JPS6127656U

JPS6127656U - polishing equipment

Info

Publication number: JPS6127656U
Application number: JP11367484U
Authority: JP
Inventors: 輝夫渡辺; 茂糟屋
Original assignee: 大同特殊鋼株式会社
Priority date: 1984-07-26
Filing date: 1984-07-26
Publication date: 1986-02-19

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１区〜第２図は本考案の一実施例を示すものであり、
第１図は一部切欠き正面図、第２図はワイヤブラシを省
いた平面図、第３図は本考案の研摩装置が組み込まれる
製造工程図、第４図は研摩後の母材帯の部分平面図、第
５図は得られたクラツド帯の部分平面図、第６図は組立
てられたＩＣリードフレームの一部切欠き平面図、第７
図は従来例における研摩後の母材帯の部分平面図、第８
図は従来のクラッド帯の部分平面図、第９図は従来の組
立てられたＩＣリードフレームの正断面図である。図中、１０・・・研摩装置、１３・・・マスキング板、
１３Ａ・・・間隙、１７・・・ワイヤブラシ、１・・・
クラツド母材帯。Section 1 to Figure 2 show one embodiment of the present invention,
Figure 1 is a partially cutaway front view, Figure 2 is a plan view with the wire brush removed, Figure 3 is a manufacturing process diagram in which the polishing device of the present invention is incorporated, and Figure 4 is a diagram of the base material band after polishing. FIG. 5 is a partial plan view of the obtained cladding band; FIG. 6 is a partially cutaway plan view of the assembled IC lead frame; FIG.
The figure is a partial plan view of the base material band after polishing in the conventional example.
The figure is a partial plan view of a conventional cladding band, and FIG. 9 is a front sectional view of a conventional assembled IC lead frame. In the figure, 10... polishing device, 13... masking plate,
13A...Gap, 17...Wire brush, 1...
Crutted base material zone.

Claims

[Scope of utility model registration request]

A polishing device used in partial polishing of metal, comprising a masking plate that covers the parts that do not require polishing, and a polishing means that exposes the parts not covered by the masking plate.