JPS61261317A - Flexible epoxy resin composition and its use - Google Patents

Abstract

PURPOSE:The titled composition which can give a mica prepreg which is excellent in impact resistance, flexibility, adhesiveness and impregnatability and can form a coil excellent in electrical and mechanical properties, comprising an epoxy resin, an acid anhydride curing agent, an accelerator and a thermoplastic resin. CONSTITUTION:1 equivalent of a bisphenol A epoxy resin and/or a flexible epoxy resin (A) or an epoxy equivalent of 184-6,000 are mixed with 0.5-1.5mol of at least one polyanhydride (B) selected from among polyazealic polyanhydride, polyadipic polyanhydride and polysebacic polyanhydride which are intermolecular anhydrides, 20-100g, per 100g of component A, of a thermoplastic resin (C) such as polyglycol and/or polycaprolactone and 0.1-5.0g, per 100g of component A, of at least one member (D) selected from among kalibolite of triethylamine, imidazole and a BF3 complex.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a flexible epoxy resin composition having adhesive properties and flexibility even after curing, and one use thereof, mica prepreg.

[Background of the invention]

Conventionally used solvent-free thermosetting resins, mainly unsaturated polyester resins or epoxy resins, have compositions that can be cured at low temperatures; The latter is extremely hard and has poor flexibility.

For example, epoxy resins are used in a wide range of fields such as cast products, impregnated materials, adhesives, sealants, and paints because of their excellent properties (see, for example, Japanese Patent Publication No. 1342/1983). However, these cured products suffer from various problems because they are inherently inferior in flexibility, and improvements in, for example, impact resistance and adhesion to soft materials have been strongly desired.

In the case of voltages of about 10,000 V to 10,000 V, it is common practice to inject a solvent-free varnish into the mica insulating layer under vacuum. In this case, solvent-free varnishes such as unsaturated polyester resin varnishes and epoxy resin varnishes have been used. However, as the coil becomes larger, a larger impregnating tank is required, so there are many problems in terms of equipment.

Another disadvantage is that it is uneconomical because it requires more impregnated varnish than the impregnated amount, and furthermore, since the varnish must be cured by heating and pressure in the atmosphere, extreme care must be taken to avoid creating voids. I was disappointed. In order to improve these drawbacks, a so-called prepreg method is used in which a type-wound coil is impregnated with a thermosetting resin varnish, taped with tape that has semi-cured the thermosetting resin varnish, and then cured by heating and pressure. started to be adopted. However, although the thermosetting resin used here, such as epoxy resin, has a very high hardness after curing, the shape of the winding wire at about the rated voltage is usually a diamond shape, and this type of winding shape is Incorporation of the wire into the slot requires considerable deformation, so that the ends of the winding must be flexible, which is a great disadvantage.

If sufficient flexibility cannot be secured by using the above thermosetting resin, a half-shaped winding with a shim winding divided into two parts can be used instead of the diamond-shaped one. It has been adopted. Since the winding portions of the harp-shaped winding are independent, there is little deformation of the winding when it is installed in the slot, and therefore there is no adverse effect such as cracking or peeling on the insulating layer of the winding. However, both ends of the winding must be connected after being assembled into the slot, and in such cases, it is extremely difficult to heat and pressure harden the coil end due to its shape. Increases work hours and manufacturing costs. Other methods include coating the base material of the end part with insulating resin while winding it, and slotting the end part (incorporating method (Japanese Patent Laid-Open No. 57-13950
However, it was not sufficient.

[Purpose of the invention]

A first object of the present invention is to provide a thermosetting epoxy resin composition with improved impact resistance, malleability, adhesion and impregnation properties.

A second object of the present invention is to harden the fill end portion so that the coil is not flexible when the coil is assembled into the slot and disassembled, and the final result is a coil with improved electrical and mechanical properties. An object of the present invention is to provide a mica prepreg that can form a mica prepreg.

[Summary of the invention]

To summarize the present invention, the first invention of the present invention relates to a flexible epoxy resin composition, and is characterized in that it includes an epoxy resin, an acid anhydride curing agent, an accelerator, and a thermoplastic resin. .

The second invention of the present invention is an invention relating to mica prepreg, which is obtained by impregnating a laminated mica with a fibrous or film-like base material as a backing material and the resin composition of the first invention. Features.

