JPS6129105B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an electrical connector for mounting a multi-pin chip carrier package equipped with an LSI or very LSI on a printed circuit board, and is also suitable for mounting multi-contact sealed switches (SMM switches). It is compatible.

Conventionally, electrical connectors for chip carrier packages with multiple pins have been designed to make contact with the package terminals.
The release is performed using a slide lever or a rotary lever. However, such an electrical connector inevitably has a larger size and a more complicated structure due to the slide lever mechanism. Also,
It is difficult to support extremely high-pin packages with over 1000 terminals. In order to deal with this, it is possible to use liquid metal for LSI mounting packages with a large number of pins, but in this case, it is easy to scatter or fall off from the storage part due to impact force.
It is extremely difficult to maintain stable contact due to instantaneous resonance interruptions due to vibrations and deviation due to mounting position.

This invention was made to solve the above-mentioned problems, and it involves disposing a low melting point metal between the contact members and changing the low melting point metal from a solid state to a liquid state or from a liquid state to a solid state using electrical or physical thermal energy. By changing this, highly reliable insertion/extraction can be performed with a small applied force, and a compact electrical connector with a simple structure is provided.

The electrical connector of the present invention includes an insulating substrate having a large number of first through holes, a heating element printed and arranged on the insulating substrate, and a second through hole at a position corresponding to the first through hole. an insulating base joined to the upper surface of the insulating substrate, a low melting point metal stored in the second through hole, and a conductive contact fitted in the first through hole and in contact with the low melting point metal. The rod-shaped conductive member inserted into the second through hole and the conductive contact member are connected via the low melting point metal heated by the heating element.

Embodiments of the present invention will be described below with reference to the drawings.

1, 2 and 3 show a first embodiment of an electrical connector according to the invention. Referring to each figure, the electrical connector of this embodiment has a plurality of through holes 1a formed in a matrix, a heating element 2 meanderingly printed on the main surface, and lead-out terminals 2a, 2b of the heating element. Ceramic substrate 1 made by planting
A wood metal 5, which is a type of low-melting point metal, is installed in the cylindrical portion 4a that receives the pin terminal, and a contact 4 is fitted into the through hole 1a of the ceramic substrate 1.
A plurality of holes 6a for introducing pin terminals 8a of this package into a wall surface on which an LSI mounting package 8, which will be described later, is placed, and a lead-out terminal 2 of the heating element 2.
A housing 6 made of plastic is provided with outlet holes 6b of holes 6a and 2b. As shown in FIG. 1, the ceramic substrate 1 with the contacts 4 fitted thereon is fitted into the housing 6 from the direction of arrow A. Furthermore, an LSI mounting package 8 is placed on the electrical connector 7 configured in this manner from the direction of arrow B. In this case, when electricity is applied between the lead terminals 2a and 2b, the heating element 2 generates heat, raising the ambient temperature, and when the heat energy reaches the melting point of the wood metal 5, which is 68°C or higher, the wood metal 5 is heated to the cylinder at one end of the contact 4. Changes from solid to liquid state in the shaped part 4a
The pin terminal 8a of the LSI mounted package cage 8 can be inserted with low insertion force. After mounting, when the power supply to the lead terminals 2a and 2b is stopped, the heat generated from the heating element 2 decreases to below the melting point of the wood metal 5, and the pin terminal 8a and the contact 4 are connected via the wood metal 5.
The components of the wood metal 5 are bismuth Bi, cadmium Cd, lead, Pb, and tin Sn, and by treating the surfaces of the contact 4 and the pin terminal 8a with this wood metal and a metal with good wettability, the contact can be made more stable. can.

Further, when the LSI mounting package 8 becomes defective, the lead terminals 2a and 2b are energized to change the wood metal 5 from a solid state to a liquid state again, and removal work is performed. Furthermore, when the LSI mounted package 8 is used for testing, the pin terminals 8a and the wood metal 5 may be surface-treated to prevent them from getting wet, or a low melting point metal may be used to enable multiple insertions and removals.

FIGS. 4A and 4B show a second embodiment. Each of these electrical connectors has a number of through holes 31.
Two ceramic substrates 3 having 1 and 312
1 and 32 are joined by baking. Heating element 3
3 is printed and arranged on the substrate 32. contact 3
4 and wood metal 35 are through holes 31 of both boards.
1 and 312. FIG. 4C shows a third embodiment, in which the upper opening area of the through hole 311a of the board 31a that accommodates the wood metal 35 is narrowed to suppress the wood metal 35 from being taken out of the through hole when inserting and removing the terminal. It is something.

In each of the above embodiments, the two insulating substrates and the printed heating element are integrally molded, so that the electrical connector can be made very thin. Moreover, manufacturing is easy and costs can be reduced. Furthermore, since the heating element is arranged by printing, its thickness and width can be arbitrary, and precise patterns can also be arranged, so that the mounting density of the terminals can be increased.

As explained above, according to the present invention, since the contact state is formed through a low-melting point metal that easily melts when heated, a highly reliable connection can be made with a small insertion/extraction force, and the structure is A simple, small, thin and low cost electrical connector can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional perspective view showing a first embodiment of the present invention, FIGS. 2 and 3 are perspective views showing a substrate 1 and a contactor 4 in FIG. 1, and FIG.
Figures A and B are a perspective view and a sectional view showing a second embodiment of the invention, respectively, and Figure 4C is a sectional view showing a third embodiment of the invention. 1, 31, 31a, 32...ceramic substrate,
2, 33...Heating element, 2a, 2b...Output terminal,
4, 34... Contact, 5, 35... Wood metal, 6... Housing, 1a, 6a, 311, 3
11a, 322...Through hole.

Claims (1)

[Claims] 1. An insulating substrate having a large number of first through holes, a heating element printed and arranged on the insulating substrate, and a top surface of the insulating substrate having a second through hole at a position corresponding to the first through hole. an insulating base joined to the second through hole, a low melting point metal stored in the second through hole, and a conductive contact member fitted in the first through hole and in contact with the low melting point metal; An electrical connector characterized in that a rod-shaped conductive member inserted into the second through hole and the conductive contact member are connected via the low melting point metal heated by the heating element.