JPS61279148A - Semiconductor-wafer positioning apparatus - Google Patents

Abstract

PURPOSE:To perform highly accurate positioning, by pushing the outer periphery of a wafer, which is mounted on a fixed receiving member, with positioning pins, which are protruded on movable receiving bodies, toward the center, and performing position alignment. CONSTITUTION:Each link 16 is provided in a radial attitude in the direction of the radius so that a wafer 1 having the largest outer diameter is placed between positioning pins 19. A turning link body 15 is turned into a standby state so that each movable receiving body 14 comes to the most backed position. Then, the wafer 1 is mounted on the upper surface of a fixed receiving member 11 and on the upper surface of each movable receiving body 14. The turning link body 15 is turned by the turning angle, which is programmed by a control device, in the specified direction by a turning and driving means 20. Then, each positioning pin 19 advances toward the center to the set position. The outer periphery of the wafer 1 is pushed and the wafer is positioned.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a positioning device for semiconductor wafers used in the process of manufacturing semiconductor wafers.

[Conventional technology]

FIG. 4 and FIG.
1 is a plan view and a front view of a conventional semiconductor wafer positioning device disclosed in Publication No. 0. FIG. In the figure, 1 is a semiconductor wafer (hereinafter referred to as "wafer"), 2 is a rotary table that adsorbs and rotates the wafer 1, and 3 is a moving table that supports this rotary table and adjusts its movement in the X-axis and Y-axis directions. , 4 are two sensors that detect the position of the outer periphery of the wafer l on the rotary table 2 in a non-contact manner.

The operation of the above conventional device is as follows. Two sensors 4 detect the outer circumferential position of the wafer 1 sucked onto the rotary table z, and the movable table 3 is moved and adjusted so that the outer circumference of the wafer 1 passes through two fixed points.

[Problem that the invention seeks to solve]

The conventional wafer positioning apparatus as described above has a problem in that when the outer diameter of the wafer 1 differs, it is necessary to change and reset the position of the sensor 4 each time. In addition, the wafer 1 is very thin, and the sensor 4 detects its position relative to the outer periphery of the thin wafer, but the current sensor 4 has low detection accuracy, making it difficult to perform high-precision positioning. .

This invention was made in order to solve the above problems, and aims to provide a wafer positioning device that can reliably and highly accurately center the wafer even if the outer diameter of the wafer differs. [Means for solving the problem] The wafer positioning device according to the present invention has a plurality of guide rods fixed radially to a fixed receiving member at a central position, and a movable receiving member is attached to each of these guide rods. A rotary coupling body is rotatably supported on the fixed support member, and the rotary coupling body is rotated by a rotary drive means, and each of the movable receivers is connected by a link. The wafer is connected to the rotary coupling body so as to be moved toward the center, and a positioning pin is protruded from the rear of the upper surface of each movable receiver. The wafer is placed on the wafer and each positioning pin is used to position the wafer by pushing the outer periphery toward the center.

[Effect]

In this invention, a wafer is placed across the top surface of the fixed receiving member and the top surface of each movable receiving member, and the rotating coupling body is rotated in a predetermined direction by the rotational driving means to move each movable receiving member toward the center. Position the wafer by pushing the outer periphery of the wafer toward the center using each positioning pin.

〔Example〕

1 and 2 are a plan view and a front sectional view of a wafer positioning apparatus according to an embodiment of the present invention. In the figure, reference numeral 11 denotes a fixed receiving member having a center portion and receiving the wafer 1 on the upper surface of the head, and the lower part of the cylindrical portion is fitted into the support table 12 and fixedly supported. Reference numeral 13 indicates a plurality of guide rods fixed radially at equal intervals around the head side of the fixed receiving member 11, reference numeral 14 indicates a plurality of movable receivers supported by these guide rods 13 so as to be movable in the axial direction, and reference numeral 15 indicates a plurality of movable receivers. A rotating coupling body having a cylindrical shape and rotatably supported in the middle of the columnar part under the head of the fixed receiving member 11, and provided with seven rank parts 15a; 16 is each movable receiving member 14;
A plurality of links 19 each have one end connected to each via a connecting pin 17 and the other end connected to the flange portion 15a of the rotary connection 15 through the connecting pin 19, protruding from the rear of the upper surface of each movable receiver 14. It is a rotation driving means for rotating a plurality of fixed positioners, and is configured as follows.