Examples of epoxy resins used in the present invention include bisphenol A epoxy resins having an epoxy equivalent of 184 to 4,000;
Alternatively, flexible epoxy resins may be used, such as commercial products such as Epicote 828, Epikote 834, Epikote 1001, Epikote 872 (
(manufactured by Yuka Shell Epoxy Co., Ltd.).

In addition, examples of acid anhydride curing agents include polyazelaic acid polyanhydride PAZ-90 (manufactured by Shin Nippon Rika Co., Ltd.), polyadipate polyfihydrate pADA (manufactured by Joupel AG, West Germany), and polysebacic acid polyanhydride pspA (manufactured by Juper AG, West Germany). (manufactured by Jupel AG, West Germany), etc.

Examples of thermoplastic resins include:

Ionomer resin, Ibsan resin, AA19 resin, Mu-S
Resin, AB8 resin, MBI resin, ethylene-vinyl chloride copolymer resin, vinylidene chloride resin, vinyl chloride resin, chlorinated vinyl chloride resin, chlorinated polyethylene, chlorinated polypropylene, butadiene resin, fluororesin, tetrafluoroethylene resin, 7-fluoride chlorinated ethylene resin, vinylidene fluoride resin, polyacetal resin, polyamide resin, polyimide resin, polyethylene resin, polycarbonate resin, polystyrene resin, polysulfone resin, polyphenylene sulfide resin, polypropylene resin, polyethylene glycol, polypropylene glycol (molecular weight 200-20
．． 000) and high molecular weight polycaprolactone.

The accelerator in the present invention may be any known accelerator. Particularly effective among them are triethylamine caribol salt, 2-methylimidazole, 2-methylimidazole,
-ethylimidazole, 2-undecylimidazole,
2-heptadecylimidazole, 2-methyl-4-ethylimidazole, 1-butylimidazole, 1-hensyl-2-methylimidazole, 1-cyanoethyl-2
-Methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-ethelimidazole, 1
-Azine-2-phenylimidazole, 1-azine-2
-1 or 2 types of imidazoles such as pyrimidazole, 2-7-2-2-methylimidazole, 1-azine-2-methylimidazole, and 1-azine-2-undecylimidazole. Boron trifluoride complexes may also be effective, examples of which include complexes of boron trifluoride with amines such as monoethylamine, triethylamine, piperidine and aniline.

On the other hand, the insulating base material, which is an example of the base material in the mica prepreg of the present invention, includes known materials conventionally used in the manufacture of winding wires, such as cotton tape, insulating paper, Japanese paper, silk cloth,
Glass cloth, glass-Tetoron blend cloth, rayon nonwoven fabric,
Polyester nonwoven fabric, polyamide film, polyimide film, polyester film, mica, etc. are used. In the case of plastic films, so-called perforated films with a large number of through holes are particularly effective. This is because the generation of voids can be prevented.

The composition of the present invention preferably has an epoxy equivalent of 184 to
For 1 equivalent of bisphenol A type epoxy resin or flexible epoxy resin of 6000 mm, 5 to 1.5 mol of polyazelaic acid polyanhydride CL, which is an intermolecular anhydride, and for 100 tons of the epoxy resin, thermoplastic 20 resin
~100? , and at least one of triethylamine Calibol salt, imidazoles, and a complex with a Lewis acid amine as a curing accelerator.
It consists of S and at.

However, by combining this composition with a mica insulating layer, pressureless molding is possible even in a short time, and the molded product is highly flexible, making it easy to incorporate the coil into the slot portion. made it possible.

[Examples of the Invention] Hereinafter, the present invention will be explained in more detail with reference to Examples.
The invention is not limited to these examples.

In addition, on each side, parts mean parts by weight.

Examples 1-9 Bisphenol Am diglycidyl ether eboxy Il
90 parts of fat IP-834 (manufactured by Yuka Ciel Epoxy Co., Ltd.),
Polyazelaic acid polyanhydride PAZ-90 (manufactured by Shin Nippon Chemical Co., Ltd.) and/or polyadipic acid polyanhydride PADmu (
65 parts of polysebacic acid polyanhydride pspA (manufactured by Joubert AG, West Germany) and/or polysebacic acid polyanhydride pspA (manufactured by Joubert AG, West Germany) were dissolved at 70 to 120°C, and then polyethylene glycol (molecular weight 20,000, manufactured by Wako Tsumugi Pharmaceutical Co., Ltd.) was dissolved at 70 to 120°C. 30 to 60 parts of triethylamine Calibol salt TEA-K (manufactured by Hokko Chemical Co., Ltd.) (manufactured by Hokko Chemical Co., Ltd.) (15 A solvent-free varnish was prepared by adding a solution of 120 to 130° C. and quickly stirring to dissolve the mixture.This varnish was designated as a 120-b sample.

