JPS61291989A - Partial plating apparatus - Google Patents

Abstract

PURPOSE:To enable both the required plating of a narrow-width part and the change of the plated width by covering the surface of a narrow-width top part of a freely changeable anode main body with an insulating mesh body, holding a plating liquid and bringing a material to be plated into contact with the mesh body. CONSTITUTION:An anode main body 6 having a narrow-width anode part 10 in a top part 9 is vertically provided freely changeably with a material having the other size on a base 4 and is fixed together with an insulating mesh body 7 covering the surface thereof with the bolts 11 and the nuts 12 via the fixed plates 5. Then after pushing up a plating liquid 16 to a liquid level Y and holding the plating liquid 16 in a part 15 proportionate to a top part of the mesh body 7, the plating liquid 16 is lowered to a liquid level X. Then a connector 1 of a material to be plated is introduced and the curved surface 14 thereof is brought into contact with the above-mentioned part 15 proportionate to the top part. Thereafter electricity is conducted between the connector 1 and the anode main body 6 and the plating is performed in a part of the width (t) of the curved surface 14.

Description

[Detailed Description of the Invention] [Prior Art] Many devices have been provided in the past as partial plating devices for electrical and electronic components such as connectors. The main ones include (a) the plating equipment shown in Japanese Patent Application Laid-open No. 52-1!
There is an apparatus shown in FIGS. 5 and 8 of Publication No. 1. In the former (a), a plating solution spraying device is combined with a tunnel that also serves as a mask to guide a continuous connector, and the plating solution is sprayed toward the part of the connector that is exposed to the outside through nine windows opened in the tunnel wall. Give alms.

Partial plating is performed continuously on connectors transported through the tunnel. The latter (b) is a device in which fine bristles are bundled, a brush is placed upright in a plating liquid tank, and the plating liquid is force-fed into the brush toward the top of the brush, and the moving strip is brush-plated in contact with the top of the brush. R (Figure 3),
and EL (FIG. 8), in which a rotatable roller with bundled fine hair is disposed in a plating liquid tank and roll plating is carried out on a moving band-like body in contact with the uppermost surface of the roller.

(Problem to be solved by the invention) In the former case (a), the plating liquid that has entered through the window enters and adheres to the parts of the connector other than the parts to be plated, which increases the amount of metal consumed. In the latter case (b), the top of the brush (6th point) corresponds to the tip of the fine bristles.
(Fig.) or the top surface of the roller (Fig. 8) and the degree of contact between the belt-shaped object and the smearing area (plating @) and the distribution of plating thickness are not constant, or when you want to reduce the "part" of partial plating. However, the hoolashi (Fig. 5) and the roller (Fig. 8)
There is a limit to the reduction in size, making it difficult to efficiently perform partial plating in narrow areas.

Therefore, an object of the present invention is to provide a complete partial plating apparatus that can perform narrow partial plating only on a desired portion of a plated object and can change the width of the plating area.

It is a means to solve problems. This invention aims to achieve the above objectives.

In the partial plating apparatus according to the first aspect of the invention, a plate-shaped anode body having a narrow anode portion at the top is freely exchangeable with another anode body having a narrow size anode portion, and is erected on a base. ? The gist is that the surface of the anode body is covered with an insulating mesh body that retains at least the plating solution supplied to the top. A plate-shaped anode holder having an anode part and having a supply path inside that communicates with a plating solution supply hole provided in the anode part is freely exchangeable with another narrow-sized anode holder with an anode part, This is an insulating mesh body that stands upright on the base and retains at least the plating solution supplied to the top, and covers the surface of the anode section.

Function: In the partial plating device according to the first invention, the plating material comes into contact with the part of the mesh body that covers the narrow anode gold of the plate-shaped anode main body, so that the plating material is supplied in advance to the part corresponding to the top of the mesh body. The plating solution is applied to the contact portion of the plating object, and partial plating is performed by applying current to the cathode side and the anode side of the plating object and the anode body, respectively.

At this time, at least the level of the plating solution 1, for example, the plating solution supplied to the top, is changed to a height where the top of the anode body is immersed, and after supplying enough plating solution, the level is lowered again. The plating solution supplied using a variable supply method is retained in the mesh body, so the area where the plating solution is applied to the plating object that comes into contact with it is slightly larger than the width of the narrow anode part, but it is extremely small. Because the distance between them is very close, the current concentrates and deposits metal only on the desired part (i.e., the part to be plated) and in an area corresponding to the width of the narrow anode part. This prevents precipitation. The part where the plating solution is applied to the plated object corresponds to the top of the mesh body, and this top part is determined by the size of the narrow anode part. This is because the plated parts do not deform when they come into contact with each other, increasing the contact area.

