JPS6124468A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS6124468A
JPS6124468A JP14423484A JP14423484A JPS6124468A JP S6124468 A JPS6124468 A JP S6124468A JP 14423484 A JP14423484 A JP 14423484A JP 14423484 A JP14423484 A JP 14423484A JP S6124468 A JPS6124468 A JP S6124468A
Authority
JP
Japan
Prior art keywords
head
wafer
defects
mounting
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14423484A
Other languages
Japanese (ja)
Inventor
Yutaka Yamagishi
裕 山岸
Michiyoshi Kawahito
川人　道善
Yoshiharu Mori
森　佳治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14423484A priority Critical patent/JPS6124468A/en
Publication of JPS6124468A publication Critical patent/JPS6124468A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Abstract

PURPOSE:To prevent the lowering of yield due to the defects of IC and the failure of circuit wiring other than the faulty performance of heating elements by a method in which the mounting of IC and the wiring of circuit are made on a wafer, e.g., FPC, PCB, etc., and the IC-mounted wafer is connected with the head substrate. CONSTITUTION:A heating element 3 is led onto the head substrate to form only a conductor 2, and the mounting of IC5 and the wiring of circuit 4 are made on another wafer. The wafer is connected with the head substrate by hot-welded with solder. The defects of the circuit wiring can thus be removed during the wiring period on other wafer, and the defects of IC can be eliminated by inspection after mounting it on other wafer.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はサーマルヘッドに係り、特に安価なＩＣ搭載型
ヘッドに好適な構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thermal head, and particularly to a structure suitable for an inexpensive IC-mounted head.

〔発明の背景〕[Background of the invention]

従来のＩＣ搭載型サーマルヘッドは、ヘッド基板上にＩ
Ｃが搭載され、回路配線もヘッド基板中で行なわれてい
た。このため、発熱部が正常であっても回路配線部の不
良％ＩＣ自体の不良、またその搭載時に生じる不良等に
よりヘッド全体として不良品となり、歩留り低下の原因
となっていた。Conventional IC-mounted thermal heads have an I on the head substrate.
C was installed, and the circuit wiring was also done inside the head board. Therefore, even if the heat generating part is normal, the head as a whole becomes defective due to defects in the circuit wiring part, defects in the IC itself, defects that occur during mounting, etc., and this causes a decrease in yield.

また、基板の面積もＩＣ搭載や回路配線の分大きくする
必要があり、コストアップの大きな原因となっていた。Furthermore, the area of the board needs to be increased to accommodate IC mounting and circuit wiring, which is a major cause of cost increase.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、　ＩＣ搭載型サーマルヘッドにおいて
発熱体の不良以外のＩＣ不良や回路配線不良による歩留
り低下を防ぎ、安価なサーマルヘッドを提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive thermal head that prevents a decrease in yield due to IC defects other than defects in the heating element and circuit wiring defects in an IC-mounted thermal head.

〔発明の概要〕[Summary of the invention]

上記目的を達成するため１本発明ではＩＣ搭載及び回路
配線をヘッド基板上では行なわず、ＦＰＣやＰＣＢ等の
基板中で行なった後、このＩＣ搭載基板をヘッド基板と
接続してＩＣ搭載型ヘッドを製作するという考えに至っ
たものである。In order to achieve the above object, 1. In the present invention, IC mounting and circuit wiring are not carried out on the head substrate, but are carried out in a substrate such as FPC or PCB, and then this IC mounting substrate is connected to the head substrate to connect the IC mounted type head. This led to the idea of producing a .

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を図面を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図は従来の構造のＩＣ搭載型サーマルヘッドである
。図に示すように、ヘッド基板９上に発熱体５．ＩＣ５
，回路配線部４が総て形成されている。FIG. 1 shows an IC-mounted thermal head with a conventional structure. As shown in the figure, a heating element 5. IC5
, circuit wiring portions 4 are all formed.

これに対し１本発明によるＩＣ搭載型サーマルヘッドの
構造を第２図に示す。In contrast, FIG. 2 shows the structure of an IC-mounted thermal head according to the present invention.

