JPS612468B2 - - Google Patents
Info
- Publication number
- JPS612468B2 JPS612468B2 JP18634982A JP18634982A JPS612468B2 JP S612468 B2 JPS612468 B2 JP S612468B2 JP 18634982 A JP18634982 A JP 18634982A JP 18634982 A JP18634982 A JP 18634982A JP S612468 B2 JPS612468 B2 JP S612468B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18634982A JPS5976662A (ja) | 1982-10-22 | 1982-10-22 | 被はんだ付け物整列支持用の治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18634982A JPS5976662A (ja) | 1982-10-22 | 1982-10-22 | 被はんだ付け物整列支持用の治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976662A JPS5976662A (ja) | 1984-05-01 |
| JPS612468B2 true JPS612468B2 (es) | 1986-01-24 |
Family
ID=16186796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18634982A Granted JPS5976662A (ja) | 1982-10-22 | 1982-10-22 | 被はんだ付け物整列支持用の治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976662A (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8419420D0 (en) * | 1984-07-30 | 1984-09-05 | Sun Ind Coatings | Holding electronic components during application of solder |
| US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
| JP2509941B2 (ja) * | 1987-07-06 | 1996-06-26 | 株式会社 タムラ製作所 | 被はんだ付け物整列支持用の治具 |
-
1982
- 1982-10-22 JP JP18634982A patent/JPS5976662A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976662A (ja) | 1984-05-01 |