JPS61273319A - Vacuum adhesive packaging method of product by foamed synthetic resin - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for vacuum tight packaging of articles such as precision parts such as tools and ICs using foamed synthetic resin.

[Conventional technology and its problems]

Previously, the vacuum packaging for this type of product was a prepackage in which the product was placed on paper with small holes and a thermoformed (vacuum formed) film was placed on top of it, but paper had poor cushioning properties. is insufficient.

Furthermore, due to the presence of small vacuum holes for thermoforming, moisture resistance is not sufficient, and there are drawbacks such as rust and increased electrical resistance of the parts. On the other hand, there are containers that store items in the recesses of foamed polystyrene molded containers that provide cushioning properties, but this requires the container to always be oriented in the direction of the container during transportation, and the foamed polystyrene can The spaces between the styrene sheets rubbed against each other, producing dust such as white powder, which reduced the accuracy of the product.

[Means for solving problems]

The present invention provides a buffer plate 3 made of foamed synthetic resin in which one or more storage recesses 2, 2, . The film 7 is placed on a support base 6 with a small hole 12 drilled therein, a film 7 is stretched over the upper surface of the lower mold, and the film 7 is fixed by clamping the upper mold and the lower mold, and then the film 7 is heated and softened. Next, the pressure inside the lower die 5 is reduced and the softened film 7 is transferred to the articles 1, 1...
・And it is brought into close contact with the buffer plate 3.

〔Example〕

As shown in the first diagram, a foamed synthetic resin mold is formed with a plurality of recesses 2, 2, . . . for accommodating articles 1, 1, . A buffer plate 3 made of a molded product is formed. In the figure, numeral 4 is a tray for carrying the article l. This tray 4 may or may not be present.

Next, as shown in the second figure, the buffer plate 3 is placed on a support base 6 that moves up and down in the lower mold 5, and a thermoforming resin film 7 is further spread on the lower mold 5. Note that 8 in the figure is a backing provided on the lower mold 5. The support base 6 has a small hole 15 of 0.5 to 2 mΔ.
are piled up in large numbers.

Next, as shown in the third figure, the upper mold 10 containing the heating plate 9
is clamped onto the lower mold 5, and the thermoforming resin film is fixed. The hot plate 9 is provided with a large number of small holes 11, 11, and so on.
Air 13 is taken in and out of the upper mold 10 through the upper mold 10. By lowering the hot plate 9 and bringing it into contact with the film 7, for example, in the case of polyethylene film, 120 to 13
Heating to 0° C. softens the film. Then hot plate 9
to rise.

Next, as shown in FIG. 4, when the hot plate 9 rises, the support stand 6 in the lower die rises and comes into contact with the film 7, and then the film 7 and the air 15 in the lower die 5 are depressurized by a vacuum pump to remove the pipe. When the air is discharged from 6, the softened film 7 is blank-formed into the shape KX of article 1, 1...
Article 1.1... is in close contact with article 1.1...
Other than that, it is in close contact with the lower buffer plate 3 and tray 4.

The air in the lower mold 5 is exhausted to the outside of the mold through the air vent f16.

During the above pressure reduction, pressurized air 1 is supplied from the pipe 17 of the upper mold 10.
8 may be blown into the upper mold 10 and the film 7 may be formed using both compressed air and vacuum.

As described above, each article 1°1...
. . . are fitted into the recesses 2, 2, . Therefore, article 1.1...
are held in the recesses 2, 2, . Since it is absorbed by the buffer plate 3, the food items 1, 1...
... is held safely and the article 1゜1...
are fixed in the two recesses 2, 2, .

Moreover, since the articles 1, 1, . . . are shielded from dust from the outside air by the film 7, dust does not adhere to them, and since there are few opportunities for them to come into contact with the air, they are resistant to rust. The buffer plate 3 can be used again by peeling off the film 7 after use.

As the buffer plate 3, materials such as foamed polypropylene, crosslinked foamed polyethylene, etc. may be used in addition to foamed polystyrene.

Further, as shown in Figure 5, if the edge 3a of the buffer plate 3 is made to protrude above the height of the stored articles 1.1..., when the buffer plates 3 are stacked, the articles 1, 1... No pressure is applied to...

As the film 7, polyvinyl chloride, polyethylene,
A transparent thermoplastic resin film, such as ethylene/vinyl acetate copolymer or polypropylene, which can be thermally bonded to the buffer plate 3 and whose interior can be seen through is used.

〔Effect of the invention〕

According to the present invention, since the articles are held within the recesses of the buffer plate, shocks are unlikely to act on the articles during transportation, and the articles are held safely and completely, and since the articles are fixed within the recesses by the film, the buffer plate It does not rub against other surfaces and does not generate dust such as white powder.

[Brief explanation of drawings]

Figures 1 to 4 are explanatory diagrams sequentially showing the method of the present invention, and Figure 5
The figure is a sectional view of a package according to the invention. 1.1... is the article, 2, 2... is the recess, 3 is the buffer plate, 5 is the lower mold, 7 is the film, IO is the upper mold,
12 is a small hole for vacuuming. Patent applicant Mitsubishi Yuka Verdate Co., Ltd. Agent
Patent Attorney Hidetoshi Furukawa Agent Patent Attorney Masahisa Hase Figure 1 Figure 2 Figure 3 Figure 4 71: si-Q

Claims (1)

[Claims] A buffer plate made of foamed synthetic resin in which one or more storage recesses containing articles are formed is placed on a support base with small holes in the lower mold, and a thermoforming resin film is stretched on the upper surface of the lower mold. Then, after clamping the upper mold and the lower mold to fix this film, the film is heated and softened, and then the inside of the lower mold is depressurized and the softened film is molded so as to be in close contact with the article and the buffer plate. A method for vacuum-tight packaging of products using foamed synthetic resin, characterized by: