JPS61250200A - Production of developer holding member - Google Patents

Production of developer holding member

Info

Publication number
JPS61250200A
JPS61250200A JP8870685A JP8870685A JPS61250200A JP S61250200 A JPS61250200 A JP S61250200A JP 8870685 A JP8870685 A JP 8870685A JP 8870685 A JP8870685 A JP 8870685A JP S61250200 A JPS61250200 A JP S61250200A
Authority
JP
Japan
Prior art keywords
holding member
developer holding
developer
acidic solution
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8870685A
Other languages
Japanese (ja)
Inventor
Shinichi Takano
高野 晋一
Shigeaki Nakada
中田 維明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8870685A priority Critical patent/JPS61250200A/en
Publication of JPS61250200A publication Critical patent/JPS61250200A/en
Pending legal-status Critical Current

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  • Magnetic Brush Developing In Electrophotography (AREA)

Abstract

PURPOSE:To produce an adequate developer holding member by subjecting a non-magnetic material to AC electrolytic etching at an optional frequency in an acidic soln. to form fine pores on the surface thereof and using such metal as a sleeve for a developing device. CONSTITUTION:The developer holding member 7 to be subjected to the etching treatment and a counter electrode 8 are immersed into an acidic soln. 6 (2-6pH) consisting of a hydrochloric acid and sulfuric acid compounded at a prescribed ratio and are connected to an external power source 9. Oxygen is substantially satd. in the soln. 6 and thereafter the liquid temp. is kept at 30-100 deg.C by a heater 11. AC current or pulse current is impressed from the power source to the member and electrode at <=50A/dm<2>, by which the surface of the developer holding member is etched. The developer holding member which has the surface roughness equiv. to the surface roughness by a mechanical surface treatment method and on the surface of which a fine polishing agent, etc., do not exist at all is thus obtd.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、複写機用現像装置に使用される現像剤保持部
材の製造方法に関し、さらに詳述すれば、スリーブと呼
ぶ現像剤保持部に用いられるアルミニウム、アルミニウ
ム合金、非磁性ステンレス鋼等の現像剤保持部材の表面
処理に関するものである。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing a developer holding member used in a developing device for a copying machine, and more specifically, to a method for manufacturing a developer holding member called a sleeve. The present invention relates to surface treatment of a developer holding member made of aluminum, aluminum alloy, nonmagnetic stainless steel, or the like.

(従来の技術) まず、複写機の一般的な現像装置の構造について第5図
により説明する。同図において、複写機の現像装置は、
電荷による潜像を保持している感光体1に相対向するよ
うに、磁性体からなる磁石ロール2の外周にあって反時
計方向に回転し、現像剤3を上記感光体1と対向する位
置に搬送するスリーブ4が配置され、さらに、このスリ
ーブ4の出口に、スリーブ4の表面に吸引される現像剤
の厚さを規制するブレード5が配設されたものである。
(Prior Art) First, the structure of a general developing device of a copying machine will be explained with reference to FIG. In the figure, the developing device of the copying machine is
A position on the outer periphery of a magnet roll 2 made of a magnetic material that rotates counterclockwise so as to face the photoreceptor 1 holding a latent image due to an electric charge, so as to place the developer 3 at a position facing the photoreceptor 1. A sleeve 4 is disposed to convey the developer, and a blade 5 is further disposed at the outlet of the sleeve 4 to regulate the thickness of the developer sucked onto the surface of the sleeve 4.

このような現像装置のスリーブ4は、その表面の現像剤
の搬送能力が高いように、微細な凹凸が形成されている
The sleeve 4 of such a developing device has fine irregularities formed on its surface so as to have a high developer transporting ability.

スリーブ4に用いられる現像剤保持部材の表面仕上げは
、機械的な工作法によっていた。適当な表面粗さとなる
ように、粒径がある範囲内にある定形又は不定形の硬質
粒子を吹き付けるサンドブラスト法(例えば、特開昭5
8−58163号公報)、あるいは、砥石又は紙やすり
で研磨する方法(特開昭56−113172号公報)等
が提案されている。これらの方法により、ピッチが2μ
閣ないし50μm、平均径が0.1μmないし10μm
の凹凸を有する表面とし、現像剤の搬送力を向上し、か
つ安定させることによって、長期にわたる画質の向上と
安定が得られるとされている。
The surface finishing of the developer holding member used in the sleeve 4 was done by a mechanical working method. A sandblasting method (for example, Japanese Patent Application Laid-Open No. 5-11311) involves spraying fixed or irregularly shaped hard particles with a particle size within a certain range in order to obtain an appropriate surface roughness.
8-58163), or a method of polishing with a grindstone or sandpaper (Japanese Patent Application Laid-open No. 113172/1982). With these methods, the pitch can be reduced to 2μ.
diameter to 50μm, average diameter 0.1μm to 10μm
It is said that improved and stable image quality can be obtained over a long period of time by creating a surface with irregularities, improving and stabilizing the developer conveying force.

