JPS6126206B2 - - Google Patents
Info
- Publication number
- JPS6126206B2 JPS6126206B2 JP7555377A JP7555377A JPS6126206B2 JP S6126206 B2 JPS6126206 B2 JP S6126206B2 JP 7555377 A JP7555377 A JP 7555377A JP 7555377 A JP7555377 A JP 7555377A JP S6126206 B2 JPS6126206 B2 JP S6126206B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- resin
- insulating layer
- preventing
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000012948 isocyanate Substances 0.000 claims description 7
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- -1 isocyanate compound Chemical class 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 description 12
- 238000005187 foaming Methods 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical group F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
- Manufacture Of Motors, Generators (AREA)
Description
本発明は電気絶縁装置の製造方法に係り、特に
回転電気や静止誘導電器等の電気巻線に使用する
に好適な電気絶縁装置のその製造方法に関する。
一般に、発電機、電動機等の回転電機や変圧器
等の静止誘導電器の電気巻線の絶縁として使用さ
れる多官能エポキシ化合物と多官能イソシアネー
ト化合物とを主成分とするレジンは、硬化触媒の
存在下で加熱することにより、耐熱性にすぐれた
硬化物となり、耐熱区分H種以上の絶縁に使用で
きる。ところが、このレジンは、その組成中の多
官能イソシアネートが水分と反応して炭酸ガスを
発生してしまい、この炭酸ガス発生により、絶縁
層中に発泡によるボイドが発生して絶縁耐力が低
下する問題がある。
そこで、さきに提案された特願昭49−116092号
(特開昭51−43000号)では、絶縁層中の水分量を
一定値以下とし、レジンのゲル化までの一次硬化
温度を80℃以下として、硬化時の反応を制御し炭
酸ガスの発生を防止している。
しかし、絶縁層中の水分量を一定量以下にする
ためには、加熱乾燥、または減圧乾燥を行う必要
があるが、乾燥炉から出て、次の工程であるレジ
ンの注入工程へ入る間に大気中に露出されるた
め、この時点で絶縁層表面、及び絶縁層中に吸湿
してしまう。この様な吸湿状態で絶縁層中にレジ
ンを含浸すると、多官能イソシアネートが水分と
反応してしまい、発生する炭酸ガスによる発泡の
問題はさけられない。また、注入されたレジンが
絶縁層外に流出してしまうと絶縁性能の向上は図
れないので、より絶縁性能を向上させるには、注
入されたレジンが絶縁層外に流出するのを防止す
ることが重要である。
本発明は上述の点に鑑み成されたもので、その
目的とするところは、乾燥炉から出てレジン注入
工程へ入る間に大気中に露出しても、絶縁層は吸
湿することなく、よつて、炭酸ガス発生による発
泡が防止されると共に、注入したレジンが絶縁層
外に流出することのないようにして絶縁性能の向
上が図れる電気絶縁装置の製造方法を提供するに
ある。
本発明は電気導体上に絶縁材を巻回して絶縁層
を形成し、この絶縁層の外側に吸湿防止用の剥離
テープを巻回して包囲すると共に、該剥離テープ
上にレジン流出防止用テープを巻回して乾燥炉で
乾燥させ、その後、多官能エポキシ化合物と多官
能イソシアネート化合物を主成分とするレジンを
含浸させて加熱硬化し、しかる後、これら剥離テ
ープ、及びレジン流出防止用テープを除去するこ
とにより、所期の目的を達成するようになしたも
のである。
即ち、前記した様に、絶縁層中に発生する発泡
の原因は水分であり、この水分は乾燥工程で取除
けるが、次工程であるレジン注入工程へ入る際に
大気中に製品が露出されるために、この時点で絶
縁層中、及び絶縁層表面が吸湿してしまう。この
吸湿により絶縁層中、及び絶縁表面に有害な発泡
を形成させないためには、レジン注入工程の際で
も絶縁層表面が直接大気にふれない様にすること
が必要である。このため、本発明ではあらかじめ
絶縁層の外側を4弗化エチレンなどからなる吸湿
防止用の剥離テープで包むようにして、乾燥工程
からレジン注入工程へ入る間に大気中に露出して
も絶縁層が吸湿しないようにしている。
しかし、単にこのように絶縁層の外側を吸湿防
止用の剥離テープで包んだだけでは、絶縁層が直
接大気にふれないようにし吸湿を防止するという
目的は達成できるが、4弗化エチレンなどからな
る剥離テープは、離形作用があるためテープ層間
の接着性が悪く、絶縁層中に注入されたレジンを
絶縁層中に留めておく作用がない。
そこで、本発明では、絶縁層の外側に巻回した
剥離テープの上に、さらに注入レジンの含浸性、
あるいは附着性の良好なテープ、例えばナトリウ
ム処理を行い表面をあらしてレジンの附着性を良
好とした4弗化エチレンテープ、あるいは不織布
繊維テープ等のレジン流出防止用テープを巻回す
ることにより、絶縁層を直接大気に露出させない
こととあわせて、注入されたレジンの流出を防ぐ
ことができるのである。
特に、レジンを含浸させた電気線輪を加熱炉中
で硬化させる場合、最初に温度が上昇するのは、
加熱炉の雰囲気に直接接している電気線輪の最外
周部絶縁であり、まず、この部分のレジンから硬
化を始め次第に内部に進行する。従つて、最外層
部にレジン含浸性、あるいはレジンとの接着性の
良いレジン流出防止用テープを巻回しておけば、
先にこのレジン流出防止用テープ部分のレジンが
硬化し、電気線輪全体に袋体を形成するため、絶
縁層内部のレジンは絶縁層外に流出せず、均質な
絶縁層を得ることができる。
以下、本発明を実施例について具体的に説明す
る。
実施例
電気導体の周りに、主絶縁材としてポリイミド
フイルム(Dupont社製KAPTON)とガラス繊維
よりなる複合材料を含浸レジンの硬化触媒である
イミダゾール系触媒(四国化成製2PZ−CN)で
処理したテープを巻回し、その上に一次硬化過程
で主絶縁材中に含浸されたレジンが空気と接触す
るのをさけるため、まず、吸湿防止用の剥離テー
プとして4弗化エチレンテープを半重巻で1回巻
回し、次にレジン流出防止用テープとしてナトリ
ウム処理を行つた4弗化エチレンテープを半重巻
で1回巻回し、40℃、0.1mmHgで減圧乾燥して、
水分等を揮散させた後、多官能エポキシ化合物と
してビスフエノールA型のジグリシジルエーテル
エポキシレジン(ダウ社製DER332)100重量
部、多官能イソシアネート化合物としてジフエニ
ルメタンジイソシアネート(住友バイエル社製、
スミジユールCD)206重量部を配合したレジンを
真空含浸し、加熱硬化した。加熱硬化条件は、90
℃、10時間の一次硬化後に200℃、15時間のアフ
ターキユアを行つた。加熱硬化後は剥離テープ、
及びレジン流出防止用テープを除去して電機線輪
を得た。
実施例
前記と同様に吸湿防止用の剥離テープとして4
弗化エチレンテープを半重巻で1回巻回し、さら
にその上にワニス含浸性の良好な不織布繊維テー
プ(日本バイリーン社製、バイリーン)を半重巻
で1回巻回して、前記実施例と同様なレジン処
理、及び加熱硬化を行つた。
なお、比較のために、絶縁層最外周部に吸湿防
止用の剥離テープとして4弗化エチレテープのみ
を半重巻で1回巻回し(比較例とする)、ま
た、吸湿防止用の剥離テープ、及びレジン流出防
止用テープを一切巻回せずに(比較例とす
る)、前記と同様の方法により電機線輪を製作し
