JPS61247038A - Injection mold for ic - Google Patents

Injection mold for ic

Info

Publication number
JPS61247038A
JPS61247038A JP8795985A JP8795985A JPS61247038A JP S61247038 A JPS61247038 A JP S61247038A JP 8795985 A JP8795985 A JP 8795985A JP 8795985 A JP8795985 A JP 8795985A JP S61247038 A JPS61247038 A JP S61247038A
Authority
JP
Japan
Prior art keywords
cavity
resin
gate
cavity side
sectional area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8795985A
Other languages
Japanese (ja)
Inventor
Shinichi Akashi
明石　進一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP8795985A priority Critical patent/JPS61247038A/en
Publication of JPS61247038A publication Critical patent/JPS61247038A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the injection efficiency to the second cavity and to alleviate the occurrence of noncharging of resin and voids by increasing the first cavity side sectional area of the second gate for charging resin from the first cavity to the second cavity wider than the second cavity side. CONSTITUTION:The sectional area S1 of the second gate 4 at the first cavity side is increased as compared with that S2 of the second cavity side (S1>S2). Thus, since the area S1 of the first cavity side is larger in the second gate 2, resin is charged to the second cavity 5 before the resin is considerably charged in the first cavity 3, the resin is smoothly charged to suppress the uncharging and voids. Further, cutting after injection molding is executed previously at the second cavity side 5, and the first cavity 3 side can be then readily cut.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ＩＣ用モールド金型に関し、特に１ケの注入
ダートに２ケのキャピテ°イを有するモールド金型に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold for IC, and particularly to a mold having two cavities in one injection dart.

〔従来の技術〕[Conventional technology]

モールド金型には、第３，４図に示すように、ランナー
部１から第１のキャビティ３へ樹脂を注入する第１のデ
ート部２と、第１のキャピテイ３から第２のキャビティ
５へ樹脂を注入する第２のダート部４とを有するものが
ある。従来、第２のゲート部４は第３図、第４図に示す
通り断面形状が均一である。さらにモールド成形後の切
断性を向上させるため、キャビティ断面より非常に小さ
いのが普通である。As shown in FIGS. 3 and 4, the mold includes a first date part 2 for injecting resin from a runner part 1 into a first cavity 3, and a first date part 2 for injecting resin from a runner part 1 into a first cavity 3, and a part for injecting resin from a first cavity 3 into a second cavity 5. Some have a second dirt part 4 into which resin is injected. Conventionally, the second gate portion 4 has a uniform cross-sectional shape as shown in FIGS. 3 and 4. Furthermore, in order to improve cutting performance after molding, the cross section is usually much smaller than the cavity cross section.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の第２のダート部４は断面が均一かつ小さ
いため、第２のキャビティ５への樹脂の注入効率が悪く
、第２のキャビティ５での樹脂未完てんが発生し易い。Since the conventional second dart portion 4 described above has a uniform and small cross section, the resin injection efficiency into the second cavity 5 is poor, and resin is likely to be incompletely filled in the second cavity 5.

さらに第１及び第２のキャビティ３，５の第２のゲート
部４側に樹脂中に巻き込まれた空気がたまり易く、ティ
ドが発生し易いという欠点があった。Furthermore, there is a drawback that air caught in the resin tends to accumulate on the second gate portion 4 side of the first and second cavities 3 and 5, and tidbits tend to occur.

本発明は前記問題点を解消した装置を提供するものであ
る。The present invention provides an apparatus that solves the above problems.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は第１のキャビティ側の第２のゲート部断面積を
第２のキャビティ側より広くしたことを特徴とするＩＣ
用モールド金型である。The present invention provides an IC characterized in that the cross-sectional area of the second gate portion on the first cavity side is wider than that on the second cavity side.
This is a mold for.

〔実施例〕〔Example〕

以下、本発明の一実施例を図によって説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第１図、第２図においそ、２はランナー部１から第１の
キャビティ３に樹脂を注入する第１のダート部、４は第
１のキャビティ３から第２のキャビティ５に樹脂を注入
する第２のゲート部である。In Figs. 1 and 2, 2 is a first dart part for injecting resin from the runner part 1 into the first cavity 3, and 4 is a part for injecting resin from the first cavity 3 into the second cavity 5. This is the second gate section.