Reference numeral 21 denotes a drive motor attached to the support base 12, and a belt 23 made of a timing belt or the like is hung between it and the rotary coupling body 15 to transmit rotation. , as follows.0 First, as shown in the plan view in FIG. The rotary coupling body 1 is moved so that it takes a radial position in the radial direction and each movable receiver 14 is in the most retracted position.
Turn 5 into a standby state. Next, w/%
1 is placed across the upper surface of the fixed receiving member 11 and the upper surface of each movable receiving member 14. When the rotation drive means 20 rotates the rotation coupling body 15 in a predetermined direction by a rotation angle programmed in a control device (not shown), each positioning pin 19 moves toward the center to a set position. Move forward and push the outer circumference of the wafer 1 to position it.

In this way, the state shown in FIG. 1 is reached.

In the above embodiment, the drive motor 21 uses the belt 23 as the rotation driving means for the rotation coupling body 15.
The rotary coupling body may be rotated gently in a predetermined direction using a spiral spring or the like, and after the positioning is completed, it may be rotated back in the opposite direction using an open return means such as an electromagnetic device or an air cylinder.

〔Effect of the invention〕

As described above, according to the present invention, the guide rods are fixed radially to the fixed receiving member, the movable receiving members are respectively supported on these guide rods so as to move toward the center, and the movable receivers are mounted on the upper surface of the fixed receiving member. Since the outer periphery of the wafer is aligned with the center using positioning pins protruding from each movable receiver, highly accurate alignment can be obtained, the equipment can be made inexpensive, and the outer diameter of the wafer can be adjusted. Even if the position changes, the position can be easily aligned.

[Brief explanation of drawings]

1 and 2 are a plan view and a front sectional view showing a wafer positioning device according to an embodiment of the present invention, and FIG. 3 is a plan view showing the device in FIG. 1 in a standby state before wafer positioning; FIGS. 4 and 5 are a plan view and a front view of a conventional wafer positioning device. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 11... Fixed receiving member, 13
...Guide rod, 14.. Movable receiver, 15.. Rotating connection body, 16.. Link, 19.. Positioning pin, 19
a...Buffer elastic body, 20...Rotation drive means, 21.
. . . Drive motor, 22 . . . Belt pulley, 23 .

Claims (4)

[Claims] (1) A fixed receiving member that places the center of the semiconductor wafer on the top surface of the head, a plurality of guide rods fixed radially around the side of the head of this fixed receiving member, and supported by these guide rods so as to be movable in the axial direction. a plurality of movable receivers on which the outer periphery of the semiconductor wafer is placed on the front part of the upper surface; positioning pins protruding and fixed to the rear part of the upper surface of these movable receivers; and a cylindrical part under the head of the fixed receiver member. a rotary connecting body rotatably supported by a rotary connector, a plurality of links connecting each of the movable receivers to the rotary connector, and each of the movable receivers by rotating the rotary connector. is moved toward the center via the link, and includes a rotational drive means for pressing and positioning the outer periphery of the semiconductor wafer with each positioning pin. (2) The rotation drive means is a drive motor that rotates by a set predetermined angle, and a belt means that is interposed between the rotation shaft of the drive motor and the rotation coupling body and transmits the rotation to the rotation coupling body. A semiconductor wafer positioning device according to claim 1, comprising: (3) The rotation driving means includes a spring member that rotates the rotation coupling body in a predetermined direction, and a spring member that rotates the rotation coupling body in the opposite direction against the spring pressure of the spring member, and rotates the rotation coupling body in the opposite direction to each movable receiver. 2. The semiconductor wafer positioning device according to claim 1, further comprising an opening/returning means for moving the body outward and returning the body. (4) The semiconductor wafer positioning device according to any one of claims 1 to 3, wherein the protruding head of the positioning pin is covered with a cushioning elastic material.