JPS6129123A - Wafer supporting device - Google Patents

Abstract

PURPOSE:To reduce treating time when the size of a wafer is altered by providing a plurality of wafer holders which have different containing sizes and the same outer diameter, and inserting one of the holders replaceably between a disk and a clamping ring. CONSTITUTION:When a wafer holder 9 is placed on a supporting ring 24 and a clamping ring 17 is operated by a compression ring 22, a wafer holder 9 is reliably held between a retainer 23 and the ring 24 by the recoiling strength of the spring 22. Many holders 9 which have different containing space sizes and the same outer diameter are prepared replaceably. When the wafer 10 is altered in size, only the type of the holder 9 for containing the wafer 10 may be replaced to reduce the treating time when the size of the wafer is altered.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a technology that is particularly effective when applied to wafer support technology, and for example, relates to a technology that is effective when applied to an ion implanter that implants ions into a wafer. be.

[Background technology]

In semiconductor device manufacturing, for example, Sem1conductor World published by Press Journal,
1982.

"High Concentration Neon Injection Technology" by Ito in May issue, pp. 30-36, published by Press Journal.

Sem1conductorvorld, 1982.
8. Wafer (
Ion implantation equipment has been developed as a technique for doping impurities into the main surface of semiconductor thin plates with high precision.

By the way, in a large current type ion implanter, the wafer is attached to a rotating disk with a wafer holder, etc.
It is attached by R. Since the size of the wafer to be accommodated in this wafer mounting mechanism is fixed, the disk must be replaced each time the size of the wafer changes. The diameter of the disgauge must also be large because it increases the throughput of wafers. Since the disk increases the throughput of wafers, its diameter is large and it is also heavy. For this reason, the work of replacing the disk requires manpower and the setup time (replacement time) of the work becomes long, which is a factor that hinders the reduction of work waste and the improvement of the worker efficiency.

[Purpose of the invention]

An object of the present invention is to provide a wafer support device capable of accommodating wafers of different wafer sizes.

Another object of the present invention is to provide a wafer support device that does not require setup time for starting work due to changes in wafer dimensions.

Another object of the present invention is to provide an ion implantation apparatus in which the operating rate does not decrease even when the wafer size is changed.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the wafer is housed in a wafer holder consisting of a support holder and a ring-shaped lid holder, and in this state is clamped between the disk of the ion implanter and the clamp ring attached to the main surface of this disk. In addition, there are various wafer holders that have the same outer diameter but different dimensions for the wafer-accommodating part, so if the wafer dimensions change, the wafer holder cannot be used. All you have to do is replace the wafer holder, and there is no need to replace the heavy disks as in the past. Therefore, according to the present invention, even if the dimensions of the wafer to be processed change, there is no need for setup work prior to starting work, and an improvement in the operating rate of the ion implantation apparatus can be achieved.

〔Example〕

FIG. 1 is a sectional view showing the main parts of a wafer support device in an ion implantation apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing a wafer holder in the wafer support device, and FIG. FIG. 4 is a schematic diagram showing an outline of the injection device, and a cross-sectional view showing a wafer holder having a small wafer storage portion.

This embodiment shows an example in which the present invention is applied to an ion implanter. As shown in FIG. 3, the ion implantation apparatus consists of a main body 1 and a door 3, which is attached to a part of the main body 1 and rotates around a support shaft 2 to open and close.

The door 3 includes a disc-shaped door main body 4 and a disc-shaped disc 6 fixed to a rotating shaft 5 attached to the main body 4. Further, the disk 6 includes a disc-shaped disk 6 fixed to the rotating shaft 5. Also,
The disk 1 is rotated by a motor 7 connected to the rotating shaft 5. Further, a plurality of wafer support devices 8 are disposed on the disk 6 in a ring-shaped area on its main surface. A wafer holder 9, which will be described later, is inserted into and held in this wafer support device 8. Further, a wafer 10 is housed in the wafer holder 9.

Further, when the door 3 is closed to close the opening of the main body 1, a target chamber 11 is formed.