(発明が解決しようとする問題点) しかしながら、上記の機械的工作法による表面処理では
、処理の際に使用した硬質粒子あるいは研磨剤が現像剤
保持部材の表面に付着したまま。
(Problems to be Solved by the Invention) However, in the surface treatment using the above mechanical working method, hard particles or abrasives used during the treatment remain attached to the surface of the developer holding member.

これを用いて成形したスリーブ4の表面に残留している
可能性が極めて高い。
There is a very high possibility that it remains on the surface of the sleeve 4 molded using this.

このようなスリーブ4を用いた現像装置では、スリーブ
4の表面で搬送された現像剤3が、ブレード5によって
付着厚さが均一化され、感光体1に対向する位置で感光
体1の表面に形成された潜像の電荷による静電気力によ
って感光体1に移動する時にスリーブ4の表面に残留す
る微細な硬質粒子又は研磨剤が、現像剤3との接触およ
び摩擦によって脱落し、現像剤3とともに感光体1に移
動し、感光体1を損傷し、その性能を劣化させる危険が
高い。
In a developing device using such a sleeve 4, the developer 3 conveyed on the surface of the sleeve 4 has a uniform adhesion thickness by the blade 5, and is deposited on the surface of the photoreceptor 1 at a position facing the photoreceptor 1. Fine hard particles or abrasives remaining on the surface of the sleeve 4 when moving to the photoreceptor 1 due to the electrostatic force caused by the charge of the formed latent image fall off due to contact and friction with the developer 3, and are removed together with the developer 3. There is a high risk of the particles migrating to the photoreceptor 1, damaging the photoreceptor 1, and deteriorating its performance.

本発明は上記の問題点を解決するもので、微細な硬質粒
子又は研磨剤が残留しないスリーブを得る現像剤保持部
材の表面処理法を提供しようとするものである。
The present invention solves the above problems and provides a method for surface treatment of a developer holding member to obtain a sleeve in which fine hard particles or abrasives do not remain.

(問題点を解決するための手段) 上記の問題点を解決するために1本発明は、環境酸化剤
とハロゲンイオンの混存する酸性溶液中よって電解エツ
チングし1機械的な表面処理法と同等な表面粗さと形状
を得ようとするものである。
(Means for Solving the Problems) In order to solve the above-mentioned problems, 1. the present invention employs electrolytic etching in an acidic solution in which an environmental oxidizing agent and halogen ions coexist. The objective is to obtain surface roughness and shape.

(作 用) エツチングは、通常、表面を平滑にするために用いられ
るが1本発明では、酸化剤とハロゲンイオンが存在する
酸性溶液中では、化学的に不均一に溶解し表面が粗くな
る金属を用い、さらに、順逆方向の電流をパルス状に流
すことによって、溶解と析出を繰り返させることにより
機械的な表面処理と類似の表面を得るものである。
(Function) Etching is normally used to smooth the surface; however, in the present invention, etching can chemically dissolve unevenly in an acidic solution containing an oxidizing agent and halogen ions, resulting in a rough surface. A surface similar to that obtained by mechanical surface treatment is obtained by repeating dissolution and precipitation by passing a current in a forward and reverse direction in a pulsed manner.

このような電気化学的な表面処理では、硬質粒子又は研
磨剤を使用しないので、これが現像剤保持部材の表面に
残留することはない。また、直流エツチングと異なり、
電流の大きさのほか、電流波形も規制要素の一つとなり
1表面の形状に対応して選択の幅が広がる利点がある。
Since such electrochemical surface treatment does not use hard particles or abrasives, they do not remain on the surface of the developer retaining member. Also, unlike DC etching,
In addition to the magnitude of the current, the current waveform is also one of the regulating factors, which has the advantage of widening the range of selection depending on the shape of one surface.

