JPS6124772B2 - - Google Patents

Description

[Detailed Description of the Invention] <<Field of the Invention>> This invention relates to a DIP type switch, and in particular, the present invention relates to a DIP type switch, and in particular, among the metal pieces for terminals arranged in two rows through the bottom plate of a package cage, the metal pieces on one side are A DIP switch is integrated with a group of similar circuit elements such as a diode array by interposing a circuit element such as a diode chip in each switch.

<<Prior art and its problems>> Conventionally, circuit elements such as DIP type switches and diode arrays have been known as electronic components suitable for mounting on printed circuit boards.

Among these, DIP type switches are generally used for circuit settings in various electronic devices such as automatic control equipment and measuring equipment, and are sometimes combined with diode arrays to configure circuits such as the one shown in Figure 1. , both may be arranged side by side and mounted on a printed circuit board.

However, in today's world where it is desired to make electronic circuits more and more compact, mounting DIP type switch A and diode array B side by side on a printed circuit board as described above is of course extremely disadvantageous in terms of space. The mounting and assembly work must also be complicated.

≪Object of the invention≫ The object of this invention is to provide DIP in a single package.
A switch that integrates a switch and a group of similar circuit elements such as a diode array, which allows for higher mounting density on printed circuit boards, etc., and also simplifies mounting and assembly work. Our goal is to provide the following.

≪Structure and Effects of the Invention≫ This invention provides that after protruding from the top surface of the package cage bottom plate,
a plurality of pairs of spring contact pieces that are bent toward each other and biased in the direction of vertical contact; an operating element exposed from a guide hole of the package top plate; and a pair of spring contact pieces inserted and removed between the pair of contact pieces; A DIP type switch having a striker having a separating part; a DIP type switch in which a plurality of terminal pins are arranged in parallel in a dual in-line package; 1st and 2nd
The first resin block is made up of a plurality of aligned metal pieces that integrally have individual terminal pin portions protruding toward the lower surface of the bottom plate and individual side contact pieces protruding toward the upper surface of the bottom plate. It is molded in resin in one piece,
and; The second resin block includes a first metal piece that integrally includes a common side terminal pin portion protruding toward the bottom side of the bottom plate and an element connection portion embedded in the bottom plate; and a common side protruding toward the top side of the bottom plate. a plurality of second metal pieces that integrally include a contact piece portion and a pad portion embedded in the bottom plate; an insulating substrate that holds the first and second metal pieces in an aligned state; the first metal piece A plurality of circuit element chips of the same type, such as a diode array, which are collectively die-bonded on the element connection part of the second metal piece and wire-bonded between the pad parts of the second metal piece; are integrally resin-molded. It is characterized by the fact that

According to such a configuration, a DIP switch and a group of similar circuit elements such as a diode array are integrated in a single package.
This has the effect of extremely high mounting density on printed circuit boards and the like, and also simplifies mounting and assembly operations.

In addition, after dividing the package bottom plate into two resin blocks and incorporating a group of circuit elements into one resin block, both resin blocks are fixed together.
It becomes easy to embed circuit elements in the bottom plate.

Further, in the present invention, the circuit elements are resin-molded and are not exposed to the outside, so that they are not damaged by arcing during switching.

In addition, in this invention, the circuit element chips such as diode arrays constituting the circuit element group are assembled together and die-bonded on the element connection part of the first metal piece, so the packaging density of the elements in the package is high. Moreover, since they are placed under the same temperature environment, their characteristics are made uniform.

Furthermore, the first and second metal pieces are aligned on the insulating substrate, and the circuit elements are collectively assembled and die bonded on the element connection part of the first metal piece, and then each element is connected to each pad part. Since wire bonding is used between the two, positioning and wiring during mounting are easy, and manufacturing costs can be reduced.

<<Description of Embodiment>> An embodiment of the present invention will be described below based on the drawings. The basic structure of this switch is a plurality of pairs of spring contact pieces C ₁ and C ₂ that are bent toward each other after protruding from the upper surface of the package bottom plate 1 and are biased in the direction of vertical contact. A plurality of strikers 7 having an operator section 7C protruding from the guide hole 6a of the package top plate and a separating section 7b inserted and removed between the pair of contact pieces C ₁ and C ₂ are arranged in parallel in the dual in-line package cage. It is something.

