JPS61275880A - Electrode connection structural body for flat type display unit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flat panel display device such as a liquid crystal display device, a plasma display device, or an EL display device. Film key 1 equipped with a semiconductor device for driving the group and display device
This relates to an electrode connection structure for connecting the 1st A7 input (11 force electrode group).Hereinafter, the first electrode group will be referred to as the external lead-out electrode group and the second electrode group will be referred to as the input electrode group. .

Conventional Technology In order to drive a flat panel display device, it is necessary to connect the external lead-out electrode group and input electrode group of the display device to the input/output electrode group of the driving semiconductor device, and several methods have been adopted for this purpose. It is being As for the structure of the connection part, a driving semiconductor device is mounted on a circuit board on which an input electrode group and an output electrode group are formed, and the output electrode group and the external lead-out electrode of the display aA@ are connected. Soldering is the most commonly used method for mounting semiconductor devices on circuit boards. For example, as shown in FIG.
The output electrode group formed at the end of the circuit board 2, in which a plurality of circuit boards are mounted on the same substrate, and the external lead-out electrode group 4 of the display device 3 are formed so as to face each other, and a conductive part is used to connect them. And the non-conductive parts are arranged in a grid! , : There is a method in which the anisotropic conductive rubber 5 is sandwiched between electrodes and pressed together. Also, as shown in Figure 3,
Using the flexible circuit board 6 for connection, the output electrode group of the circuit board 2 and the external lead-out electrode group 4 of the display device 3 are thermally fused using solder or the like on the flexible circuit board 6 for connection. There is a method in which heating is performed using a hexagonal conductive film sheet formed with an adhesive and conductive dispersion ports G, -, J. In another example, as shown in FIG. 4, the driving semiconductor device 1 is mounted on the - side of the flexible circuit board 7, and the output electrode group and the external lead electrode of the display device 3 are formed at one end thereof. There is a method of connecting group 4 using the method described above. 8 is film-+: II rear (
There is.

Solved by the invention 1] Problems to be solved In these conventional methods, the structure of the connection part 13 is that the display device and the semiconductor device are mounted on the board I, 2 and ii'8 are separate, and the number of connection points is reduced. [Many] 1st grade is also higher. Regarding the connection method, the H method using anisotropic conductive rubber has a high contact resistance (several 100 points or more), resulting in low electrical loss. The thermal fusion method using semi-111 requires processing steps (plating, vapor deposition, etc.) for the electrode surface of the display device, which not only complicates the culm but also makes it possible to use only a limited number of electrode materials. -The part b with the turtle connection cannot be replaced. In addition, since the anisotropic electronic film uses resin as an adhesive, it has poor heat resistance (11) and poor temperature resistance, resulting in a sharp decrease in reliability. However, since the film serving as the base material of the flexible +11 circuit board 4 substrate undergoes heat shrinkage, a pitch shift occurs when used for the autumn pitch, large screen display 541i1.

The present invention solves these problems by making the c1 mounting body compact, and also by making the connection part highly reliable.
The object of the present invention is to provide an electrode connection structure that can realize the following.

Means for Solving the Problem In order to solve this problem, the invention is derived from the 11th picture of the present invention. An electrode group is formed on the Ic5p plate type display device, and a semiconductor device is mounted and cut to a predetermined size.
and a first filler group having leads at positions corresponding to and covering the second electrode group, a connection frame body having a cushion material near the first and second electrode groups, and a flat panel display device. It consists of a supporting frame for connecting and fixing the connecting frame at the portion where the cushioning material is arranged, and the film 4 - the spear 17! IY is installed on the flat display [on the plane on which the first electrode group and the second electrode group are arranged,
ht1 - One end of the side lead is in contact with the first electrode group, the other end is in contact with the cushioning material, one end of the lead on the other side is in contact with the second electrode group, and the other end is in contact with the second electrode group. This is the part b that touches the cushion H.

Function: With this configuration, two electrode groups are formed in the display device, and the semiconductor device is also mounted on the display device-1, so the number of parts is reduced and the display device is compact. Furthermore, since the connection is made by mechanical pressing force, reliability is high and the process is simplified.

EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.

In FIG. 1, an external lead-out electrode group 12 and a manual electrode group 13 including a signal circuit pattern are formed on the back surface of a flat panel display device 11 and are led out from picture elements. A cushioning material 15 is fixed near the external lead-out electrode group 12 and the input electrode group 13.

