JPS6127901B2 - - Google Patents

Info

Publication number
JPS6127901B2
JPS6127901B2 JP7057380A JP7057380A JPS6127901B2 JP S6127901 B2 JPS6127901 B2 JP S6127901B2 JP 7057380 A JP7057380 A JP 7057380A JP 7057380 A JP7057380 A JP 7057380A JP S6127901 B2 JPS6127901 B2 JP S6127901B2
Authority
JP
Japan
Prior art keywords
main electrode
electrode plate
cathode
main
pressure contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7057380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56167353A (en
Inventor
Yuzuru Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7057380A priority Critical patent/JPS56167353A/ja
Publication of JPS56167353A publication Critical patent/JPS56167353A/ja
Publication of JPS6127901B2 publication Critical patent/JPS6127901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP7057380A 1980-05-26 1980-05-26 Pressure-welding type semiconductor device Granted JPS56167353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7057380A JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7057380A JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Publications (2)

Publication Number Publication Date
JPS56167353A JPS56167353A (en) 1981-12-23
JPS6127901B2 true JPS6127901B2 (enrdf_load_html_response) 1986-06-27

Family

ID=13435423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7057380A Granted JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Country Status (1)

Country Link
JP (1) JPS56167353A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258372A (ja) * 2006-03-22 2007-10-04 Toyota Central Res & Dev Lab Inc 半導体装置
KR20210097738A (ko) * 2018-11-27 2021-08-09 아체트엘 아헨 게엠베하 평판 재료의 압축 가공 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452261B1 (en) * 1997-03-26 2002-09-17 Hitachi, Ltd. Flat semiconductor device and power converter employing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258372A (ja) * 2006-03-22 2007-10-04 Toyota Central Res & Dev Lab Inc 半導体装置
KR20210097738A (ko) * 2018-11-27 2021-08-09 아체트엘 아헨 게엠베하 평판 재료의 압축 가공 장치

Also Published As

Publication number Publication date
JPS56167353A (en) 1981-12-23

Similar Documents

Publication Publication Date Title
US5278434A (en) Pressure engagement structure for a full press-pack type semiconductor device
US3437887A (en) Flat package encapsulation of electrical devices
US2897419A (en) Semiconductor diode
US3736474A (en) Solderless semiconductor devices
EP0428044B1 (en) High power semiconductor device having a housing
JPH0263300B2 (enrdf_load_html_response)
EP0159797A2 (en) Thyristor device and process for producing it
US4673961A (en) Pressurized contact type double gate static induction thyristor
US3476986A (en) Pressure contact semiconductor devices
US3599057A (en) Semiconductor device with a resilient lead construction
US3310716A (en) Connecting device for consolidating the housing of a semiconductor device
EP0067575B1 (en) Power semiconductor device
US3581163A (en) High-current semiconductor rectifier assemblies
EP0158749A1 (en) Semiconducteur device having pressure loaded members
US3450962A (en) Pressure electrical contact assembly for a semiconductor device
US4881118A (en) Semiconductor device
US3337781A (en) Encapsulation means for a semiconductor device
JPS6127901B2 (enrdf_load_html_response)
US3280383A (en) Electronic semiconductor device
US3217213A (en) Semiconductor diode construction with heat dissipating housing
US3513361A (en) Flat package electrical device
US3452254A (en) Pressure assembled semiconductor device using massive flexibly mounted terminals
EP0324929B1 (en) Pressure connection type semiconductor device
US5796123A (en) Semiconductor component mounted by brazing
US3536966A (en) Semiconductor device having an electrode with a laterally extending channel formed therein