た。
この様にして製作した各電機線輪の特性を比較
するため、絶縁層表面のレジンの発泡状況、レジ
ン含浸量、B.D.V特性、誘電正接を測定した。そ
の結果を下表に示す。
The present invention relates to a method of manufacturing an electrical insulating device, and more particularly to a method of manufacturing an electrical insulating device suitable for use in electrical windings of rotating electrical equipment, stationary induction electrical equipment, and the like. In general, resins whose main components are polyfunctional epoxy compounds and polyfunctional isocyanate compounds, which are used as insulation for electric windings in rotating electric machines such as generators and electric motors, and stationary induction electric appliances such as transformers, are used in the presence of a curing catalyst. By heating at a lower temperature, it becomes a cured product with excellent heat resistance, and can be used for insulation of heat resistance classification H class or higher. However, the problem with this resin is that the polyfunctional isocyanate in its composition reacts with moisture and generates carbon dioxide gas, which causes voids due to foaming to occur in the insulating layer, resulting in a decrease in dielectric strength. There is. Therefore, in the previously proposed patent application No. 49-116092 (Japanese Patent Application Laid-Open No. 51-43000), the moisture content in the insulating layer is set below a certain value, and the primary curing temperature until gelation of the resin is set below 80°C. As a result, the reaction during curing is controlled to prevent the generation of carbon dioxide gas. However, in order to reduce the moisture content in the insulating layer to a certain level or less, it is necessary to perform heat drying or vacuum drying. Since it is exposed to the atmosphere, moisture is absorbed on the surface of the insulating layer and into the insulating layer at this point. If the resin is impregnated into the insulating layer in such a moisture-absorbing state, the polyfunctional isocyanate will react with moisture, and the problem of foaming due to the generated carbon dioxide gas cannot be avoided. In addition, if the injected resin flows out of the insulating layer, the insulation performance cannot be improved, so in order to further improve the insulation performance, it is necessary to prevent the injected resin from flowing out of the insulating layer. is important. The present invention has been made in view of the above points, and its purpose is to prevent the insulating layer from absorbing moisture even if it is exposed to the atmosphere after leaving the drying oven and entering the resin injection process. Therefore, it is an object of the present invention to provide a method for manufacturing an electrical insulating device that can prevent foaming due to the generation of carbon dioxide gas and improve insulation performance by preventing injected resin from flowing out of the insulating layer. In the present invention, an insulating material is wound around an electrical conductor to form an insulating layer, a release tape for preventing moisture absorption is wrapped around the outside of this insulating layer, and a tape for preventing resin leakage is placed on the release tape. It is rolled up and dried in a drying oven, then impregnated with a resin whose main components are a polyfunctional epoxy compound and a polyfunctional isocyanate compound and cured by heating, and then the release tape and the tape for preventing resin leakage are removed. By doing so, the intended purpose was achieved. That is, as mentioned above, the cause