JPS61254262A - Dehydration apparatus - Google Patents

Abstract

PURPOSE:To enhance the dehydration capacity of a substrate, by efficiently contacting a substrate such as a semiconductive substrate with a gas stream at the time of rotation in such a state that said substrate is supported so as to be inclined with respect to a rotary surface. CONSTITUTION:A substrate cassette 3 is attached to a rotary frame body 5 so that semiconductive substrates 4 cross the rotary surface of the rotary frame body 5. Therefore, when the rotary frame body 5 is rotated, the drying gas supplied from the blow-off port 2 of the drying gas supply pipe 1 extending to the interior of the frame body 5 along the rotary shaft of said frame body is directly contacted with the lower side main surface of each semiconductive substrate 4 and formed into a gas stream by the rotation of the substrates 4 and this gas stream is also contacted with the substrates 4 to further enhance dehydration effect.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a dehydrating apparatus for substrates such as semiconductor substrates.

Prior Art FIG. 3 shows a conventional centrifugal dehydration apparatus for (semiconductor) substrates. In the figure, 11 is a dry gas supply pipe, 12 is a gas outlet, 13 is a substrate cassette that supports a substrate such as a semiconductor substrate, 14 is a semiconductor substrate to be processed, and 15 is a rotating frame. The supply pipe 11 extends into the rotating frame 15 along the rotation axis of the rotating frame 15, and has air outlets 12 provided at predetermined intervals. The substrate cassette 13 is attached to support the substrate 14 in parallel to the rotating surface of the rotating frame 15.

Centrifugal force generated by high-speed rotation of a substrate parallel to the direction of rotation is insufficient for dehydrating the substrate. Therefore, as shown in FIG. 3, at the same time as exhausting the gas in the rotating frame 15, dry gas is blown onto the semiconductor substrate 14 from the air outlet 12, or the dry gas is sucked, thereby causing the semiconductor substrate 14 to rotate. In addition to the centrifugal force caused by the semiconductor substrate 14
The structure is such that water can also be dehydrated by contact with drying gas.

Problems to be Solved by the Invention In order to improve the performance of the dehydration device, dehydration can be performed uniformly over the entire substrate, that is, the uniformity of dehydration of moisture on the substrate and the reduction of dehydration time can be raised. Here, the dehydration effect due to the centrifugal force acting on the substrate and the contact between the substrate and the drying gas as described above is still insufficient, and element defects due to non-uniform dehydration cannot be avoided.

Means for Solving the Problems In order to solve the problems as shown above, the present invention provides the following:
It is equipped with a support part that supports the substrate at an angle with respect to the rotating surface, so that the gas flow generated by rotation directly hits the substrate, and furthermore, this gas flow can be used to more efficiently exhaust the inside of the tank. I made it.

Function According to the present invention, since the substrate comes into contact with the gas flow generated by the high-speed rotation of the substrate itself, this dehydration effect and more efficient exhaust are achieved.
[52 Water effect is improved. That is, since moisture on the substrate is removed more uniformly in a shorter time, the occurrence of device defects due to non-uniformity of moisture on the substrate, which could not be avoided with conventional dehydration equipment, is reduced.

Embodiments Hereinafter, embodiments of the present invention shown in the attached drawings will be described in detail.

FIGS. 1 and 2 are cross-sectional views of an embodiment of the substrate dehydrating apparatus according to the present invention. In the figure, 1 is a drying gas supply pipe, 2 is a drying gas outlet, 3 is a substrate force hit (supporting part) that supports a substrate such as a semiconductor substrate, and 4 is a drying gas supply pipe.
is a semiconductor substrate, 5 is a rotating frame body to which a substrate cassette 3 is attached, and the arrow is the rotation direction of the rotating frame body 5.

The supply pipe 1 extends into the rotating frame 5 along the rotation axis of the rotating frame 5, and has air outlets 2 provided at predetermined intervals.

The substrate cassette 3 is attached (pull) so as to support the semiconductor substrate 4 in a direction that crosses the rotating surface of the rotating frame 5 (a surface perpendicular to the rotating axis).

Therefore, when the rotating frame 5 rotates, the semiconductor substrate 4 generates a gas flow, and at the same time, its principal surface comes into direct contact with the gas flow. Note that the main surface of the semiconductor substrate 4 is the lower side.

Effects of the Invention As described above, in the present invention, since the main surface of the substrate is directly contacted with the drying gas and the gas flow generated by the rotation of the substrate, the dehydration effect on the substrate is further increased, and the dehydration uniformity of moisture on the substrate is improved. will improve. Therefore, it is possible to reduce device defects caused by non-uniform dehydration of moisture on the substrate.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of an embodiment of the substrate dehydrating apparatus according to the present invention, and FIG. 3 is a cross-sectional view of a conventional dehydrating apparatus. 1...Dry gas supply pipe 2...Dry gas outlet 3...Substrate cassette 4...Semiconductor substrate 5.
... Rotating frame patent applicant Matsushita Electronics Co., Ltd. Figure 1 Figure 2

Claims (1)

[Claims] A dewatering device characterized in that a support portion for supporting a substrate is provided within a rotating frame so that the substrate is supported at an angle with respect to a rotating surface.