JPH04100231A - Cleaning device - Google Patents

Abstract

PURPOSE:To remove the water marks by a method wherein the title cleaning device is fitted with a spinning part for spinning a wafer horizontally arranged in a chamber to feed pure water or chemical solution from a nozzle for cleaning up and drying the water, lower exhaust ports below the wafer arrangement position in the spinning part as well as a suction port on the central part above the wafer arrangement position. CONSTITUTION:A chuck 1 and a wafer 3 are spinned by spinning a spinning axle 1. The pure water from a nozzle 4 to the wafer central part slides over the wafer surface to be discharged from the wafer 3 by centrifugal force for cleaning the wafer surface. In order to dehydrate for drying up the wafer 3 by rapid spinning step, the even laminar air 7 is fed from a suction port 5 at the chamber upper part to exhaust ports 6 producing sliding air flow from the wafer central part over the surface in the process. When there is no air flow on the wafer surface, water marks 8 remain on the central part at the low centrifugal velocity while when the turbulence occurs, the water marks 8 are apt to remain on the parts other than the wafer central part. Accordingly, the even laminar air 7 is fed from the suction port 5 to the wafer central part so that the water marks 8 may gradually disappear to finish the drying up step.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device. In particular, it is an effective cleaning device that enables high reliability of LSI.

[Conventional technology]

In conventional cleaning equipment for LSI manufacturing, cleaning and drying are separated. Furthermore, in the case of centrifugal drying, it is difficult to control the exhaust air because it is a batch process, and it is impossible to avoid turbulence in the air flow (airflow) over all the wafer surfaces.

[Problem to be solved by the invention]

In the conventional method, 1. When the wafers are removed from the cleaning tank and centrifuged for drying in batch processing, there is no exhaust control, so the flow of air (airflow) between wafers to the wafer surface is irregular. Therefore, there is a problem in that water droplets remain locally, forming stains (water marks) and generating foreign matter on the wafer surface. Watermarks also occur during the transfer of wafer patches from the cleaning tank to the dryer. The present invention aims at removing this watermark.

[Means to solve the problem]

In the present invention, in order to solve such conventional problems, wafer cleaning and drying are performed continuously in the same chamber.

In the cleaning apparatus according to the invention, the wafer is placed horizontally on a rotating body. Further, a chemical solution or pure water is supplied from a nozzle to the wafer surface on the rotating body to clean the wafer. At this time, Ueno-- does not need to be rotated. After the chemical solution or pure water has been supplied, the wafer can be centrifuged and dried by rotating the wafer.

In the present invention, by installing a cylindrical intake hole in the center of the upper part of the wafer arrangement position and an exhaust hole in the lower part of the wafer arrangement position of the rotating part, a laminar air flow is generated in the chamber. Provides even air flow to the surface. No atmospheric turbulence occurs on the wafer surface during wafer cleaning and drying. This avoids the occurrence of water marks due to water droplets remaining on the upper surface of the wafer.

〔Example〕

Embodiments of the present invention will be shown using FIGS. 1 to 5.

1 to 3 are cross-sectional views and air flow inside the chamber according to the present invention.

In FIG. 1, the chuck 2 and the wafer 5 rotate as the rotating shaft 1 rotates. When pure water is supplied from the nozzle 4 toward the center of the wafer, the pure water slides on the wafer surface and is discharged from the wafer by centrifugal force, thereby cleaning the wafer surface. In the cleaning apparatus according to the present invention, as shown in FIG. 2, when wafers are dehydrated and dried at high speed rotation, a uniform laminar flow of air 7 is supplied from the intake hole 5 at the top of the chamber toward the exhaust hole 6. During this process, a sliding air flow is generated from the center of the wafer. When there is no air flow on the wafer surface, water droplets 8 remain at the center of the wafer where the circumferential velocity is low. Furthermore, when turbulence occurs, water droplets tend to remain in places other than the center of the wafer. In the present invention, as shown in FIG. 5, a uniform laminar flow of air 7 is supplied from the air intake hole 5 toward the center of the wafer, and the water droplets 8 gradually disappear to complete drying.

〔Effect of the invention〕

According to the present invention, water droplets 7 remaining on the Uenoshima surface can be removed not only by the centrifugal force caused by rotation (but also by applying the force of a clean air flow supplied from the air intake holes) to remove stains (water marks) caused by remaining water droplets. ) can be avoided.

As explained above, the cleaning apparatus of the present invention improves the reduction in LSI yield caused by watermarks.

８・・・・・・・・・Drops of water that's all Applicant: Seiko Epson Corporation Agent: Patent attorney Kisanbe Ehon (1 other person)

[Brief explanation of drawings]

1 to 5 are cross-sectional views and diagrams showing the operating mechanism of the cleaning device of the present invention. 1...Rotary shaft 2...Chuck 5...Wafer 4...Pure water supply nozzle 5 ......Intake hole 6...Exhaust hole 7...Air flow (airflow)

Claims (1)

[Claims] In a cleaning device for IC manufacturing, a rotating part rotates a wafer placed horizontally in a chamber, supplies pure water or a chemical solution from a nozzle, and cleans and dries the wafer surface, and a lower part of the rotating part where the wafer is placed. A cleaning device characterized by having an exhaust hole and an intake hole in the center above the wafer arrangement position.