JPS61274932A - Flexible printed wiring substrate - Google Patents
Flexible printed wiring substrateInfo
- Publication number
- JPS61274932A JPS61274932A JP60118626A JP11862685A JPS61274932A JP S61274932 A JPS61274932 A JP S61274932A JP 60118626 A JP60118626 A JP 60118626A JP 11862685 A JP11862685 A JP 11862685A JP S61274932 A JPS61274932 A JP S61274932A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed wiring
- polyurethane resin
- wiring board
- resin adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はフレキシブルプリント配線板を作成するための
配線基板に関し、予め支持体に貼合された金属箔をエツ
チング除去してフレキシブルプリント配線板を作成する
のに好適に用い得る配線基板に関するものである。Detailed Description of the Invention (a) Industrial Application Field The present invention relates to a wiring board for producing a flexible printed wiring board, and the present invention relates to a wiring board for producing a flexible printed wiring board, and a flexible printed wiring board is produced by etching away metal foil that has been bonded to a support in advance. The present invention relates to a wiring board that can be suitably used to create a wiring board.
（ロ）従来の技術
従来よりフレキシブルプリント配線板を作成する方法の
一つとして、次に示す如きものがある。(b) Prior Art One of the conventional methods for producing a flexible printed wiring board is as follows.
即ち、フィルム等の支持体と金属箔とをポリウレタン樹
脂接着剤で貼合してフレキシブルプリント配線基板を作
り、その後配線部を残して非配線部の金属箔をエツチン
グ除去してフレキシブルプリント配線板を作成する方法
である。この方法で作成した場合、フレキシブルプリン
ト配線板の非配線部にはポリウレタン樹脂接着剤が露出
している。That is, a flexible printed wiring board is made by laminating a support such as a film and metal foil with a polyurethane resin adhesive, and then the metal foil in the non-wiring area is removed by etching, leaving the wiring area to form the flexible printed wiring board. This is how to create it. When produced using this method, the polyurethane resin adhesive is exposed in the non-wiring portions of the flexible printed wiring board.
ところでポリウレタン樹脂接着剤は、ジイソシアネート
系誘導体や硬化剤であるトリイソシアネート化合物等を
有機溶剤に溶かした接着剤溶液を用い、溶剤の揮発と共
にジイソシアネート系誘導体を硬化させて接着させるも
のであるが、接着硬化後その表面に夕７キネスが残る（
残留タッキネス）という問題がある。この残留タッキネ
スはジイソシアネート系誘導体の末端ＮＧＯ基やトリイ
ソシアネート化合物等のＮＣＯ基が残存しているために
生じると考えられる。By the way, polyurethane resin adhesives use an adhesive solution in which a diisocyanate derivative and a triisocyanate compound, which is a curing agent, are dissolved in an organic solvent, and as the solvent evaporates, the diisocyanate derivative is cured and adhered. After curing, a slight stain remains on the surface (
There is a problem of residual tackiness. This residual tackiness is thought to be caused by the residual terminal NGO groups of diisocyanate derivatives and NCO groups of triisocyanate compounds.
（ハ）発明が解決しようとする問題点
このポリウレタン樹脂接着剤の残留タッキネスのため、
上記の方法で作成したフレキシブルプリント配線板の非
配線部がべとつくという問題があった、この問題のため
、フレキシブルプリント配線板を積み重ねて輸送してい
る間に、配線板同士が付着してしまうという欠点があり
、またこの付着によってフレキシブルプリント配線板の
商品価値は低下するし、更に付着が著しい場合には、そ
れを剥がす際配線部の剥離や配線板自体の破れを惹起す
・るという欠点があった。(c) Problems to be solved by the invention Due to the residual tackiness of this polyurethane resin adhesive,
There was a problem that the non-wiring parts of the flexible printed wiring boards created using the above method were sticky. Because of this problem, the wiring boards stuck to each other while being stacked and transported. This adhesion reduces the commercial value of the flexible printed wiring board, and if the adhesion is severe, the wiring section may peel off or the wiring board itself may be damaged when it is removed. there were.
そこで、本発明はポリウレタン樹脂接着剤にある特定の
物質を添加することにより、上記の欠点を解決せんとす
るものである。Therefore, the present invention attempts to solve the above-mentioned drawbacks by adding a certain specific substance to a polyurethane resin adhesive.