A specimen was obtained in a Petri dish with a diameter of 50 cm and a height of 5 cm, and the Shore A hardness at room temperature was measured. The results are shown in Table 1 below along with other examples.

Next, the prepared varnish was applied to a copper plate sample (size 15 x 120 cm) covered with an insulating base material in a size of 15 x 5 G-, the two sheets were stacked on top of each other, and both sides were sandwiched with clothespins. 120-b was used as a shear adhesive specimen, and the measurement results are shown in Table 1.

Next, using this prepared varnish, apply it in advance to 60%
It was applied onto a glass cloth with a thickness of Q, 05 cm that had been heated to ~80°C, and a layer of laminated mica with a thickness of 0.1 m was superimposed on the top surface of the glass cloth, and while being lightly pressed, it was wound onto a roll.
After being left in a constant temperature bath at 80° C. for 1 to 3 days (this operation is called transfer), it was taken out to obtain a prepreg sheet. This sheet had flexibility for more than 6 months at 25°C and exhibited sufficient storage stability.

This tape is wound around a copper plate and an insulating layer is applied to it.
Curing proceeded at 80° C. for a predetermined period of time.

The bending strength of this insulator at room temperature was measured, and the values at a strain of 101111, at which the bending strength became constant, are shown in Table 1.

Examples 10 to 12 70 to 90 parts of bisphenol A type diglycidyl ether epoxy resin EP-834 (manufactured by Yuka Shell Epoxy Co., Ltd.) and 65 parts of polyazelaic acid polyanhydride PAZ-90 (manufactured by Shinnihon Rika Co., Ltd.) Dissolve at 120°C, add high molecular weight caprolactone and Placcel.
) H-1 (molecular weight IQ, 000, manufactured by Daicel Chemical Co., Ltd.)
] Dissolve 30 to 70 parts at 120 to 130° and
Keep warm at 80℃. To this was added 5 parts of TEA-KO in the same manner as in Example 1 to obtain a controlled varnish. Using this varnish, a cured resin product and a prepreg sheet were created in the same manner as in Example 1, and the properties were measured using this.
The results are shown in Table 1.

Examples 13-15 Bisphenol A diglycidyl ether epoxy resin]! 90 parts of 1p-a34 (manufactured by Yuka Ciel Epoxy Co., Ltd.) and 65 parts of polyazelaic acid polyanhydride PAZ-90 (manufactured by Shinnihon Rika Co., Ltd.) are dissolved at 70 to 120°C, and high molecular weight polyethylene glycol is dissolved in this. (Molecular weight 2 to 000
, manufactured by Wako Tsumugi Yakuhin Co., Ltd.) at 120 to 130°C and kept at 70 to 80°C.

In the same manner as in Example 1, 1-cyanethyl-2-
Ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., 21
4MZ-C! N) (Added 5 parts of L to make a texture adjustment varnish.

Using this phenol, a cured resin product and a prepreg sheet were prepared in the same manner as in Example 1, and the properties were measured using the same, and the results are shown in Table 11C.

Examples 16 to 18 90 parts of flexible epoxy resin EP-871 (manufactured by Yuka Shell Epoxy Co., Ltd.) and polyazelaic acid polyanhydride PAZ
-90 (manufactured by Shin Nippon Rika Co., Ltd.) at 70 to 120°C, and 30 to 70 parts of high molecular weight polyethylene glycol (molecular weight 2 to 000, manufactured by Wako Tsumugi Pharmaceutical Co., Ltd.) was dissolved in this at 120 parts.
Dissolve at ~130°C and keep warm at 70-80°C.

To this, α5 moiety was added to TBA- in the same manner as in Example 1 to prepare a adjusted phenol.

Using this phenol, a cured resin product and a prepreg sheet were prepared in the same manner as in Example 1, and the properties of the resin were measured using the same. The results are shown in Table 1.