of foaming in the insulating layer is moisture, and although this moisture can be removed in the drying process, the product is exposed to the atmosphere when entering the next process, the resin injection process. Therefore, at this point, the inside of the insulating layer and the surface of the insulating layer absorb moisture. In order to prevent the formation of harmful bubbles in the insulating layer and on the insulating surface due to this moisture absorption, it is necessary to prevent the surface of the insulating layer from coming into direct contact with the atmosphere even during the resin injection process. For this reason, in the present invention, the outside of the insulating layer is wrapped in advance with a release tape made of tetrafluoroethylene to prevent moisture absorption, so that even if exposed to the atmosphere between the drying process and the resin injection process, the insulating layer will absorb moisture. I try not to. However, simply wrapping the outside of the insulating layer with release tape to prevent moisture absorption can achieve the purpose of preventing moisture absorption by preventing the insulating layer from coming into direct contact with the atmosphere, but it does not prevent the insulation layer from coming into direct contact with the atmosphere. The release tape has poor adhesion between the tape layers due to its releasing effect, and does not have the effect of retaining the resin injected into the insulating layer. Therefore, in the present invention, on the release tape wound on the outside of the insulating layer, an impregnated resin is further added.
Alternatively, insulation can be achieved by wrapping a tape with good adhesion properties, such as tetrafluoroethylene tape that has been treated with sodium to roughen its surface to improve resin adhesion, or a tape for preventing resin leakage such as non-woven fiber tape. In addition to not exposing the layer directly to the atmosphere, this prevents the injected resin from flowing out. In particular, when curing electric wire impregnated with resin in a heating furnace, the temperature initially rises as follows:
This is the insulation at the outermost periphery of the electric coil, which is in direct contact with the atmosphere of the heating furnace, and the resin in this area begins to harden and gradually progresses inside. Therefore, if the outermost layer is wrapped with resin-impregnated tape or tape that has good adhesiveness to resin to prevent resin spillage,
The resin in this tape to prevent resin leakage hardens first and forms a bag over the entire electrical wire ring, so the resin inside the insulation layer does not leak out of the insulation layer and a homogeneous insulation layer can be obtained. . Hereinafter, the present invention will be specifically described with reference to Examples. Example: A tape in which a composite material consisting of polyimide film (KAPTON manufactured by Dupont) and glass fiber as the main insulating material is treated with an imidazole-based catalyst (2PZ-CN manufactured by Shikoku Kasei), which is a curing catalyst for impregnated resin, around the electrical conductor. To prevent the resin impregnated into the main insulating material from coming into contact with air during the primary curing process, first wrap a half-wrap of tetrafluoroethylene tape as a release tape to prevent moisture absorption. Then, as a tape for preventing resin leakage, sodium-treated tetrafluoroethylene tape was wound once in a half-wrap, and dried under reduced pressure at 40°C and 0.1 mmHg.