(実施例) 本発明による現像剤保持部材の電気化学的な表面処理装
置について、第1図により説明する。同図において、塩
酸(HCIり10%、硫酸(HtSOJo、07%の酸
性溶液6の中に、エツチング処理を施す現像剤保持部材
7および対極8を浸漬した後、これらに流す電流の波形
と時間を制御する外部電源9に接続して回路を形成し、
さらに、上記の溶液6を撹拌する撹拌機ioと、溶液6
の温度を上げる加熱器11とを設けたものである。
(Example) An electrochemical surface treatment device for a developer holding member according to the present invention will be explained with reference to FIG. In the figure, after a developer holding member 7 and a counter electrode 8 to be subjected to etching treatment are immersed in an acidic solution 6 containing 10% hydrochloric acid (HCI) and 7% sulfuric acid (HtSOJo), the waveform and time of the current applied to them are shown. form a circuit by connecting to an external power supply 9 that controls the
Furthermore, a stirrer io that stirs the solution 6, and a stirrer io that stirs the solution 6,
A heater 11 is provided to raise the temperature.

溶液6に十分酸素を飽和して、加熱器11により液温を
45℃に保って、第3図に示すように、0.4A/cd
の陽極電流密度Ia、陰極電流密度Icおよび休止をそ
れぞれ10m5の時間、周期的に繰り返して、現像剤保
持部材7に表面処理を施した。
The solution 6 is sufficiently saturated with oxygen, and the temperature of the solution is maintained at 45°C by the heater 11, and the temperature is 0.4A/cd as shown in FIG.
The anode current density Ia, the cathode current density Ic, and a pause were periodically repeated for a period of 10 m5 to perform surface treatment on the developer holding member 7.

第4図は1本実施例の現像剤保持部材7であるアルミニ
ウム箔の表面に生じるエツチング孔径およびその密度と
陰極電流密度Icとの関係を示したもので、横軸は陰極
電流密度A/aJ、縦軸はエツチング孔径μmとエツチ
ング孔密度/μボである。
FIG. 4 shows the relationship between the diameter and density of etched holes formed on the surface of the aluminum foil, which is the developer holding member 7 of this embodiment, and the cathode current density Ic, where the horizontal axis is the cathode current density A/aJ. , the vertical axis is the etching hole diameter μm and the etching hole density/μm.

同図に示したように、陰極電流一度Icが大きくなるに
従って、エツチング孔径は小さくなり、逆に孔密度は高
くなる。また、陰極電流密度が極めて小さい時は、直流
電解エツチングによって形成される表面に類似する。
As shown in the figure, as the cathode current Ic increases, the etching pore diameter decreases and, conversely, the pore density increases. Also, when the cathode current density is extremely low, it resembles a surface formed by direct current electrolytic etching.

第2図(a)および(b)に、それぞれ直流電解エツチ
ングおよびパルス電解エツチングによる表面処理を施し
た表面の断面図を示す、第2図(b)から判るように、
パルス電解エツチングによる表面処理は、機械的表面処
理と同等の表面粗さが得られ。
FIGS. 2(a) and 2(b) show cross-sectional views of surfaces treated by DC electrolytic etching and pulsed electrolytic etching, respectively. As can be seen from FIG. 2(b),
Surface treatment using pulsed electrolytic etching provides surface roughness equivalent to mechanical surface treatment.

粉体である現像剤がスリーブの表面の孔に目詰りを起す
心配なしに、搬送力を向上できる。
The conveying power can be improved without worrying that the developer powder will clog the holes on the surface of the sleeve.

また、第4図は、第3図に示したパルス形状のままで、
規制要素である陰極電流密度Icとエツチングされる孔
径および孔密度の関係を示したものであるから、現像剤
保持部材7として適当な平均粗さ径0.1μmないし1
0μmを得る陰極電流密度Icは0.2A/ad以下が
得られる。
In addition, Fig. 4 shows the pulse shape shown in Fig. 3 as it is,
This shows the relationship between the cathode current density Ic, which is a regulating element, and the etched pore diameter and pore density.
The cathode current density Ic for obtaining 0 μm is 0.2 A/ad or less.