本実施例において、第２のゲート部４は第１のキャビテ
ィ側の断面積Ｓ１を第２のキャビティ側の断面積Ｓ２よ
り広＜　（Ｓｌ＞８２）する。In this embodiment, the second gate portion 4 has a cross-sectional area S1 on the first cavity side that is wider than a cross-sectional area S2 on the second cavity side (Sl>82).

本実施例によれば、第２のゲート部４は第１のキャビテ
ィ側の断面積Ｓ１が広くなっているため、第１のキャビ
ティ３に樹脂の充てんがあまり進行しないうちに第２の
キャビティ５に樹脂が注入されることになり、樹脂の流
れがスムースとなり、前述の未充てん及び♂イドの発生
が押えられる。According to this embodiment, since the second gate part 4 has a large cross-sectional area S1 on the first cavity side, the second cavity 5 is filled before the first cavity 3 is filled with resin much. Since the resin is injected into the mold, the flow of the resin becomes smooth, and the occurrence of the above-mentioned unfilling and male id is suppressed.

さらに、モールド成形後の切断はく第２のキャビティ５
側を先に切断し、しかる後に第１のキャビティ３側を切
断することにより容易に行うことができるものである。Furthermore, the second cavity 5 is cut after molding.
This can be easily done by cutting the side first and then cutting the first cavity 3 side.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、第２のキャビティ
への注入効率を向上することができ、樹脂の未充てん及
び？イドの発生を軽減できる効果る有するものである。As explained above, according to the present invention, it is possible to improve the injection efficiency into the second cavity, and to prevent resin from being unfilled and filling the second cavity. It has the effect of reducing the occurrence of id.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す平面図、第２図は第１
図のＸ−Ｙ線断面図、第３図は従来例を示す平面図、第
４図は第３図のｘ’−ｙ’線断面図である。 １・・・ランナー部、２・・・第１のダート部、３・・
・第１のキャビティ部、４・・・第２のゲート部、５・
・・第２のキャビティ部 特許出願人　　日本電気株式会社 第１図 第２図 第４図Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
3 is a plan view showing a conventional example, and FIG. 4 is a sectional view taken along the line x'-y' of FIG. 3. 1... Runner part, 2... First dirt part, 3...
・First cavity part, 4... Second gate part, 5.
...Second cavity part patent applicant NEC Corporation Figure 1 Figure 2 Figure 4

Claims (1)

【特許請求の範囲】[Claims] （１）トランスファーモールド金型において、ランナー
部から第１のキャビティへ樹脂を注入する第１のゲート
部と、第１のキャビティから第２のキャビティへ樹脂を
注入する第２のゲート部とを有し、該第２のゲート部は
第１のキャビティ側断面積を第２のキャビティ側より広
くしたことを特徴とするＩＣ用モールド金型。(1) A transfer mold mold has a first gate part that injects resin from the runner part to the first cavity, and a second gate part that injects the resin from the first cavity to the second cavity. The IC molding die is characterized in that the second gate portion has a cross-sectional area on the first cavity side larger than that on the second cavity side.
JP8795985A 1985-04-24 1985-04-24 Injection mold for ic Pending JPS61247038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8795985A JPS61247038A (en) 1985-04-24 1985-04-24 Injection mold for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8795985A JPS61247038A (en) 1985-04-24 1985-04-24 Injection mold for ic

Publications (1)

Publication Number Publication Date
JPS61247038A true JPS61247038A (en) 1986-11-04

Family

ID=13929402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8795985A Pending JPS61247038A (en) 1985-04-24 1985-04-24 Injection mold for ic

Country Status (1)

Country Link
JP (1) JPS61247038A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0730938A1 (en) * 1994-09-21 1996-09-11 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of manufacturing spheroidal moldings
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design
US5744083A (en) * 1994-06-21 1998-04-28 Texas Instruments Incorporated Method for molding semiconductor packages
EP0730938A1 (en) * 1994-09-21 1996-09-11 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of manufacturing spheroidal moldings
EP0730938A4 (en) * 1994-09-21 1998-05-27 Seikisui Chemical Co Ltd Method of manufacturing spheroidal moldings
US5792406A (en) * 1994-09-21 1998-08-11 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of preparing spherical moldings

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