（ニ）問題点を解決するための手段及び作用本発明は、
支持体と金属箔とをポリウレタン樹脂接着剤で貼合した
フレキシブルプリント配線基板において、前記ポリウレ
タン樹脂接着剤中にポリスチレン樹脂を混入せしめたこ
とを特徴とするフレキシブルプリント配線基板に係るも
のである。(d) Means and action for solving the problems The present invention includes:
This invention relates to a flexible printed wiring board in which a support and a metal foil are bonded together with a polyurethane resin adhesive, characterized in that a polystyrene resin is mixed into the polyurethane resin adhesive.
本発明に用いる支持体としては、フィルム、布帛等が採
用され、特に比較的柔軟なものが好ましい。これは自在
に折り曲げることができ、フレキシブルプリント配線板
として好適に使用できるからである。As the support used in the present invention, films, fabrics, etc. are employed, and relatively flexible ones are particularly preferred. This is because it can be bent freely and can be suitably used as a flexible printed wiring board.
支持体に貼合される金属箔としては、銅箔、アルミニウ
ム箔、ニッケル箔等が用いられる。この金属箔は配線部
分となるものであるから、比較的電気伝導度の大きいも
のが好ましい。As the metal foil bonded to the support, copper foil, aluminum foil, nickel foil, etc. are used. Since this metal foil will be used as a wiring portion, it is preferable that the metal foil has relatively high electrical conductivity.
支持体と金属箔とを貼合するため本発明で用いるポリウ
レタン樹脂接着剤は常温又は加熱硬化型のものであって
、溶媒である有機溶剤の揮発と共に硬化の進むものであ
る。有機溶剤としてはブタノール、エタノール等が単独
で又は混合して用いられる。The polyurethane resin adhesive used in the present invention for laminating the support and the metal foil is of a room temperature or heat curing type, and hardens as the organic solvent evaporates. As the organic solvent, butanol, ethanol, etc. may be used alone or in combination.
ポリウレタン樹脂接着剤の原料であるジイソシアネート
系誘導体というのは、主としてジイソシアネートとグリ
コールの重付加反応で生成する、下記のごとき構成単位
を持つ比較的高分子量のものをいう。Diisocyanate derivatives, which are raw materials for polyurethane resin adhesives, are relatively high-molecular-weight derivatives that are produced primarily through polyaddition reactions between diisocyanates and glycols and have the following structural units.
しかしこれに限られず、その他の方法で生成するウレタ
ン結合子ＮＨＣＯＯ＋を持つ比較的高分子量のものも本
発明でいうジイソシアネート系誘導体に含まれる。However, the diisocyanate derivatives referred to in the present invention are not limited to this, and also include those having a relatively high molecular weight and having a urethane bond NHCOO+ produced by other methods.
ポリウレタン樹脂接着剤に混入するポリスチレン樹脂は
、アククチツク重合体でもアイソタクチック重合体でも
よい、ポリスチレン樹脂はポリウレタン樹脂接着剤１０
０重量部に対して０．０５ｊｉｉ量部〜２．０重量部程
度混入する。ポリスチレン樹脂をポリウレタン樹脂接着
剤１００！量部に対して０．０５重量部未満しか混入さ
せない場合にはポリウレタン樹脂接着剤のタッキネスを
防止する傾向が小さくなり、２．０重量部を超えて混入
するとポリウレタン樹脂接着剤の金属箔への接着力が弱
くなる傾向となる。′ポリスチレン樹脂をポリウレタン
樹脂接着剤に混入させる方法は、ポリウレタン樹脂接着
剤溶液を支持体に塗布する際にポリスチレン樹脂を添加
する方法や支持体に塗布する前に予めポリウレタン樹脂
接着剤溶液にポリスチレン樹脂を添加する方法等がある
。ポリウレタン樹脂接着剤溶液の有機溶媒はポリスチレ
ン樹脂に対して良溶媒である、トルエン、ベンゼン、キ
シレン、四塩化炭素、エチルメチルケトン等が多くの場
合用いられる。The polystyrene resin mixed in the polyurethane resin adhesive may be an active polymer or an isotactic polymer.
