JPS61252143A - Manufacture of transparent conductive film - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a method for producing a transparent conductive film.

(Prior Art) Conventionally, transparent conductive glass, in which a transparent conductive IR film is formed on a glass plate, has been used as electrodes for displays such as liquid crystal, EL, and electrochromic, electrodes for solar cells, antistatic, and N!
It is used for I-wave blocking, etc.

However, since transparent conductive glass uses a glass plate as a base material, it is inferior in flexibility, workability, and impact resistance, and is often undesirable depending on the application. For this reason, transparent conductive films that use polymer film as a base material instead of glass plates have recently attracted attention, and are now being used for electrodes of transparent switches in input/output devices, which was not possible with transparent conductive glass. It started to happen.

However, polymer films usually have much lower heat resistance than glass plates, so they are heated to a high temperature of 200 degrees Celsius or more while being heated to a transparent conductor. A method of forming a film cannot be used. For this reason, when forming a transparent conductive film using a vacuum evaporation method, it is first deposited at a low temperature to form a high-resistance, opaque film, and then post-treated at a temperature that the polymer film can withstand for a long period of time. It is necessary to perform a thermal oxidation treatment to create a low-resistance, transparent film. Furthermore, when depositing a film using ion blasting or sputtering, a film with lower resistance and higher pass rate can be obtained compared to vacuum evaporation. is being carried out.

(Problem to be Solved by the Invention) However, when a polymer film with a transparent conductive film formed on one side is heated, the thermal shrinkage rate differs greatly between the side on which the transparent conductive film is formed and the opposite side. It has the disadvantage of curling, and also has the disadvantage that low molecular weight components precipitate from the opposite side, resulting in a cloudy film surface. For this purpose, there is a method in which the heating temperature is set to a relatively low temperature, but this method has the drawback that the heating time is long and the manufacturing time is time-consuming.

In addition, when a transparent conductive film is used as an electrode for a transparent switch, not only the mechanical durability of the transparent conductive layer but also the abrasion resistance of the back surface on the opposite side of the film are required, but conventional methods However, this had the disadvantage that sufficient wear resistance could not be obtained and it was easily damaged.

The object of the present invention is to provide a method for producing a transparent conductive film that can improve the above-mentioned drawbacks, prevent curling, improve the abrasion resistance of the back surface, and be produced in a short time.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a transparent conductive film manufacturing method in which a transparent conductive film is formed on one side of a polymer film. The present invention provides a method for producing a transparent conductive film, characterized in that a back layer is formed on the surface opposite to the film-forming surface and then heat-treated.

(Function) That is, in the present invention, [n20
While forming a transparent conductor IIn consisting of s, etc., on the other side) n20s, Sn02, ALzOs,
Zt”Oz, CuS, RuO, Si02.

T+ 02, ZnO, ZnS, MgF
, An, Ag.

A back layer containing Pd, Pt, etc. as the main component is formed, and then heat treatment is performed.The heat shrinkage rate on both sides of the film can be made to be the same or close to it, which prevents curling. The back layer can prevent precipitation of low molecular weight components from within the film, thereby preventing clouding and improving abrasion resistance.Furthermore, since heat treatment can be performed at a relatively high temperature, manufacturing time can be shortened.

(Example) Hereinafter, the present invention will be explained based on examples.

A polyethylene terephthalate film with a thickness of 100 μm was used as the polymer film, and a transparent conductive film was formed on one side of the film by high frequency ion blating under the following conditions.

a) Base material temperature Room temperature b) Evaporation material In -5wt%3nc) RF power 500W d) Film formation speed 15 people 7 seconds e) Film thickness 1000A Then, oxygen gas is injected into the tank at a pressure of 5 x 10 = Torr. .

After forming a transparent conductive film on one side of the polyethylene terephthalate film, the other side is coated with a thickness of 10 mm by electron beam evaporation.
Form 00 S+02 membranes.

After forming the 5iQz film, the film was placed in the air at a temperature of 1
Heat at 70°C for 60 minutes.

When the deformation of the film was observed during the heat treatment, no curling occurred and no clouding was observed.

Also, transparent guide 1! Seal the membrane and S+02 membrane with gauze for 10 minutes.
Although it was rubbed 1000 times with a pressure horn of 0 g/cIi, no damage was caused to the surface.

As Comparative Example 1, a transparent conductive film was formed on a polyethylene terephthalate film under the same conditions as in the above example, and then heat-treated under the same conditions as in the example without forming 5i0211, resulting in curling and clouding. Furthermore, when both sides of the film were rubbed with gauze under the same conditions as in Examples, the transparent conductive film was not damaged, but scratches were found on the opposite side.

In addition, as Comparative Example 2, transparent ml was applied to a polyethylene terephthalate film under the same conditions as in the example. and S'+O
Using a transparent conductive film that forms a Z film and does not undergo heat treatment, both film surfaces are covered with gauze at a pressure of 100 g/ai.
When rubbed 00 times, scratches occurred on both film surfaces.

(Effects of the Invention) As described above, according to the present invention, a transparent conductor is formed on one side of a polymer film, a back layer is formed on the other side, and then heat treatment is performed to prevent curling due to heat treatment. A method for producing a transparent conductive film that is free from cloudiness, has excellent mechanical strength on both the conductive surface and the back surface, and can shorten the production time is obtained.

Patent applicant: Hitachi Capacitor Co., Ltd. Procedural amendment (voluntary) May 14, 1985

Claims (2)

[Claims] (1) In a method for manufacturing a transparent conductive film in which a transparent conductive film is formed on one side of a polymer film, heat treatment is performed after forming a back layer on the side opposite to the transparent conductive film forming side of the polymer film. A method for manufacturing a transparent conductive film. (2) Back layer is In_2O_3, SnO_2, Al_
2O_3, ZrO_2, CuS, RuO, SiO_2,
TiO_2, ZnO, ZnS, MgF, An, Ag, P
The method for producing a transparent conductive film according to claim 1, which contains at least one of Pt and Pt as a main component.