Examples 19 to 21 90 parts of bisphenol diglycidyl ether Ebokiku resin Hp-1oot (manufactured by Yuka Shell Epoxy Co., Ltd.),
65 parts of polyazelaic acid polyanhydride PAZ-90 (manufactured by Shin Nippon Rika Co., Ltd.) are dissolved at 70 to 120°C, and high molecular weight polyethylene glycol (molecular weight 20,000
, manufactured by Wako Tsumugi Pharmaceutical Co., Ltd.) at 120 to 130°C and kept at 70 to 80°C.

TEA-KO and 5 parts were added to this in the same manner as in Example 1 to obtain a controlled varnish. Example 1 using this varnish
A cured resin product and a prepreg sheet were prepared in the same manner as above, and various properties were measured using the same, and the results are shown in Table 2.

Examples 22-24 Bisphenolum diglycidyl ether epoxy resin 1!1P-834 (manufactured by Yuka Shell Epoxy Co., Ltd.) 90 parts and polyazelaic acid polyanhydride PAZ-90 (manufactured by Shinnihon Rika Co., Ltd.) 56 to 41 parts. was dissolved at 70 to 120°C, and 12 parts of high molecular weight caprolactone [Plaxel H-1 (molecular weight 10,000, manufactured by Daicel Chemical Co., Ltd.)] was added to the solution.
Dissolve at 0-130°C and keep warm at 70-80°C. To this, α5 part was added to TEA- in the same manner as in Example 1 to obtain a controlled varnish.

Using this varnish, a cured resin product and prepreg sheet were prepared in the same manner as in Example 1, and various properties were measured using the same. The results are shown in Table 2.

Comparative Example 1 70 parts of bisphenol A type epoxy resin Hp-1oot (manufactured by Yuka Shell Co., Ltd.), bisphenol type epoxy resin BP-8! 30 parts of S4 (manufactured by Yuka Fel Co., Ltd.) and dicyandiamide 5. ．． Using an epoxy resin varnish obtained by dissolving 1 part in 150 parts of toluene, a cured resin product and a prepreg sheet were prepared in the same manner as in Example 1, and various properties were measured. The results are shown in Table 2.

Table 2 From Table 6 above, Examples 1 to 24 of the present invention show flexibility in Shorem hardness at room temperature and bending properties of bar coils compared to Comparative Example 1, and the flexibility after curing is also poor in adhesive properties. is also sufficient.

Application Examples 1 to 4 90 parts of bisphenol deaf diglycidyl ether evoquine resin BP-854 (manufactured by Yuka Shell Epoxy Co., Ltd.) and 56 parts of polyazelaic acid polyanhydride PAZ-90 (manufactured by Shinnihon Rika Co., Ltd.) The high molecular weight polycaprolactone Plaxel H-1 molecular weight (to
, on-mouth) (manufactured by Daicel Chemical Co., Ltd.) (manufactured by Daicel Chemical Co., Ltd.) is mixed in, dissolved by heating, and kept at 70 to 80°C.

To this, in advance 10 parts of epoxy resin, caripol salt of triethylamine TEA-K (manufactured by Hokko Chemical Co., Ltd.) α
Dissolve 5 parts at 120-130℃ and reduce the temperature to 70℃.
A solvent-free varnish was prepared by adding the mixture at ~80°C and quickly mixing and dissolving it.

This varnish was cured by heat treatment for 120~b. This cured resin board (thickness 5cm)
The hardness was measured using a Shore A hardness meter at room temperature, and the results shown in Table 3 below along with other examples were obtained. Next, using this varnish, apply it to a glass cloth with a thickness [L05] that has been preheated to 60°C to 80°C, and overlay the laminated mica with a thickness of α1■ on the top surface and lightly press it. I wound it up into a roll while rotating it. Next, this product was left in a constant temperature bath at 60 to 80° C. for 1 to 3 days (this operation is called transfer) and then taken out to obtain a prepreg sheet.

This sheet II'i remained malleable for more than 6 months at 25°C and exhibited sufficient storage stability. In this case, the varnish content is preferably in the range of 20 to 60%. The reason for this is that if the tape is less than 20 mm, the adhesive strength will be insufficient when the insulating tape is wound around the conductor.

