JPS612469B2 - - Google Patents
Info
- Publication number
- JPS612469B2 JPS612469B2 JP57225577A JP22557782A JPS612469B2 JP S612469 B2 JPS612469 B2 JP S612469B2 JP 57225577 A JP57225577 A JP 57225577A JP 22557782 A JP22557782 A JP 22557782A JP S612469 B2 JPS612469 B2 JP S612469B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57225577A JPS59118265A (ja) | 1982-12-22 | 1982-12-22 | はんだ付け用保持治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57225577A JPS59118265A (ja) | 1982-12-22 | 1982-12-22 | はんだ付け用保持治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59118265A JPS59118265A (ja) | 1984-07-07 |
| JPS612469B2 true JPS612469B2 (enExample) | 1986-01-24 |
Family
ID=16831486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57225577A Granted JPS59118265A (ja) | 1982-12-22 | 1982-12-22 | はんだ付け用保持治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59118265A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8419420D0 (en) * | 1984-07-30 | 1984-09-05 | Sun Ind Coatings | Holding electronic components during application of solder |
| JPH0230139Y2 (enExample) * | 1985-06-05 | 1990-08-14 | ||
| JPH05269574A (ja) * | 1991-11-19 | 1993-10-19 | Sun Ind Coatings Pte Ltd | 半田付け中電気または電子部品を保持するための装置 |
-
1982
- 1982-12-22 JP JP57225577A patent/JPS59118265A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59118265A (ja) | 1984-07-07 |