On the other hand, the main body 1 includes an ion source 14 that is controlled by a high voltage power source 12 and emits an ion beam 13. The ion beam 13 emitted from the ion source 14 is selectively separated into only predetermined ions by the mass spectrometry electromagnet 15, passes through the slit 16, and is irradiated onto the main surface of the wafer 10 located in the target chamber 11. At this time, the ion beam 13 is configured to reciprocate in the radial direction of the disk 6 by scanning the magnetic field;
The disk 6 rotates at high speed (for example, 101,000
rp, the wafer 10 held by the wafer support device 8 of the disk 6 is uniformly doped with desired impurities.

Next, the wafer support device 8 will be explained using FIG. 1 and FIG. 2. As shown in FIG. 1, the wafer support device 8 includes a clamp ring 17 attached to the disk 6, and a pusher mechanism 18 that moves the clamp ring 17 toward or away from the main surface of the disk 6. It consists of The clamp ring 1
7 has a ring shape and is larger than the maximum dimension of the wafer to be processed. This clamp ring 17 is inserted so as to rest on the large diameter portion of a stepped circular hole 19 provided on the main surface of the disk 6. Several guide pins 20 are attached to the lower surface of this clamp ring 17. This guide pin 20 is inserted into a guide hole bored in the disk 6, and its tip protrudes from the lower surface of the disk 6.

Further, the tip of each guide pin 20 is fixed to a controlled plate 21. A compression spring 22 is inserted into a portion of the guide pin 20 located between the controlled plate 21 and the disk 6. As a result, the clamp ring 17 is always inserted into the circular hole 19. Furthermore, a protruding pressing portion 23 is provided on the inner periphery of the clamp ring 17 for pressing the peripheral portion of the wafer holder 9 inserted into the circular hole 19.

On the other hand, a thin support ring 24 is provided at the stepped portion of the circular hole 19 to support the wafer holder 9 so that the wafer holder 9 does not fall out of the circular hole 19. When the clamp ring 17 is close to the disk 6, a gap narrower than the thickness of the peripheral portion of the wafer holder 9 is formed between the holding portion 23 of the clamp ring 17 and the support ring 24. therefore,
When the wafer holder 9 is placed on the support ring 24 and the clamp ring 17 is operated by the compression spring 22, the wafer holder 9 is reliably held between the holding part 23 and the support ring 24 by the restoring force of the compression spring 22. It has become.

On the other hand, pusher mechanisms 18 are disposed in portions of the door body 4 corresponding to the controlled plates 21, respectively. The pusher mechanism 18 is made up of, for example, a pneumatic cylinder 25, with the tip of a rod 26 of the pneumatic cylinder 25 facing the central portion of the controlled plate 21. When the pneumatic cylinder 25 is driven, the rod 26 projects toward the controlled plate 21 and pushes the controlled plate 21. As a result, the clamp ring 17 separates from the disk 6, and a gap opens between the flat main surface of the disk 6 and the bottom surface of the clamp ring 17, as shown in the first example, and the wafer holder 9 to circular hole 1゜l, g: o -
5 years old, okay. -, It's like □61. Furthermore, when the pneumatic cylinder 25 stops driving, the compression spring 22 acts to move closer to the clamp ring disk 6. At this time, the rod 2
6 is pushed back by the controlled plate 21.

The wafer holder 9 includes a disk-shaped support holder 27 that is slightly larger than the maximum dimension of the wafer 10 to be ion-implanted;
It consists of a ring-shaped lid holder 28 which is stacked on the main surface side of the support holder 27.