On the other hand, if it exceeds 61116, the adhesiveness increases and it becomes difficult to handle and insulation treatment work becomes difficult. This tape is wound around a copper plate and an insulating layer is applied to it.
Cure was allowed to proceed for the specified time. The bending strength of this insulator at room temperature was measured, and the values at strain 101, at which the bending strength became constant, are shown in Table 3. Although the insulating layer at this stage was not completely cured, it exhibited sufficiently satisfactory electrical properties. This tape was cut into a size of 15 x 50 m and two copper plate specimens (15 x 1
A shear adhesion test piece was obtained by sandwiching it between 20 pieces of paper and using clothespins, and the sample was cured at 120 to 180°C for a predetermined period of time. The tensile shear adhesive strength of this sample at room temperature was measured, and the results are shown in Table 3.

Application Examples 5 to 8 70 to 80 parts of bisphenol ha diglycidyl ether epoxy resin It was dissolved at 120°C, and high molecular weight polyethylene glycol molecular weight = 2 (L 0
Mix 30-90 parts of 0 G (manufactured by Wako Tsumugi Co., Ltd.) and make 120-
Dissolve by heating at 130°C and keep warm at 70-80°C. To this, in advance 10 parts of epoxy resin, triethylamine calibol salt TEA-K (manufactured by Hokko Kagakusha) (
70 to 8 parts of L5 dissolved at 120 to 130°C
The mixture was added at 0° C. and quickly mixed and dissolved to prepare a solvent-free varnish.

Using this varnish, a cured resin plate and a prepreg sheet were prepared in the same manner as in Application Example 1, and various properties were measured using the same, and the results are shown in Table 3.

Application Examples 9-12 Bisphenol diglycidyl ether ethoxy 1l
90 parts of lltKP-834 (manufactured by Yuka Shell Epoxy Co., Ltd.) and 56 parts of polyazelaic acid polyanhydride PAP (manufactured by Shin Nippon Rika Co., Ltd.) are dissolved at 70 to 120°C, and high molecular weight polyethylene glycol is added to the solution. = 7.500
(manufactured by Wako Tsumugi Co., Ltd.) 120-13 parts mixed with 30-90 parts
Dissolve by heating at 0°C and keep warm at 70-80°C.

In advance, 10 parts of epoxy resin was added to the caulibol salt of triethylamine TEA-K (manufactured by Hokko Chemical Co., Ltd.) IIL.
5 parts dissolved at 120-130℃ to 70-80%
℃ and quickly mixed and dissolved to prepare a solvent-free varnish.

Using this varnish, a cured resin plate and a prepreg sheet were prepared in the same manner as in Application Example 1, and various properties were measured using the same, and the results are shown in Table 3.

Application Examples 13-15 Bisphenol A diglycidyl ether epoxy resin 11! 90 parts of P-834 (manufactured by Yuka Shell Epoxy Co., Ltd.) and 62 to 41 parts of polyazelaic acid polyanhydride pApm (manufactured by Shin Nihon Rika Co., Ltd.) are dissolved at 70 to 120°C, and high molecular weight polyethylene is dissolved in this. Glycol molecular weight F7.50
0 (manufactured by Wako Tsumugi Yakuhin Co., Ltd.) is mixed therein, heated and dissolved at 120 to 130°C, and kept at 70 to 80°C.

To this, 7 parts of triethylamine Calibol salt T n A -K (Hokuko Kagakusha #) Q, dissolved in advance at 12Q to 130°C in 10 parts of epoxy resin, were added.
A solvent-free varnish was prepared by adding the mixture at a temperature of 0 to 80°C and quickly mixing and dissolving it.

Using this varnish, a cured resin plate and a prepreg sheet were prepared in the same manner as in Application Example 1, and the elastic properties were measured using the same. The results are shown in Table 3.

Application Examples 16 to 18 90 parts of bisphenol A diglycidyl ether epoxy resin EP-864 (Yuka Shell Epoxy Co., Ltd. fi),
41 parts of polyazelaic acid polyanhydride PAPA (manufactured by Shin Nihon Rika Co., Ltd.) are dissolved at 70 to 120°C, and 30 to 70 parts of high molecular weight polyethylene glycol Zs o o (manufactured by Wako Tsumugi Pharmaceutical Co., Ltd.) are mixed therein. Dissolve by heating at 120-130°C and keep warm at 70-80°C.

To this, 5 parts of triethylamine Calipol salt TEA-K (manufactured by Hokko Chemical Co., Ltd.) α was dissolved in 10 parts of epoxy resin at 120 to 130°C in advance at 7-0 to 80°C.
A non-narcotic varnish was prepared by quickly mixing and dissolving the mixture.