Next, to explain the configuration of the switch part in more detail, in FIG. 2, 1 is the bottom plate of the dual in-line package, and 2 and 3 are embedded in the bottom plate 1 with their lower ends protruding a desired amount below the bottom plate. the individual side metal pieces and the common side first metal piece.

Among these, a plurality of individual side metal pieces 2 are arranged at appropriate intervals and are disposed to penetrate along one side edge extending in the longitudinal direction of the bottom plate 1, and the upper end of each metal piece 2 is arranged above the bottom plate. This portion is protruded toward and bent toward the center, and serves as an individual side contact piece portion 2a having spring properties.

Furthermore, the portion of the individual side metal piece 2 that protrudes below the bottom plate serves as an individual side terminal pin portion 2b.

On the other hand, the portion of the first metal piece 3 on the common side that protrudes downward from the bottom plate is a common side terminal pin portion 3b.
Two to three wires are arranged for each package.

Reference numeral 4 denotes a common side second metal piece that is fixed to the top surface of the bottom plate on the mounting side of the common side first metal piece 3 in a number corresponding to the individual side metal pieces 2;
. . . and the first metal piece 3 on the common side, a diode chip 5 is interposed as will be described later, and after being wired, it is resin-molded integrally with the bottom plate 1.

Further, the outer end portion of the second metal piece 4 is bent toward the contact piece 2a side to form a common side contact piece portion 4b,
And this common side contact piece part 4b and individual side contact piece part 2
a are vertically opposed to each other, and are biased so that they are in contact with each other under normal conditions.

Next, a cover 6 is fixed on the bottom plate 1 so as to surround the contact piece portion 2a and the contact piece portion 4b, and the cover 6 and the bottom plate 1 constitute a dual in-line package of the switch. Further, guide holes 6a and 6 are provided in the upper wall of the cover 6 in correspondence with the respective contact pieces 2a and 4b.
a, ... are formed (see Figure 3).

Reference numeral 7 denotes a striker that is mounted in the cover 6 of the case so as to be able to slide in the longitudinal direction of the contact piece in correspondence with each pair of contact piece parts 2a and 4b, and this striker 7 has the above-mentioned contact piece part at the bottom. 2a, 4b
The contact piece 2a has a leg part 7a hanging down on both sides, and a separation part 7b located at the center between the legs to separate the contact piece parts 2a and 4b. , and the contact piece portion 4b is connected to the separation portion 7b.
It is possible to make contact with the upper surface of each.

Further, on the upper part of the striker 7, an operator part 7 is provided which projects upward from the guide hole 6a of the cover 6.
c are provided respectively, and this operator section 7C
The striker 7 can be slid by operating it from outside the case along the guide hole 6a.

That is, when the striker 7 is slid in the direction of arrow A in FIG. open state and no,
Furthermore, when the striker 7 is slid in the direction of the arrow B, the separation part 7b is removed from between the contact piece part 2a and the contact piece part 4b, and the contact piece parts 2a and 4b are brought into pressure contact by their spring properties, and immediately Terminal pin part 2
The area between b and 3b is closed.

Next, bonding of the diode chip 5 interposed between the first common metal piece 3 and the second common metal piece 4 will be described.

First, as shown in FIG. 2, the bottom plate 1 is divided into two resin blocks 1a and 1b, the individual side metal pieces 2 are attached to one block 1a by insert molding, and the other block 1 is
The first metal piece 3 on the common side, the second metal piece 4 on the common side and the diode chip 5 are attached to b. The first metal piece 3 and the second metal piece 4 are attached as follows.

That is, a diode chip 5 is placed on the connection portion 3a of the first metal piece 3 on the common side having a shape as shown in FIG.
is die-bonded in advance and placed on the substrate 1b' made of synthetic resin, and the second metal pieces 4, 4, which will become the common side contact pieces, are also placed on the substrate 1b' as shown in the figure. After aligning and mounting, wires are connected between the ends (pad portions) 4a of each second metal piece 4 and each diode configured in the diode chip 5.
Bond (connect).