Further, a positioning pin 29 is provided on the main surface of the support holder 27.
are arranged on the same circumference. These positioning pins 2
Reference numeral 9 serves as a guide for positioning the wafer 10. Further, the wafer 10 is held by vacuum tweezers or the like and placed on the main surface of the support holder 27, but at that time, the positioning pins 29 are
9 is provided unevenly on a semicircle. On the other hand, the lid holder 28 has a hole 30 into which the positioning pin 29 is inserted.
is provided. Therefore, if the lid holder 28 is stacked on the support holder 27 so that the positioning pin 29 is inserted into the hole 30, the support holder 27 and the lid holder 28 will be automatically inserted.
The wafers 10 also overlap concentrically and circularly. Also, the fourth
As shown in the figure, the back side of the lid holder 28 has a recess corresponding to the thickness and outer diameter of the wafer 10, that is,
A housing space (accommodating portion) 31 is provided. Therefore, even if the wafer 10 is sandwiched between the support holder 27 and the lid holder 28, no external force is directly applied to the wafer 10, so that the wafer 10 is not damaged. Further, the outer peripheral portion of the upper surface of the lid holder 28 is thinned in a stepped manner. Since the outer diameter of the stepped inner portion of the lid holder 28 is slightly smaller than the inner diameter of the support ring 24,
When the disk 6 rotates at high speed, the stepped inner portion of the lid holder 28 contacts and is supported by the inner peripheral surface of the support ring 24, so that the movement of the wafer holder 9 is stopped and stabilized.

Although the drawings show the wafer holder 9 (see FIG. 1) with a large accommodation space 31 and the wafer holder 9 (see FIG. 4) with a small accommodation space 31, in reality, the dimensions of the accommodation space 31 are 6 In such an ion implantation apparatus, a large number of wafer holders 9 with different sizes are prepared, and when the dimensions of the wafer 10 to be ion implanted change,
It is only necessary to replace the
It is no longer necessary to replace the disk 6, which weighs 30 kg and cannot be replaced by one person, and the setup time before starting work is significantly reduced (previously, setup time was required to be over 4 hours). .

〔effect〕

1. In the ion implantation apparatus of the present invention, the wafer 10 is held by a wafer holder 9 and attached to each wafer support device 8 of the disk 6, and a plurality of types of wafer holders 9 that match the wafer size are prepared in advance. Therefore, when changing the wafer size, it is only necessary to change the type of wafer holder 9 that accommodates the wafer 10, and the setup time associated with changing the wafer size can be significantly reduced, and throughput can be improved by improving the operating rate of the equipment. is obtained.

2. From 1 above, the wafer size can be changed easily without having to take into account the setup time associated with changing the wafer size, and the processing performance can be improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, even if the accommodation space 31 provided in the lid holder 28 of the wafer holder 9 is provided in the support holder 27, the same effect as in the embodiment described above can be obtained.

[Application field]

The above explanation has mainly focused on the case where the invention made by the present inventor is applied to ion implantation technology, which is the background application field, but is not limited to this, and various processing technologies for batch processing wafers. The present invention is applicable to at least batch processing techniques for articles such as wafers.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing essential parts of a wafer support device in an ion implantation apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing a wafer holder in the wafer support device, and FIG. 3 is the same. FIG. 4 is a schematic diagram showing an overview of the ion implantation apparatus. FIG. 4 is a cross-sectional view showing a wafer holder having a small wafer storage area. 1...Main body, 2...Spindle, 3...Door, 4...
Door body, 5... Rotating shaft, 6... Disk, 7...
- Motor, 8... Wafer support device, 9... Wafer holder, 10... Wafer, 11... Target chamber, 1
2...High voltage power supply, 13...Ion beam, 14...
・Ion source, 15...Electromagnet for mass spectrometry, 16.
...Slit, 17...Clamp ring, 18...
Pusher mechanism, 19... Circular hole, 20... Guide pin, 21... Controlled plate, 22... Compression spring, 23
... Holding part, 24... Support ring, 25... Pneumatic cylinder, 26... Rod, 27... Support holder, 28... Lid holder, 29... Positioning pin, 30...
... Hole, 31... Accommodation space. Figure 1 Figure 2 Diagram

Claims (1)

[Claims] 1. Consisting of a disk and a grapple ring attached to the main surface of the disk so as to be able to control separation and approach,
A wafer support device having a structure in which a wafer is held between the disk and a clamp ring, and this device has a plurality of wafer holders each having a different accommodating part size and the same outer diameter size, and has a plurality of wafer holders that have different accommodating portion dimensions and the same outer diameter size, and has a structure in which a wafer is held between the disk and the grand prize. 1. A wafer support device characterized in that one of the devices is configured to be replaceably inserted between the wafer support device and the wafer support device.