JPS61291971A - Plane discharge electrode - Google Patents

Abstract

PURPOSE:To generate plasma spirally hence uniformly by forming magnets connected with a rotational driving device to the double spiral shape so that the respective poles are alternately disposed at prescribed intervals. CONSTITUTION:A plane target 1 is provided as a cathode material. The magnets 2 constituted in such a manner that the N poles and S poles are spirally formed double and that the respective poles are radially and alternately disposed at the prescribed intervals are disposed on the bottom surface side of the target in proximity thereto. The magnets 2 are rotated along the target 1 by the rotational driving device 3 connected to the magnets 3 to move the spirally generated plasma 4 toward the outside or inside of the radial direction. The plasma 4 is generated and moved over the entire part above the target 1 and the target 1 material is uniformly splashed by such constitution. A material to be treated is thereby uniformly etched.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a plane discharge cathode, and more particularly to a plane discharge cathode that is applied to a sputtering device and the like and generates plasma discharge.

[Technical burden of the invention and its problems]

Traditionally, discharge cathodes have magnets arranged concentrically,
A planar cathode material is placed close to this magnet, and an electric field is generated by applying a high voltage between the cathode material and a separately placed anode, and this electric field and the magnet A plasma discharge is generated in the area where the radial magnetic field generated by the radial magnetic field intersects perpendicularly.

Such discharge cathodes are applied, for example, to sputtering equipment, ion etching equipment, etc. In sputtering equipment, the target is used as the cathode material, and the object to be processed is used as the anode, and the target material is scattered by the plasma discharge. This process forms a film on the object to be treated.

However, in the above-mentioned discharge cathode, since the magnetic field by the magnet is fixed, plasma is generated partially.
It was not possible to scatter the target material uniformly.

For this reason, in the past, there was a method in which the magnet was eccentrically rotated to move the magnetic field and move the plasma generating part, but it was not possible to generate plasma completely uniformly.

[Purpose of the invention]

The present invention has been made in view of the above points, and an object of the present invention is to provide a Group 1i cathode that can generate plasma discharge uniformly over its surface.

(Summary of the Invention) In order to achieve the above object, the planar discharge cathode according to the present invention is provided by arranging a magnet close to a planar cathode material and applying a high voltage between the cathode material and the anode to generate a plasma. In the flat discharge cathode that generates a discharge, the magnet is formed into a double spiral shape with eight poles arranged alternately in the radial direction and at a predetermined interval, and the magnet is attached to the magnet along the cathode material. The magnet is connected to a rotary drive device that rotates the magnet, and the shape of the magnet generates plasma in a thinly wound shape.

(Embodiments of the Invention) Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 shows an embodiment in which the present invention is applied to a sputtering device, in which a planar target 1 is provided as a cathode material, and a magnet 2 is placed close to the lower surface of the target 1. has been done. As shown in FIG. 2, this magnet 2 has N and S poles formed in a double spiral shape, and the eight poles are arranged alternately in the radial direction and at a predetermined interval. There is. Further, below the magnet 2, a rotation drive device M3 such as a motor that rotates the magnet 2 twice along the target 1 is provided.
is connected.

In this embodiment, the discharge cathode configured as described above is placed in a high-altitude container so as to face the object to be treated (not shown) serving as an anode, and is placed between the target 1 and the object to be treated. A high voltage is applied from a power source (not shown). Then, an electric field is generated between the target 1 and the object to be processed, and plasma 4 is generated in a portion where this electric field and the magnetic field generated by the magnet 1 are perpendicular to each other. Then, the material of the target 1 is scattered by this plasma 4 to form a film on the object to be processed. In this case, the plasma 4 is generated in a spiral shape because the magnet 2 is formed in a spiral shape, and since the magnet 2 is rotated by the rotation drive device 3, the plasma generated in the spiral shape is 4 moves radially outward or inward.

Therefore, since the plasma 4 is generated and moves over the entire area above the target 1, the target material can be uniformly scattered, and a uniform film can be formed on the object to be processed.

Further, in the above embodiments, the case where the discharge cathode is applied to a sputtering device was explained, but it can also be used as an electrode of an ion etching device, and with such a configuration, uniform etching of the object to be processed can be performed. becomes possible.

〔Effect of the invention〕

As described above, in the flat discharge cathode according to the present invention, the magnet connected to the rotation drive device is formed in a double spiral shape so that eight poles are alternately arranged at predetermined intervals. A radial magnetic field is generated in a spiral shape by the magnet, and therefore plasma is generated in a spiral shape.

Furthermore, by rotating the magnet, plasma is generated over the entire area of the cathode material.
Extremely uniform plasma can be generated, and, for example, when applied to a sputtering device, it is possible to form a uniform film, and when applied to an ion etching device, uniform etching can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a plan view of the magnet shown in FIG. 1. 1...Target~, 2...Magnet, 3...
Rotary drive device, 4... plasma.

Claims (1)

[Claims] In a flat discharge cathode, in which a magnet is placed close to a flat cathode material and a high voltage is applied between the cathode material and the anode to generate a plasma discharge, each pole alternates the magnets in the radial direction. A planar discharge cathode, characterized in that the magnet is arranged in a double spiral shape with a predetermined interval, and a rotation drive device is connected to the magnet to rotate the magnet along the cathode material.