After volatilizing water, etc., 100 parts by weight of bisphenol A type diglycidyl ether epoxy resin (DER332, manufactured by Dow) was added as a polyfunctional epoxy compound, and diphenylmethane diisocyanate (manufactured by Sumitomo Bayer, Inc.) was added as a polyfunctional isocyanate compound.
A resin containing 206 parts by weight of Sumidyur CD was vacuum impregnated and cured by heating. Heat curing conditions are 90
After primary curing at ℃ for 10 hours, after-curing was performed at 200℃ for 15 hours. After heat curing, release tape,
And the tape for preventing resin outflow was removed to obtain an electric wire ring. Example 4 As a release tape for preventing moisture absorption as described above
A fluorinated ethylene tape was wound once in a half-wrap, and a nonwoven fiber tape with good varnish impregnability (Vilene, manufactured by Nippon Vilene Co., Ltd.) was wound once on top of the tape in a half-wrap. Similar resin treatment and heat curing were performed. For comparison, only tetrafluoride ethylene tape was wrapped once in a half-wrap as a release tape for preventing moisture absorption around the outermost periphery of the insulating layer (as a comparative example), and a release tape for preventing moisture absorption, An electric wire ring was manufactured in the same manner as described above, without wrapping any tape for preventing resin leakage (comparative example). In order to compare the characteristics of each electric wire wheel manufactured in this way, the foaming state of the resin on the surface of the insulating layer, the amount of resin impregnation, BDV characteristics, and dielectric loss tangent were measured. The results are shown in the table below.
【表】
上記表から明らかな如く、直接空気にさらされ
た比較例は、絶縁層表面の発泡が著しく、従つ
て、電気特性も実施例、に比較して良くな
い。また、吸湿防止用の剥離テープのみを巻回し
ている比較例Iは、剥離テープを巻回していない
比較例に比べて多少の改善がみられるが、電気
特性、及びレジン含浸量は実施例、に比べて
劣る。
尚、実施例、においては、吸湿防止用の剥
離テープ、及びその上に巻かれたレジン流出防止
用テープには、発泡が多数発生したが、これらの
テープは樹脂硬化後除去するため、テープ自体の
発泡は特に問題とならず、目的とする絶縁層には
発泡が残ることはなく、しかも注入レジンの流出
のない均質な絶縁層を得ることができたので、所
期の目的は達成された。
以上説明した本発明の電気絶縁装置の製造方法
によれば、電気導体上に絶縁材を巻線して絶縁層
を形成し、この絶縁層の外側に吸湿防止用の剥離
テープを巻回して包囲すると共に、該剥離テープ
上にレジン流出防止用テープを巻回して乾燥炉で
乾燥させ、その後、多官能エポキシ化合物と多官
能イソシアネート化合物を主成分とするレジンを
含浸させて加熱硬化し、しかる後、これら剥離テ
ープ、及びレジン流出防止用テープを除去したも
のであるから、乾燥炉から出てレジン注入工程へ
入る間に大気中に露出しても、絶縁層は剥離テー
プで包囲されているため直接大気中にはさらされ
ることはないので吸湿することがなく、よつて、
発泡が防止され、更に、レジン流出防止用テープ
があることより、加熱硬化時にレジン流出防止用
テープ部分のレジンが硬化して電気線輪全体に袋
体を成形するため、注入されたレジンは絶縁外に
流出することはなく、しかも、樹脂硬化後、これ
らのテープは除去されるので、絶縁性能の向上し
た此種電気絶縁装置を得ることができる。[Table] As is clear from the above table, in the comparative examples directly exposed to air, foaming on the surface of the insulating layer was significant, and therefore the electrical properties were not as good as in the examples. In addition, Comparative Example I, in which only a release tape for preventing moisture absorption is wound, shows some improvement compared to a Comparative Example in which no release tape is wound, but the electrical properties and the amount of resin impregnation are different from those in the example. inferior to. In the example, a lot of foaming occurred on the release tape for preventing moisture absorption and the tape for preventing resin leakage wrapped on top of the release tape, but since these tapes are removed after the resin hardens, the tape itself The foaming was not a particular problem, and no foaming remained in the desired insulating layer, and a homogeneous insulating layer with no leakage of the injected resin could be obtained, so the intended purpose was achieved. . According to the method for manufacturing an electrical insulating device of the present invention described above, an insulating material is wound on an electrical conductor to form an insulating layer, and a release tape for preventing moisture absorption is wrapped around the outside of this insulating layer. At the same time, a tape for preventing resin leakage is wrapped around the release tape and dried in a drying oven, and then impregnated with a resin containing a polyfunctional epoxy compound and a polyfunctional isocyanate compound as main components and cured by heating. , these release tapes and resin spill prevention tapes have been removed, so even if the insulating layer is exposed to the atmosphere after leaving the drying oven and entering the resin injection process, the insulating layer is still surrounded by the release tape. Since it is not directly exposed to the atmosphere, it does not absorb moisture, and therefore,
Foaming is prevented, and since there is a resin spill prevention tape, the resin in the resin spill prevention tape part hardens during heat curing and forms a bag over the entire electric wire ring, so the injected resin is insulated. Since these tapes do not flow out and are removed after the resin hardens, it is possible to obtain this type of electrical insulating device with improved insulation performance.