Then, a synthetic resin is molded onto these to form a block 1b into which the first metal piece 3 on the common side, the second metal piece 4 on the common side and the diode chip 5 are inserted.

Here, the diode chip 5 is a quadruple diode made up of four diodes, and for example, the number of the second metal pieces 4 and the individual side metal pieces 2 is 4.
Diode chips are made easier to handle by using one chip when the number is less than one, and two chips when the number is between 5 and 8.

The thus formed block 1b constitutes the bottom plate 1, which is bonded to the block 1a by ultrasonic welding or the like.

According to the above configuration, a DIP switch and a diode array are integrated into a single switch case, which allows extremely high mounting density on printed circuit boards, etc. Assembly work is also simplified.

Further, according to the above configuration, the diode chip 5
Since it is molded in resin and is not exposed to the outside, it will not be damaged by arcing during switching.

Furthermore, since the bottom plate of the package is divided into two resin blocks and a group of circuit elements is built into one of the resin blocks, then both resin blocks are fixed together, it is easy to embed the circuit elements in the bottom plate.

Furthermore, according to the above configuration, the diodes are gathered together and die-bonded on the element connection part 3a of the first metal piece 3, so the packaging density of the elements is high and the diodes are placed under the same temperature environment. To be saved,
Characteristics are made uniform.

Furthermore, after aligning the first and second metal pieces 3 and 4 on the resin substrate 1b' and assembling each diode as a diode chip 5 on the element connection part 3a of the first metal piece 3, Since wire bonding is performed between each pad portion 4a, positioning and wiring during mounting are easy, and manufacturing costs can be reduced.

[Brief explanation of the drawing]

Fig. 1 is a circuit explanatory diagram when a DIP switch and a diode array are connected, Fig. 2 is a sectional front view showing an example of the switch according to the present invention, Fig. 3 is a perspective view thereof, and Fig. 4 is a diagram showing the bottom plate. It is an explanatory view showing a method of attaching a common side first metal piece, a common side second metal piece, and a diode. DESCRIPTION OF SYMBOLS 1... Bottom plate, 1b'... Board, 2... Individual side metal piece, 2a... Individual side contact piece part, 2b... Individual side terminal pin part, 3... Common side first metal piece, 3a... Connection part, 3b... Common side terminal pin part, 4... Common side second metal piece (contact piece), 4a... End part (pad part), 4b... Common side contact piece part, 5... Diode chip , 7... operation member (strike), 7b
...Separation part, 7c...Controller part.

Claims (1)

[Scope of Claims] 1 A plurality of pairs of spring contact pieces C ₁ and C ₂ that are bent toward each other after protruding from the top surface of the package bottom plate 1 and biased in the direction of vertical contact; Package top plate A DIP type switch in which a plurality of strikers 7 are arranged side by side in a dual in-line package, including an operating part 7C exposed from the guide hole 6a of the striker 7 and a separating part 7b inserted and removed between the pair of contact pieces. The bottom plate 1 of the package collectively holds each row of terminal pins and is composed of first and second resin blocks 1a and 1b that are fixed together; the first resin block 1a is The individual side terminal pin portion 2b protrudes toward the lower surface of the bottom plate, and the spring contact pieces C ₁ and C ₂ protrude toward the upper surface of the bottom plate and form the pair.
A plurality of metal pieces 2 integrally having an individual side contact piece portion 2a serving as one C ₁ are integrally resin-molded in a state in which they are aligned, and; a first metal piece 3 which integrally has a common side terminal pin part 3b protruding to the bottom plate and an element connection part 3a embedded in the bottom plate; a spring contact piece C ₁ which projects to the top side of the bottom plate and forms the pair; Common side contact piece part 4 that becomes the other C ₂ of C ₂
b, and a plurality of second metal pieces 4 that integrally have pad portions 4a embedded in the bottom plate; an insulating substrate 1b' that holds the first and second metal pieces 3 and 4 in an aligned state; A plurality of circuit element chips 5 of the same type, such as diode arrays, are assembled together and die-bonded on the element connection portion 3a of the first metal piece 3, and wire-bonded between each chip and the pad portion 4a of the second metal piece. A switch characterized by being integrally molded with resin.