Using this varnish, a cured resin plate and a prepreg sheet were prepared in the same manner as in Application Example 1, and various properties were measured using these. The results are shown in Table 4.

Application Examples 19-21 Bisphenol A,! 90 parts of diglycidyl ether epochene resin Epicoat 1001 (manufactured by Yuka Shell Co., Ltd.) and polyazelaic acid polyanhydride PAPA (manufactured by Shinnihon Rika Co., Ltd.)
28 parts of polyethylene glyconyl is dissolved at 70 to 120°C, and 30 to 70 parts of high molecular weight polyethylene glyconyl with a molecular weight of 7.500 (manufactured by Wako Tsumugi Pharmaceutical Co., Ltd.) is mixed therein and dissolved by heating at 120 to 130°C to obtain a solution of 70 to 80 parts. Keep warm at ℃.

To this, 10 parts of epoxy resin was preliminarily mixed with triethylamine calibol [Tga-x(-1t).

(manufactured by Kokagakusha Co., Ltd.) [15 parts dissolved at 120 to 130°C were added at 70 to 80°C, and quickly mixed and dissolved to prepare a solvent-free varnish.

Using this varnish, a cured resin plate and a prepreg sheet were prepared in the same manner as in Application Example 1, and various properties were measured using these. The results are shown in Table 4.

Control Example 1 70 parts of bisphenol A epoxy resin BP-1001 (IK, manufactured by Yuka Shell Co., Ltd.), 30 parts of bisphenol A epoxy resin EP-834 (manufactured by Yuka Shell Co., Ltd.), and 11 parts of dianediamide were dissolved in 150 parts of toluene. Using the obtained epoxy resin varnish, a cured resin product and mica insulating tape were prepared in the same manner as in Application Example 1, and various properties were measured. The results are shown in Table 4.

Table 4 From Tables 3 and 4 above, application examples 1 to 21 of the present invention showed flexibility in both the Shore A hardness at room temperature and the bending properties of the bar coil, compared to control example 1. It has sufficient flexibility and adhesion. Therefore, it is easy to incorporate into the stator.

〔Effect of the invention〕

As described above in detail, the resin composition of the present invention retains both flexibility and adhesive properties even after curing, and is convenient for subsequent processing.

Furthermore, the mica prepreg according to the present invention is advantageous in that it has the above-mentioned compatible properties, and is also advantageous in that it is not sticky.

Claims (1)

[Claims] 1. A flexible epoxy resin composition comprising an epoxy resin, an acid anhydride curing agent, an accelerator, and a thermoplastic resin. 2. The flexible epoxy resin composition according to claim 1, wherein the epoxy resin is a bisphenol A epoxy resin and/or a flexible epoxy resin. 3. A patent claim in which the acid anhydride curing agent is at least one polyanhydride selected from the group consisting of intermolecular anhydrides such as polyazelaic acid polyanhydride, polyadipic acid polyanhydride, and polysebacic acid polyanhydride. The flexible epoxy resin composition according to item 1 or 2. 4. The flexible epoxy resin composition according to any one of claims 1 to 3, wherein the thermoplastic resin is polyglycol and/or polycaprolactone. 5. The flexibility according to any one of claims 1 to 4, wherein the accelerator is at least one selected from the group consisting of Calibol salt of triethylamine, imidazole, and boron trifluoride complex. Epoxy resin composition. 6. A mica characterized by being made by impregnating a laminated mica with a fibrous or film-like base material as a backing material and a resin composition containing an epoxy resin, an acid anhydride curing agent, an accelerator, and a thermoplastic resin. prepreg. 7. The mica prepreg according to claim 6, wherein the epoxy resin is a bisphenol A epoxy resin and/or a flexible epoxy resin. 8. A patent claim in which the anhydrous acid curing agent is at least one polyanhydride selected from the group consisting of intermolecular anhydrides: polyazelaic acid polyanhydride, polyadipic acid polyanhydride, and polysebacic acid polyanhydride. The mica prepreg according to item 6 or 7. 9. The mica prepreg according to any one of claims 6 to 8, wherein the thermoplastic resin is polyglycol and/or polycaprolactone. 10. The accelerator is Calibol salt of triethylamine,
The mica prepreg according to any one of claims 6 to 9, which is at least one selected from the group consisting of imidazole and boron trifluoride complex.