JPS6127030A - Solenoid relay - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to an electromagnetic relay.

(Prior art) In recent years, electromagnetic relays have become more compact and have achieved the smallest allowable shape.The winding part, in which the excitation winding is wound around the syspool, also has an outer box (with an inner diameter that is almost close to the outer diameter). casen is used.

When conventional electromagnetic relays are manufactured using automatic machines, the terminals of the excitation windings wound around the spools are soldered with gold so that the soldered parts of the lead-out terminals can be easily immersed in a solder bath. In the outward direction from the center of the winding part, the shape protrudes out of the same plane. Therefore, when using an outer box whose outer diameter dimensions are approximately the same, the soldered portions of the lead-out terminals not only get in the way, but also have many chances of bending and breaking of the wire. In a normal structure, the winding part is located on the board, and the lead-out terminal is placed on the board or in a place close to the board.The lead-out wire at the end of the excitation winding extends toward the outside of the winding to the soldered part of the lead-out terminal. ing.

(Problem to be Solved by the Invention) In this way, the conventional electromagnetic relay has a structure in which the lead wire at the end of the excitation winding extends outward from the winding toward the soldered part of the lead terminal toward the board. Therefore, in a normal structure in which the outer box is fitted toward the board from the opposite direction to the board of the winding part, when the soldered part of the lead terminal is caught on the outer box, it is bent outward from the excitation winding. There was a problem in that the leader wire at the end of the winding could not be avoided being cut.

(Means for Solving the Problems) The basic structure of the electromagnetic relay according to the present invention is characterized in that at least one of the winding lead terminals protruding from one winding section is made of a shape memory alloy, and furthermore, the shape memory alloy When the winding is fixed, the pull-out terminal bends to the side of the winding depending on the temperature, and has a matrix shape in which the tip of the fixed part is located inside the moving position of the outer case when the outer case is attached. Features.

(Principle and operation of the invention) The shape memory alloy used in the lead terminal of the present invention is as follows.

For example, for titanium-nickel alloys, the temperature is 200-300℃.
It is processed into the final shape in a heated Roe oven, and then dipped in linear solder at room temperature to form an easy-to-response shape. After assembly,
When winding the lead wire of the winding around the lead terminal, the temperature of the solder in the solder tank is 250℃ when the lead wire is immersed in solder. Change in shape.

(Example) Next, an electromagnetic relay according to the present invention will be described by way of an example with reference to the drawings.

FIG. 1 is a side view showing one embodiment of an electromagnetic relay according to the present invention, and a side sectional view of an outer box attached thereto. In Figure 1, the electromagnetic relay has an excitation winding 1 wound around a spool.
0. A winding lead-out terminal 20 having a soldered part 21 where the end of the winding is completely wrapped and soldered. Two substrates 3 forming hh spools at both ends of the bobbin around which the excitation winding 10 is wound.
1.32° A fixed contact plate 4 that penetrates the board 31 and has a lead-out terminal 41 and a contact point on almost the same surface as the board 32.
0. A movable contact spring 50, each having a lead-out terminal 51 substantially parallel to the lead-out terminal 41 at one end and a contact 52 at the other end. A movable armature 60 attached to the movable contact spring 50 and attracted to the excitation winding 10 (actually a magnetic bar at the center of the winding, not shown) when an excitation current is passed through the excitation winding 10. In addition, a movable contact spring 50 is bonded and fixed at both ends to the substrate 31, 32 to form a magnetic path, and a yoke 70 is provided, and covered with an outer box 80 that fits onto the substrate 31.

Figures 2(a) and fb) show winding pull-out terminals 20 and 20' for connecting and pulling out one end of one excitation winding 10 in Figure 1, respectively, and the other end. In the perspective view shown, the lead terminal 20.
20' uses a shape memory alloy made of a titanium-nickel alloy as a base material, and shows the machined shape at a matrix processing temperature of approximately 250°C. The lead-out terminal 20.20' includes a central portion 22.22' that is incorporated parallel to the plane of the substrate 31 in FIG. The excitation winding 10 has a central axis that is an extension of the central axis of 22', and is bent in the opposite direction of the lead-out terminal part 23 and 23' at an angle of 45'' or more with respect to the plane.
Soldering part 21゜21 where the lead wire is wrapped and soldered.
′ is the processed shape.

Fig. 3 (a) U The soldering of the soldering part 21 of the winding pull-out terminal 20 in Fig. 2 is a side view showing the previous state, and the soldering in Fig. 3 (bl is Fig. 3 ta). Part 21t is a side sectional view of the solder tank 91 showing the state when immersed in the solder liquid 92 in the solder tank 91.

In FIG. 3 (al), the soldered part 21 of the winding lead-out terminal 20 assembled on the board 31 protrudes almost perpendicularly to one surface of the rectangular parallelepiped formed by the boards 31 and 32 of the spool around which the excitation winding 10t is wound. The shape shown in FIGS. 2(a) and 2(b) is molded at room temperature to form the lead wire 1 of the excitation winding 10.
1 is wound. When the soldering part 21 (Fig. 3+8) is immersed in the soldering liquid 92 in the soldering tank 91 in Fig. 3 (bl), the soldering liquid 92 is hot! 250℃ is the lead-out terminal 20
Since the temperature is the matrix processing temperature of the shape memory alloy of the material, the soldered portion 21 of the lead-out terminal 20 is folded in the illustrated state 1 of FIGS. It deforms from the protruding state to a curved state. As shown in FIG. 1, the tip of this soldering part 21 is connected to a yoke 70 attached to this plane from a plane from which a rectangular parallelepiped soldering part 21 formed by a board 31, 32 projects, and an outer surface of this yoke 70. The matrix is processed so that it is located at a position that does not exceed the thickness up to the surface of the movable contact spring 500 fixed to the surface. Also.

Since the tip of the soldered part 21 is bent in the direction opposite to the lead-out terminal part 23, that is, in the direction of the excitation winding 10, there is no tensile force on the winding lead wire (11 in FIG. 3), and there is no possibility of cutting due to tension.

Therefore, the conventional problem that the soldering part 21 is hooked by the outer box 80 while protruding perpendicularly to the plane of the yoke 70 is solved.

In the above embodiment, soldering was explained in terms of connection.

When using a connection method that applies heat, all the shapes change to the matrix shape in the same way. Although the temperature does not need to be high, the greater the temperature difference from room temperature, the shorter the deformation time, which improves the productivity.

(Effects of the Invention) As explained above, in the electromagnetic relay of the present invention, at least one of the lead terminals of the excitation winding is made of a shape memory alloy, and the connection of the winding lead wire of the lead terminal is performed at the matrix processing temperature. This allows you to fit all the protruding positions of the tip without the hassle of manually bending it.

You can benefit from improved productivity.

[Brief explanation of drawings]

Figure 1 is a side view showing the entire one-pronged male side of the electromagnetic relay of the present invention and a side sectional view of the outer box, and Figures 2 (a) and fb) are
Figure 3(a) is a partial side view of the previous figure 1 with soldering, and Figure 3(b) is a side view and solder tank showing the condition of the lead-out terminal with soldering. It can be seen in the side cross-sectional view. 10...Winding wire, 11...Leader wire, 20...
...Output terminal, 21...Soldering part (output wire connection part). 31.32... Board, 91... Solder tank, 92... Solder liquid. Hayabusa 7 Figure 2 (α) (b) Fu 3 Figure (α) 3rd box (b)

Claims (1)

[Claims] An electromagnetic relay characterized in that at least one of the lead terminals for connecting and fixing the ends of the excitation winding is made of a shape memory alloy.