(発明の効果) 本発明の表面処理方法によれば、機械的表面処理による
表面形状と同等で、現像装置のスリーブに用いて好適な
表面粗さを有し、しかも表面に微細な硬質粒子又は研磨
剤の全く存在しない現像剤保持部材を得ることができ、
これを装備する複写機の品質の安定と寿命の向上に著し
い効果がある。
(Effects of the Invention) According to the surface treatment method of the present invention, the surface shape is equivalent to that obtained by mechanical surface treatment, the surface roughness is suitable for use in the sleeve of a developing device, and the surface has fine hard particles or It is possible to obtain a developer holding member that does not contain any abrasive,
This has a significant effect on stabilizing the quality and improving the lifespan of copying machines equipped with this.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明によるパルス電解エツチングによる表面
処理用電解槽の構成図、第2図(a)および(b)はそ
れぞれ直流電解エツチングおよびパルス電解エツチング
によるアルミニウム材の表面の拡大断面図、第3図は実
施例におけるパルス電流の形状図、第4図は第3図の波
形で陰極電流密度とエツチング表面との関係図、第5図
は複写機の現像装置の構造を示す断面図である。 1 ・・・感光体、 2・・・磁石ロール、 3・・・
現像剤、 4 ・・・スリーブ、 5 ・・・ブレード
。 6・・・酸性溶液、 7・・・現像剤保持部材、8・・
・対極、 9 ・・・外部電源、10・・・撹拌機。 11・・・加熱器、  Ia・・・陽極電流密度、  
Ic・・・陰極電流密度。 第1図 「「α■トー11 第2図 (a) (b) 第3図 第4図 18fIl流ffi度 (A/cm2)4−−一人 5−一一フ リーア ゛し−ド
FIG. 1 is a block diagram of an electrolytic cell for surface treatment by pulse electrolytic etching according to the present invention, and FIGS. Fig. 3 is a diagram of the shape of the pulse current in the example, Fig. 4 is a diagram of the relationship between the cathode current density and the etching surface using the waveform of Fig. 3, and Fig. 5 is a cross-sectional view showing the structure of the developing device of the copying machine. . 1...Photoreceptor, 2...Magnet roll, 3...
Developer, 4...Sleeve, 5...Blade. 6... Acidic solution, 7... Developer holding member, 8...
- Counter electrode, 9... external power supply, 10... stirrer. 11... Heater, Ia... Anode current density,
Ic...Cathode current density. Figure 1 ``α ■ To 11 Figure 2 (a) (b) Figure 3 Figure 4 Figure 18fIl flowffi degree (A/cm2) 4-- per person 5-11 free hand

Claims (4)

【特許請求の範囲】[Claims] (1)非磁性金属を酸性溶液中で任意の周波数で交流電
解、あるいは任意の衝撃係数で休止又は逆電流を印加す
るパルス電解エッチングし、表面に微細な孔を形成させ
ることを特徴とする現像剤保持部材の製造方法。
(1) Development characterized by forming fine pores on the surface of a non-magnetic metal by performing alternating current electrolysis at an arbitrary frequency in an acidic solution, or pulse electrolytic etching by applying a pause or reverse current at an arbitrary impact coefficient. A method for manufacturing a drug holding member.
(2)酸性溶液をpH−2ないし6、液温を30℃ない
し100℃の範囲とし、交流電解およびパルス電解エッ
チングの印加電流が共に50A/cm^2以下であるこ
とを特徴とする特許請求の範囲第(1)項記載の現像剤
保持部材の製造方法。
(2) A patent claim characterized in that the pH of the acidic solution is -2 to 6, the liquid temperature is in the range of 30°C to 100°C, and the applied current for both AC electrolysis and pulsed electrolytic etching is 50A/cm^2 or less A method for manufacturing a developer holding member according to item (1).
(3)酸性溶液に、硝酸、過酸化水素、過塩素酸塩類、
重クロム酸塩類、過マンガン酸塩類、酸素等の環境酸化
剤、硫酸又はその塩類および3価の鉄イオンを一種又は
それ以上を濃度が10^−^mol/lないし10mo
l/lの範囲になるように添加したことを特徴とする特
許請求の範囲第(1)項記載の現像剤保持部材の製造方
法。
(3) In the acidic solution, nitric acid, hydrogen peroxide, perchlorates,
Dichromates, permanganates, environmental oxidizing agents such as oxygen, sulfuric acid or its salts, and one or more trivalent iron ions at a concentration of 10^-^mol/l to 10mol
The method for manufacturing a developer holding member according to claim 1, wherein the amount of the developer is added in a range of 1/1.
(4)酸性溶液に、ハロゲンもしくはハロゲン基等の攻
撃性陰イオンを一種又はそれ以上、濃度が10^−^3
mol/lないし10mol/lの範囲になるように添
加した特許請求の範囲第(1)項ないし第(3)項のい
ずれか1項記載の現像剤保持部材の製造方法。
(4) Adding one or more types of aggressive anions such as halogens or halogen groups to an acidic solution at a concentration of 10^-^3
The method for manufacturing a developer holding member according to any one of claims (1) to (3), wherein the additive is added in a range of mol/l to 10 mol/l.
JP8870685A 1985-04-26 1985-04-26 Production of developer holding member Pending JPS61250200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8870685A JPS61250200A (en) 1985-04-26 1985-04-26 Production of developer holding member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8870685A JPS61250200A (en) 1985-04-26 1985-04-26 Production of developer holding member