The plating area for partial plating is specified as a portion that approximately corresponds to the intended narrow width of the anode portion. Furthermore, since the anode main body is freely replaceable with another anode main body having an anode portion of a narrow size, the width of the plating area can also be changed accordingly.

In the partial plating device according to the second aspect of the invention, the plating material comes into contact with the part of the mesh body that covers the narrow anode part provided at the top of the plate-shaped anode holder, so that the part corresponding to the top of the mesh body The plating solution supplied in advance to the plated object adheres to the contact portion of the plating object, and partial plating is performed by applying current to the plating object and the anode section on the cathode side and the anode side, respectively. At this time, at least the plating solution supplied to the top part, that is, the plating solution applied from the supply channel inside the anode holder to the plating solution supply hole of the anode part and supplied to the part corresponding to the top part of the mesh body, is stored in the mesh body. Although the area where the plating solution is applied to the plating object that comes in contact with it is slightly larger than the width of the narrow anode section, the distance between the electrodes is very close, so it is difficult to reach the desired area [i.e. the area to be plated]. ], the current is concentrated only in an area corresponding to the width size of the narrow anode part, causing metal to be deposited, and therefore not to be deposited in other parts.

And the part where the plating solution is applied to the plated object.

This corresponds to the top part of the mesh body, and this top part is determined by the size of the narrow anode part.Moreover, the mesh body has fine hairs (i.e., flexibility) of the conventional device, and deforms when the meshing object comes into contact with it. Since the contact area is not such that the contact area is widened, the plating area for partial plating is specified as a portion that corresponds approximately to the narrow width of the intended anode portion. Furthermore, since the narrow anode part can be replaced with another anode holder with another narrow anode part, the width of the plating area can be changed accordingly.

<Example> Next, an example will be described. 1 to 5 show an embodiment of a partial plating apparatus according to the first invention,
An anode 3 is arranged along a path line 2 along which a connector 1 as a "plated object" is conveyed in a substantially horizontal state. This anode 3 has a plate-shaped anode main body 6 erected on a pace 4 such that both sides are sandwiched between fixed plates 5, and the entire surface of the anode main body 6 is covered with an insulating mesh body 7. covered. The mesh body 7 is placed over the anode body 6, and both terminals 8 are held down by the fixing plate 5 in a closed state.

The anode main body 6 has a narrow anode part io'r at the top 9, and can be freely replaced with an anode main body [not shown] having an anode part of another narrow size having two different widths (1). . That is, on pace 4, bolt 11 and nut 1
2, the anode body 6 can be easily replaced with another one by removing the fixing plate 5t and releasing the clamping state. or.

The bolt holes 13 of the fixing plate 5 are designed so that the pair of fixing plates 5 on both sides can be slid in the direction of opening (in the direction of the arrow in FIG. 2) so that the bolts 11 and nuts 12 do not have to be removed each time the anode body 6 is replaced. It has a long hole shape in the open (direction).

The height of the anode body 6 is set at such a height that the curved surface 14 of the connector 1 can come into contact with the surface of the mesh body 70 that covers the anode portion 10 of the top portion 9 during transportation.

Next, the state of plating will be explained. First, the connector 1 is conveyed substantially horizontally along the pass line 2, and the two curved surfaces 14 come into contact with the portion 15 of the mesh body 70 corresponding to the top portion 9. The plating solution 16 supplied to the top portion 15 of the mesh body 1 is adjusted by adjusting the height of the "liquid level".
) and the liquid level (Y) t- are repeated alternately until the top portion 15 is immersed in the plating liquid 16 when the liquid level is (Y). Then, a rectifier (not shown) is turned on for an appropriate period of time until the plating solution 16 lowers the "liquid level", descends from the top portion 15, rises again, and immerses the top portion 15, and the liquid level is When you reach Y.

By setting it to OFF, the top portion 1
When the plating liquid 16 is sufficiently supplied to the plating solution 16 and the "liquid level" drops to the liquid level
The plating process is performed as a result of this.

