JPS6127915B2 - - Google Patents
Info
- Publication number
- JPS6127915B2 JPS6127915B2 JP2503180A JP2503180A JPS6127915B2 JP S6127915 B2 JPS6127915 B2 JP S6127915B2 JP 2503180 A JP2503180 A JP 2503180A JP 2503180 A JP2503180 A JP 2503180A JP S6127915 B2 JPS6127915 B2 JP S6127915B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- hollow pipe
- liquid
- cooling medium
- liquid storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000002826 coolant Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 5
- 238000003860 storage Methods 0.000 description 21
- 239000004020 conductor Substances 0.000 description 11
- 239000012071 phase Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2503180A JPS56122152A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2503180A JPS56122152A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56122152A JPS56122152A (en) | 1981-09-25 |
| JPS6127915B2 true JPS6127915B2 (da) | 1986-06-27 |
Family
ID=12154536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2503180A Granted JPS56122152A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56122152A (da) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3307703A1 (de) * | 1983-03-04 | 1984-09-06 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente |
| US4982274A (en) * | 1988-12-14 | 1991-01-01 | The Furukawa Electric Co., Ltd. | Heat pipe type cooling apparatus for semiconductor |
| US5229915A (en) * | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
-
1980
- 1980-02-28 JP JP2503180A patent/JPS56122152A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56122152A (en) | 1981-09-25 |
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