Publications (1)

Publication Number Publication Date
JPS61250200A true JPS61250200A (en) 1986-11-07

Family

ID=13950329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8870685A Pending JPS61250200A (en) 1985-04-26 1985-04-26 Production of developer holding member

Country Status (1)

Country Link
JP (1) JPS61250200A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6394461U (en) * 1986-12-09 1988-06-17
US6157803A (en) * 1998-11-06 2000-12-05 Fuji Xerox Co., Ltd. Developing unit and developing roll contained therein
JP2010128269A (en) * 2008-11-28 2010-06-10 Panasonic Corp Developing roll, method for manufacturing the same, and printing device
JPWO2009008273A1 (en) * 2007-07-09 2010-09-09 住友金属鉱山株式会社 Printed wiring board manufacturing method and printed wiring board obtained by the manufacturing method
JPWO2009034764A1 (en) * 2007-09-10 2010-12-24 住友金属鉱山株式会社 Printed wiring board manufacturing method and printed wiring board obtained by the manufacturing method
US8178188B2 (en) 2001-04-20 2012-05-15 Panasonic Corporation Base layer for manufacturing an electronic component by an etching process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5156745A (en) * 1974-11-15 1976-05-18 Fuji Satsushi Kogyo Kk Aruminiumu oyobi aruminiumugokinno hyomenchoseihoho
JPS5536280A (en) * 1978-09-08 1980-03-13 Mitsubishi Rayon Co Ltd Plastic molding bearing metal thin film on surface and their production
JPS55140858A (en) * 1979-04-20 1980-11-04 Canon Inc Developing unit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5156745A (en) * 1974-11-15 1976-05-18 Fuji Satsushi Kogyo Kk Aruminiumu oyobi aruminiumugokinno hyomenchoseihoho
JPS5536280A (en) * 1978-09-08 1980-03-13 Mitsubishi Rayon Co Ltd Plastic molding bearing metal thin film on surface and their production
JPS55140858A (en) * 1979-04-20 1980-11-04 Canon Inc Developing unit

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6394461U (en) * 1986-12-09 1988-06-17
US6157803A (en) * 1998-11-06 2000-12-05 Fuji Xerox Co., Ltd. Developing unit and developing roll contained therein
US8178188B2 (en) 2001-04-20 2012-05-15 Panasonic Corporation Base layer for manufacturing an electronic component by an etching process
JPWO2009008273A1 (en) * 2007-07-09 2010-09-09 住友金属鉱山株式会社 Printed wiring board manufacturing method and printed wiring board obtained by the manufacturing method
JP4986081B2 (en) * 2007-07-09 2012-07-25 住友金属鉱山株式会社 Method for manufacturing printed wiring board
US8663484B2 (en) 2007-07-09 2014-03-04 Sumitomo Metal Mining Co., Ltd. Method for manufacturing a printed circuit board and a printed circuit board obtained by the manufacturing method
JPWO2009034764A1 (en) * 2007-09-10 2010-12-24 住友金属鉱山株式会社 Printed wiring board manufacturing method and printed wiring board obtained by the manufacturing method
JP4986082B2 (en) * 2007-09-10 2012-07-25 住友金属鉱山株式会社 Method for manufacturing printed wiring board
JP2010128269A (en) * 2008-11-28 2010-06-10 Panasonic Corp Developing roll, method for manufacturing the same, and printing device

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