本発明によるサーマルヘッドは、ヘッド基板上には発熱
体３と引き出し導体２のみが形成される。ＩＣ５搭載と
回路配線４はヘッド基板とは別の基板（１ｂ・・・本実
施例では基材が厚み０．１４　ｆｆｍのガラスエポキシ
であるＰＣＢを用いた）上で行ない、このＰＣＢ基板と
ヘッド基板が半田熱圧着等により接続されている。この
方法により、回・路配線における不良はＰＣＢの製作の
ときに、またＩＣの不良はＰＣＢに搭載後の検査にて取
り除くことが可能となる。さらに発熱体の不良もヘッド
基板単体の検査により、ドライバＩＣを搭載する前に取
り除くことができる。また、ヘッド基板上でＩＣの搭載
や回路配線の必要がないため。In the thermal head according to the present invention, only the heating element 3 and the lead-out conductor 2 are formed on the head substrate. The IC 5 mounting and the circuit wiring 4 are carried out on a board (1b...in this example, a PCB whose base material is glass epoxy with a thickness of 0.14 ffm is used) different from the head board, and this PCB board and the head The boards are connected by solder thermocompression bonding or the like. With this method, defects in circuits and circuit wiring can be removed during PCB manufacture, and IC defects can be removed during inspection after mounting on the PCB. Furthermore, defects in the heating element can be removed by inspecting the head board alone before mounting the driver IC. Additionally, there is no need to mount an IC or conduct circuit wiring on the head board.

本実施例においては基板サイズを従来の半分以下にする
ことができ、ヘッド基板の値段も半分以下にすることが
でき、かつ製造歩留りも大幅に向上できた。その代わり
として、ＩＣ搭載や回路配線用のＰＣＢ基板が必要とな
るが、同じサイズのヘッド基板の値段に比べて安価であ
り、２層配線もヘッド基板上で行なうより歩留りが良く
、総合的に大幅な原価低減を行なうことができる。In this embodiment, the substrate size can be reduced to less than half of the conventional size, the price of the head substrate can be reduced to less than half, and the manufacturing yield can also be greatly improved. As a substitute, a PCB board for IC mounting and circuit wiring is required, but it is cheaper than the price of a head board of the same size, and the yield is better than doing two-layer wiring on the head board, and overall Significant cost reductions can be achieved.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、　ＩＣ搭載型サーマルヘッドの発熱部
と、駆動回路部をそれぞれ別々に製作し。According to the present invention, the heat generating part and the drive circuit part of the IC-mounted thermal head are manufactured separately.

検査も別々に行なって良品の選別ができるのでヘッド完
成品の歩留りが大きく向上する。ま？。Inspection can also be carried out separately and non-defective products can be selected, greatly improving the yield of finished head products. Ma? .

ヘッド基板を小さくシ、その分ヘッド基板より安価な基
板を用いることが可能であり、基板トータルの値段とし
ておよそ従来の半分程度に低減でき、経済性にも優れる
。Since the head substrate can be made smaller, it is possible to use a substrate that is cheaper than the head substrate, and the total cost of the substrate can be reduced to about half of the conventional cost, which is also excellent in economical efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来構造のＩＣ搭載製サーマルヘッドの斜視図
、第２図は本発明の一実施例のＩＣ４ｇ型サーマルヘク
トの斜視図である。 １ａ・・・・・・ヘッド基板、 ２ａ・・・・・・引き出し導体。 ３・・・・・・発熱体。 ４・・・・・・回路配線部。 ５・・・・・・ＩＣ。 第　１　図 ζFIG. 1 is a perspective view of a conventional IC-mounted thermal head, and FIG. 2 is a perspective view of an IC4g type thermal head according to an embodiment of the present invention. 1a...Head board, 2a...Outgoing conductor. 3...Heating element. 4...Circuit wiring section. 5...IC. Figure 1 ζ

Claims (1)

【特許請求の範囲】[Claims] １、発熱印画部とヘッド駆動回路部より成るＩＣ搭載型
のサーマルヘッドにおいて、ドライバ、ダイオード等の
ＩＣをヘッド基板に直接は搭載せず、フレキシブルプリ
ントケーブル、プリンテッドサーキットボード、または
これに相等する可撓性のある駆動回路基板上に搭載され
このＩＣ搭載基板と、ヘッド基板が接続された構成であ
ることを特徴とするサーマルヘッド。1. In an IC-mounted thermal head consisting of a heat-generating printing section and a head drive circuit section, ICs such as drivers and diodes are not mounted directly on the head substrate, but instead are mounted on a flexible printed cable, printed circuit board, or equivalent. A thermal head characterized by being mounted on a flexible drive circuit board and connected to the IC mounting board and a head board.
JP14423484A 1984-07-13 1984-07-13 Thermal head Pending JPS6124468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14423484A JPS6124468A (en) 1984-07-13 1984-07-13 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14423484A JPS6124468A (en) 1984-07-13 1984-07-13 Thermal head

Publications (1)

Publication Number Publication Date
JPS6124468A true JPS6124468A (en) 1986-02-03

Family

ID=15357365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14423484A Pending JPS6124468A (en) 1984-07-13 1984-07-13 Thermal head

Country Status (1)

Country Link
JP (1) JPS6124468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06183047A (en) * 1992-03-02 1994-07-05 Rohm Co Ltd Thermal printing head and printer having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06183047A (en) * 1992-03-02 1994-07-05 Rohm Co Ltd Thermal printing head and printer having the same

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