JPS6127345U - Heat dissipation fixture - Google Patents
Heat dissipation fixtureInfo
- Publication number
- JPS6127345U JPS6127345U JP11110784U JP11110784U JPS6127345U JP S6127345 U JPS6127345 U JP S6127345U JP 11110784 U JP11110784 U JP 11110784U JP 11110784 U JP11110784 U JP 11110784U JP S6127345 U JPS6127345 U JP S6127345U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fixture
- dissipation fixture
- heat
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る放熱用取付具め一実施例を示す斜
視図、第２図は第１図のＡ−Ａ断面図、第３図は従来の
発熱体の実装状態を示す斜撞図、第４図は第３図のＢ−
Ｂ断面図である。
１・・・半導体、２・・・インシュレータ、３・・・放
熱板、３ａ・・・取付部、９・・・取付具、１ａ・・・
取付部、１ｂ・・・取付穴、９ａ・・・突起。Fig. 1 is a perspective view showing an embodiment of the heat dissipation fixture according to the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 is a perspective view showing the mounting state of a conventional heating element. Figure 4 is B- of Figure 3.
It is a sectional view of B. DESCRIPTION OF SYMBOLS 1... Semiconductor, 2... Insulator, 3... Heat sink, 3a... Mounting part, 9... Mounting tool, 1a...
Mounting part, 1b...Mounting hole, 9a...Protrusion.
Claims (2)
体を装着して放熱する放熱用取付具において、該放熱用
取付具がほぼＵ字状をなす弾性体からなり、その内面に
前記放熱板と半導体などの取付部とを一体に挟持し、前
記放熱用取付具に前記半導体タどの取付部に形成された
取り付け穴に嵌合する突起を設けたことを特徴とする放
熱用取付具。(1) In a heat dissipation fixture that radiates heat by attaching a heat generating element such as a semiconductor to a heat dissipation plate provided on a chassis, the heat dissipation fixture is made of an elastic body that is approximately U-shaped, and the heat dissipation fixture is made of an elastic body that is approximately U-shaped, and A heat dissipation fixture, characterized in that a plate and a semiconductor mounting part are integrally held together, and the heat dissipation fixture is provided with a protrusion that fits into a mounting hole formed in the semiconductor mounting part.
Ｌ字状に形成してなることを特徴とする実用新案登録請
求の範囲第１項記載の放熱用取付具。(2) The heat dissipation fixture according to claim 1, wherein the heat dissipation plate is formed into a substantially L-shape by cutting and raising a part of the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11110784U JPS6127345U (en) | 1984-07-24 | 1984-07-24 | Heat dissipation fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11110784U JPS6127345U (en) | 1984-07-24 | 1984-07-24 | Heat dissipation fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127345U true JPS6127345U (en) | 1986-02-18 |
Family
ID=30670217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11110784U Pending JPS6127345U (en) | 1984-07-24 | 1984-07-24 | Heat dissipation fixture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127345U (en) |
-
1984
- 1984-07-24 JP JP11110784U patent/JPS6127345U/en active Pending
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