Claims (1)
し、その後、乾燥工程を経て前記絶縁層に多官能
エポキシ化合物と多官能イソシアネート化合物を
主成分とするレジンを含浸し加熱硬化して形成す
る電気絶縁装置の製造方法において、前記電気導
体上に絶縁層を形成した後、該絶縁層の外側に吸
湿防止用の剥離テープを巻回して包囲すると共
に、該剥離テープ上にレジン流出防止用テープを
巻回して乾燥させ、その後、前記レジンを含浸さ
せて加熱硬化し、しかる後、前記剥離テープ、及
びレジン流出防止用テープを除去したことを特徴
とする電気絶縁装置の製造方法。 2 前記吸湿防止用の剥離テープとして4弗化エ
チレンテープを用い、レジン流出防止用の剥離テ
ープとしてナトリウム処理を施した4弗化エチレ
ンテープを用いたことを特徴とする特許請求の範
囲第1項記載の電気絶縁装置の製造方法。 3 前記吸湿防止用の剥離テープとして4弗化エ
チレンテープを用い、レジン流出防止用テープと
して不織布繊維テープを用いたことを特徴とする
特許請求の範囲第1項記載の電気絶縁装置の製造
方法。[Claims] 1. An insulating material is wound around an electrical conductor to form an insulating layer, and then, through a drying process, the insulating layer is impregnated with a resin containing a polyfunctional epoxy compound and a polyfunctional isocyanate compound as main components. In the method for manufacturing an electrical insulating device formed by heating and curing, an insulating layer is formed on the electrical conductor, and then a release tape for preventing moisture absorption is wrapped around the outside of the insulating layer, and the release tape is An electrical insulation device characterized in that a tape for preventing resin spillage is wound on top and dried, then the resin is impregnated and cured by heating, and then the peeling tape and the tape for preventing resin spillage are removed. manufacturing method. 2. Claim 1, characterized in that a tetrafluoroethylene tape is used as the release tape for preventing moisture absorption, and a tetrafluoroethylene tape treated with sodium is used as the release tape for preventing resin outflow. A method of manufacturing the electrical insulation device described. 3. The method of manufacturing an electrical insulating device according to claim 1, wherein a tetrafluoroethylene tape is used as the release tape for preventing moisture absorption, and a nonwoven fiber tape is used as the tape for preventing resin outflow.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7555377A JPS5410965A (en) | 1977-06-27 | 1977-06-27 | Method of making electric insulating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7555377A JPS5410965A (en) | 1977-06-27 | 1977-06-27 | Method of making electric insulating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5410965A JPS5410965A (en) | 1979-01-26 |
JPS6126206B2 true JPS6126206B2 (en) | 1986-06-19 |
Family
ID=13579483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7555377A Granted JPS5410965A (en) | 1977-06-27 | 1977-06-27 | Method of making electric insulating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5410965A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132312A (en) * | 1981-02-09 | 1982-08-16 | Toshiba Corp | Manufacture of resin impregnated coil |
JPS57164515A (en) * | 1981-04-01 | 1982-10-09 | Fuji Electric Co Ltd | Manufacture of coil for resin-insulated armature |
JPS57159794U (en) * | 1981-04-03 | 1982-10-07 | ||
JPS5850719A (en) * | 1981-09-19 | 1983-03-25 | Toshiba Corp | Insulation treatment for electrical apparatus |
-
1977
- 1977-06-27 JP JP7555377A patent/JPS5410965A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5410965A (en) | 1979-01-26 |
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