About 0.05 parts to 2.0 parts by weight are mixed with respect to 0 parts by weight. Polystyrene resin to polyurethane resin adhesive 100%! If less than 0.05 parts by weight is mixed in, the tendency to prevent the tackiness of the polyurethane resin adhesive will be reduced, and if it is mixed in more than 2.0 parts by weight, the polyurethane resin adhesive will not adhere to the metal foil. Adhesive strength tends to become weaker. ``Polystyrene resin can be mixed into polyurethane resin adhesive by adding polystyrene resin when applying the polyurethane resin adhesive solution to the support, or by adding polystyrene resin to the polyurethane resin adhesive solution in advance before applying it to the support. There are methods such as adding . As the organic solvent for the polyurethane resin adhesive solution, toluene, benzene, xylene, carbon tetrachloride, ethyl methyl ketone, etc., which are good solvents for polystyrene resin, are often used.
ポリスチレン樹脂をポリウレタン樹脂接着剤に混入する
と、ポリウレタン樹脂接着剤の残留タッキネスが小さく
なる理由は、明確ではないが次のように考えられる。即
ち、硬化後のジイソシアネート系誘導体やトリイソシア
ネート化合物の残存ＮＧＯ基がポリスチレン樹脂によっ
て封鎖されるためと考えられる。The reason why the residual tackiness of the polyurethane resin adhesive becomes smaller when polystyrene resin is mixed into the polyurethane resin adhesive is not clear, but it is thought to be as follows. That is, it is thought that this is because the remaining NGO groups of the diisocyanate derivative or triisocyanate compound after curing are blocked by the polystyrene resin.
（ホ）発明の効果
本発明に係るフレキシブルプリント配線基板を用いて、
フレキシブルプリント配線板を作成すれば、非配線部に
露出しているポリウレタン樹脂接着剤のタッキネスが小
さいため、作成したフレキシブルプリント配線板を直ち
に積み重ねて、製品として出荷できる。そして電気製品
等に組み込む工程においても、積み重ねたフレキシブル
プリント配線板を一枚ずつ良好に取り去ることができる
。(e) Effects of the invention Using the flexible printed wiring board according to the invention,
Once a flexible printed wiring board is created, the tackiness of the polyurethane resin adhesive exposed in the non-wiring area is small, so the created flexible printed wiring boards can be immediately stacked and shipped as a product. Also, in the process of assembling it into electrical products, etc., stacked flexible printed wiring boards can be easily removed one by one.
これが従来のポリスチレン樹脂を混入させないポリウレ
タン樹脂接着剤を用いて作ったフレキシブルプリント配
線基板であると、フレキシブルプリント配線板作成後た
だちに積み重ねることができず、高温で１０日以上も熟
成した後、積み重ねて出荷している。そして、それでも
積み重ねたフレキシブルプリント配線板を一枚ずつ取り
去る際にトラブルが発生していた。このことから判るよ
うに本発明に係るフレキシブルプリント配線基板は、産
業経済上或いは電気製品組立作業上非常に有益なもので
ある。If this is a flexible printed wiring board made using a polyurethane resin adhesive that does not contain conventional polystyrene resin, it cannot be stacked immediately after making the flexible printed wiring board, but it must be aged at high temperatures for more than 10 days before being stacked. Shipping. However, trouble still occurred when removing the stacked flexible printed wiring boards one by one. As can be seen from this, the flexible printed wiring board according to the present invention is very useful from an industrial economic perspective or an electrical appliance assembly work.
Claims (1)
たフレキシブルプリント配線基板において、前記ポリウ
レタン樹脂接着剤中にポリスチレン樹脂を混入せしめた
ことを特徴とするフレキシブルプリント配線基板。1. A flexible printed wiring board in which a support and a metal foil are bonded together with a polyurethane resin adhesive, characterized in that a polystyrene resin is mixed into the polyurethane resin adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60118626A JPS61274932A (en) | 1985-05-30 | 1985-05-30 | Flexible printed wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60118626A JPS61274932A (en) | 1985-05-30 | 1985-05-30 | Flexible printed wiring substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61274932A true JPS61274932A (en) | 1986-12-05 |
| JPH023702B2 JPH023702B2 (en) | 1990-01-24 |
Family
ID=14741186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60118626A Granted JPS61274932A (en) | 1985-05-30 | 1985-05-30 | Flexible printed wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61274932A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231790A (en) * | 1989-03-03 | 1990-09-13 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116914U (en) * | 1984-12-29 | 1986-07-23 |
-
1985
- 1985-05-30 JP JP60118626A patent/JPS61274932A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116914U (en) * | 1984-12-29 | 1986-07-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231790A (en) * | 1989-03-03 | 1990-09-13 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023702B2 (en) | 1990-01-24 |
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