disposed in the opening 3a, the two spin chucks 2, 3 are disposed concentrically and doubly in the inside and the outside, and the small-diameter spin chuck 2 in the inside is placed so that it can rise and fall in the upward and downward directions (axial directions). The inside spin chuck 2 is set to a diameter which is smaller than the spacing between conveying belts 4, 4. The reverse surface of the substrate is thus protected by the spin chucks 2, 3, and therefore when photoresist is applied with high speed revolution, there is no contamination with the excessive amount of resist.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a coating device.

[Conventional technology]

Conventionally, the spin chuck of this type of coating device is shown in Fig. 2 (
As shown in α) and (b), the spicchuck 5 moves up and down, and when it is at the top, the receiver for the semiconductor substrate l is used for picking up and sending it out, and when it is at the bottom, it rotates at high speed to coat the photoresist. It was supposed to be done.

[Problem that the invention seeks to solve]

In the conventional coating device described above, the size of the spin chuck 5 is limited by the interval between the semiconductor substrate conveying belts 4 and 40, so the back side of the semiconductor substrate 1 held protruding from the spin chuck is coated with photoresist at high speed. A drawback is that there is a risk of contamination with excess resist when coating by rotation.

The present invention provides a coating apparatus in which the spin chuck is of a split type and the size of the spin chuck is changed between when transporting a semiconductor substrate and when coating a semiconductor substrate.

[Means for solving problems]

The coating device of the present invention has two large and small spin chucks with different diameters arranged concentrically in two layers: 1. This coating device is characterized by an inner small-diameter spin chuck that is movable in the axial direction.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIGS. 1(α) and (b), there are two spin chucks 2 and 3 with different diameters, the center of the spin chuck 3 with a large diameter is hollowed out in the shape of a disk, and the opening 3cL is provided with a small diameter. Two spin chucks 2 and 3 are arranged concentrically in double layers, inside and outside, and the inner small-diameter spin chuck 2 is installed to be movable up and down in the vertical direction (axial direction). The inner spin chuck 2 is set to have a smaller diameter than the interval between the conveyor belts 4, 4.

When applying photoresist to a semiconductor substrate, use the method shown in Figure 1 (
As shown in α), two spin chucks 2 and 3 are positioned on the same surface, and the semiconductor substrate 1 is chucked by the two spin chucks. In this case, spin chuck 2.
3, there is no possibility of contamination with excess resist when applying photoresist at high speed.

When a semiconductor substrate is transferred, only the inner spin chuck 2 transfers the semiconductor substrate, as shown in FIG. 1(b).

Therefore, it can be performed regardless of the size of the semiconductor substrate 1. The diameter of the larger spin chuck 3 is preferably 1 mm smaller than the diameter of the semiconductor substrate.

〔Effect of the invention〕

As explained above, in the present invention, the spin chuck of the coating device is made the size of the semiconductor substrate, and a spin chuck that is slightly smaller than the interval between the semiconductor substrate conveying belts is incorporated into it, so that the back side of the semiconductor substrate is not contaminated with photoresist. This has the effect that it is possible to prevent such problems, and that transportation can be carried out regardless of the size of the semiconductor substrate.

[Brief explanation of drawings]

FIGS. 1(α) and (b) are longitudinal cross-sectional views of the semiconductor manufacturing apparatus of the present invention, FIG. 1(cL) is a diagram showing a state in which two spin chucks are integrated, and FIG. 1Cb) Figure 2 shows a state in which the inner spin chuck is raised during semiconductor substrate transfer, Figures 2 (α) and (b) are longitudinal cross-sectional views of the conventional device, and Figure 2 (α) shows a state in which the spin chuck is lowered. Figure 2 (b) is a diagram when the spin chuck is on top. 1... Semiconductor substrate 2... Inner spin chuck 3... Outer spin chuck 4... Conveyor belt patent applicant NEC Corporation (a) (b) Figure 1 (a) (b) Figure 2

Claims (1)

[Claims] (1) In a coating device that attaches a semiconductor substrate to a spin chuck and rotates it to apply photoresist to the substrate in the photolithography process in semiconductor manufacturing, two spin chucks with different diameters are arranged concentrically in two layers, inside and outside. arranged,
A coating device characterized by an inner small-diameter spin chuck that can be displaced in the axial direction.