The film carrier 17 on which the semiconductor device 16 is mounted and cut to a predetermined size is installed in a flat display device @ 11F, and one side of the glue board 18 on one side is in contact with the external lead-out electrode group 12.
One surface of the lead 19 on the other side is in contact with the input electrode group 13,
The other side of both leads 18 and 19 is in contact with the opposing sliding cushion (415), and the flat display side 11 is in contact with the connecting frame 14.
; L #i21 From the opposite side, the portion where the cushioning material 15 is arranged is pressed against and fixed to the support frame 2 (). 21 has a cover.

Next, we will explain six specific examples.As an i-type display device, the pitch is 0.3211111 r scanning electrode 256
It has an external lead-out electrode group of 1024 No. 1h electrodes, and has an input electrode group including a 1jl circuit turn for supplying control signals such as the same board 1 to 1. [
This will be explained in the case of an L display. The electrode material is Or or I-T'('')C.The connection frame and support frame were made by AQ.F1 of the connection frame
A groove was made in the connection part with the display, and Bai1hen [Turado 2+11111φ] was inserted as a cushioning material. The rear of film 1-11 is made of polyimide film-1 with a copper foil pattern formed and tinned)'-
Alternatively, the electrode 13- of the semiconductor device forms a bump having a structure of Ti-1]d-AU, and the electrode 13- of the semiconductor device is formed by a bump having a structure of Ti-1]d-AU, and Noil 11 carrier A7 and Al1-3n or Δ+1-A 1.1. Connected with alloy and cut to specified size. This film YA' 40flXl
(5L, 8 on the scanning side, 32 on the signal side) are placed in alignment with the external lead-out electrode group and the input electrode group at 8 to 10 places on the flat panel display, and the lead group and the electrode The support frame and the connection frame were fixed with 11 screws so that the groups were pressed against each other.

When the display mounted in this way was driven at a driving voltage of 100, it was possible to perform good driving. The connection resistance value at this time is the electrode 44
II to J: High temperature storage at 125℃ at 1Ω or less, 85℃8
Even after 1000 hours of storage at 5% high temperature and high humidity, it remained less than twice the initial value.

In the embodiment, the connection frame and the support frame are fixed using the screw 11, but the frames may be fitted into each other, or a separate fixing jig may be provided.

Although the connection frame and the support frame are described as ΔQIJ, they are not limited to this, and may be Cu or Sue.

It may be made of iron, ceramic, resin, or the like.

Further, as the cushioning material, an elastic material having relatively heat resistance such as silicone rubber can be used.

-〇- 914 inventions! According to the invention, the deck helicopter display device 1 is equipped with a direct II 'F conductor device stand, and the film carrier is mounted. T1 protein 1
- Since there is no need to use the conventional J-Uni flexible circuit board, the number of E is reduced, the number of connection points is also reduced, and low connection I (reliable resistance to E is high) , and low cost [・
The electrode connection structure is made of real IJ5.

[Brief explanation of drawings]

Figure 1 does not show an example of Mokubimei, and Figures 2-
FIG. 4 is a perspective view showing different conventional examples. 11... Middle plate type display mounting, 12... External lead-out electrode 1
1Y, 13... Input electrode group, 14... Connection frame,
15... Rinsion Shrine, 16... Semiconductor Equipment Iwakari,
17...) f Rumukitosu A7.18゜19...Lee
1:, 20...Support frame member Hiroshi Mori Figure 2 Figure J

Claims (1)

[Claims] 1. A flat panel display device in which a first electrode group derived from a picture element and a second electrode group disposed on the same plane opposite thereto are formed, and a semiconductor device is mounted on the flat panel display device and a predetermined size is provided. a film carrier group having leads on at least two sides at positions corresponding to the first and second electrode groups of the flat panel display; and a cushion material near the first and second electrode groups. a support frame for coupling and fixing the flat display device and the connection frame body at the portion where the cushioning material is arranged, and the film carrier group 1st and 2nd
one end of the lead on the one side is in contact with the first electrode group, the other end is in contact with the cushioning material, and one end of the lead on the other side is in contact with the first electrode group. An electrode connection structure for a flat panel display device that is in contact with the second electrode group and has the other end in contact with the cushioning material.