In this plating process, the plating 116 supplied to the top portion 15 of the mesh body 70 comes into contact with the curved surface 14 and
However, since the width size of the top portion 150 corresponds to the width t, that is, the cyanode portion 100 width size, it is naturally considered to be a narrow size, and the plating solution 1
The amount of the mesh body 7 is limited to the amount that can be maintained between the mesh body 7 and the surface of the anode section 10 (i.e., not so much, but rather a small amount), and furthermore, the mesh body 7 is not a brush made of fine bristles, but a curved surface 14. Due to reasons such as not changing the width t upon contact with the curved surface 14, it attaches to the curved surface 14 in an area that roughly corresponds to the limited width t, and it attaches exactly to the "portion", and also adheres to the curved surface 14 [cathode]. ] and the anode part 10 [anode] is very small, corresponding to the thickness of the mesh body 7, so the current flows concentrated in the desired part and no plating is deposited in other parts. As shown in Figure 3, accurate partial plating with a uniform thickness μ without variation at each point A, B, C, D, E, F within the next width size according to the width t is performed as a plating target part. It will be held in the area.

Such partial plating is possible because the anode portion 10 is narrow and has a so-called rectangular top that is elongated in plan view.
All of the connectors 1 that are in contact with the plating liquid 16 are carried out at the same time, and as the plating liquid 16 is conveyed at a predetermined pitch, new connectors 1 come into contact with the plating liquid 16. This is done repeatedly and intermittently by supplying and energizing. In either case, partial plating is always performed according to the width t.

If the anode section 10 is replaced with another narrower one, the width of the plating area will be changed accordingly.

Next, an embodiment of the second invention shown in FIG. 4 will be described. In this embodiment, a plate-shaped anode holder 20 and a nine-width narrow anode part 21 attached to the top of the plate-shaped anode holder 20 are used in place of the grate-shaped anode body 6, and a portion corresponding to the top of the mesh body 7 is used. The plating solution 16 is supplied to the anode holder 20 through a plating solution supply hole 23 provided in the anode section 21 communicating with the supply channel 22 in the anode holder 20.
The plating solution 16 is constantly supplied so that it oozes out into the top portion 15. Therefore, since the connector 1 and the anode section 21 are constantly energized, so to speak, continuous partial plating can be performed.

Then, the width of the "plating area" is changed by replacing it with another anode holder (not shown) with a narrower anode part (not shown).

The rest of the structure and the details of the partial plating are substantially the same as those of the embodiment shown in FIGS. 1 to 6, so common parts are designated by the same reference numerals and redundant explanation will be omitted.

Since the partial plating apparatus according to the present invention has the contents as described above, it is possible to reliably perform partial plating on the entire plating area of the plated object with a narrow size, and to prevent plating on areas other than the desired areas. Since there is no precipitation, metal consumption can be reduced accordingly.

Furthermore, since the width of the anode part can be changed by replacing it with another anode part, the common effect that the width of the plating area can also be changed is obtained in both the first invention and the second invention, and also in the second invention. According to the above, in addition to the above-mentioned common effects, the plating solution can be supplied to the mesh body through the supply channel of the anode holder and the plating solution supply hole of the anode part, which allows the plating solution to be constantly supplied and narrow spaces can be used. This has the effect of allowing continuous partial plating to the plating area. According to the embodiment, in both the first and second inventions, the narrow anode part can be easily replaced with another one, including the anode body and anode holder, by simply loosening the bolts, opening and closing the fixing plate, and releasing the clamping state. Furthermore, there is an additional effect that by pressing both ends of the mesh body placed over the anode part with the fixing plate, the entire surface of the anode body or the entire surface of the anode part at the top of the anode holder can be easily covered.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view showing a state in which a partial plating apparatus according to the present invention (first invention) is used. FIG. 2 is a partially cutaway side view of the partial plating device as seen in the direction of the arrow (■) in FIG. FIG. 6 is an explanatory diagram showing the relationship between the narrow anode portion, the plating area of the connector, and the plating with a uniform thickness applied thereto. FIG. 4 is a side view corresponding to FIG. 2 showing an embodiment of the partial plating apparatus according to the present invention (second invention). 1 11. Connector (plated) 3...Anode 4...Base 5...Fixing plate, plate 6...Anode body 7...Mesh body 9...Top portion 10.21. ... Narrow anode section 16 ... Plating solution 20 ... Anode holder 22 ... Supply channel 23 ... Plating solution supply hole Fig. 2

Claims (2)

[Claims] (1) A plate-shaped anode body having a narrow anode portion at the top is freely exchangeable with another anode body having a narrow size anode portion, and is erected on a base, so that at least the top is supplied with the anode body. The partial plating device comprises an insulating mesh body that retains the plating solution and covers the surface of the anode body. (2) A plate-shaped anode holder with a narrow anode part on the top and a supply path inside that communicates with the plating solution supply hole provided in the anode part can be used with other narrow-sized anode parts. A partial plating device comprising an insulating mesh body that is replaceable with an anode holder, stands upright on a base, and covers the surface of the anode section with an insulating mesh body that retains at least a plating solution supplied to the top.