JPS61244566A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS61244566A
JPS61244566A JP8788885A JP8788885A JPS61244566A JP S61244566 A JPS61244566 A JP S61244566A JP 8788885 A JP8788885 A JP 8788885A JP 8788885 A JP8788885 A JP 8788885A JP S61244566 A JPS61244566 A JP S61244566A
Authority
JP
Japan
Prior art keywords
wiring
layers
heating resistor
tips
wiring layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8788885A
Other languages
Japanese (ja)
Inventor
Hoshun Akechi
明智 方俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP8788885A priority Critical patent/JPS61244566A/en
Publication of JPS61244566A publication Critical patent/JPS61244566A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Abstract

PURPOSE:To enhance thermal efficiency of a thermal head, by a construction wherein wiring layers are provided in the form of alternate wiring, and heating resistor layers are provided independently at each gap between opposed ones of the wiring layers. CONSTITUTION:The wiring layers 2 are provided on an insulating substrate in the form of alternate wiring, and the heating resistor layers 1 are provided independently for each dot. The wiring layers 2 are provided by a photo-resist treating method in such a pattern that the tips of comb teeth are opposed from both sides. The opposed tips of the wiring layers 2 overlap with each other alternately in the opposing direction, and are provided in the form of alternate wiring so that gaps with a predetermined size are provided in the direction orthogonal to the opposing direction. The tips of the wiring layers 2 are provided to be smaller in width at the overlapping parts. The heating resistor layers 1 are provided independently at each to1 the gaps provided in the lateral direction at the tips of the wiring layers 2, and both end parts in the lateral direction are connected to the tip side parts of the layers 2 by riding on and making contact with the latter.

Description

【発明の詳細な説明】 (a+技術分野 この発明は、絶縁基板上に厚膜や薄膜の発熱抵抗体アレ
イを形成したサーマルヘッドに関する。
DETAILED DESCRIPTION OF THE INVENTION (a+ Technical Field) This invention relates to a thermal head in which a thick film or thin film heating resistor array is formed on an insulating substrate.

fbl従来技術 サーマルヘッドは基本的には、第2図に示すように、絶
縁基板上に記録ドツトごとに形成された各発熱抵抗体層
1の両端にそれぞれ配線層2を接続することにより構成
され、この両端の配線層2を通じて電流を流すことによ
り各発熱抵抗体層1ごとに適宜発熱させて感熱紙に記録
するようにしている。ところが、発熱抵抗体層1や配線
層2のパターン形成の精度には限界があるので、従来よ
り、第3図に示すように、両側から向かい合う配線層2
の櫛の歯状の先端の幅を細くした」二でこの先端を、向
かい合う方向(図面上の上下方向)に互い違いとなって
重なり、向かい合う方向に対して横方向(図面上の左右
方向)に所定の間隔の隙間を開ける交互配線形式となる
ように形成し、発熱抵抗体層1を、この配線層2の先端
の重なった部分に横方向に帯状に連続して形成するサー
マルヘッドの発明がなされていた。この従来のサーマル
ヘッドによると、両側の各配線層2を適宜組み合わせて
通電することにより、配線層2の隙間に位置する発熱抵
抗体層1の各部分を独立に発熱させることができるので
、各配線層2かその先端の両側に位置する発熱抵抗体層
1の各部分のill電を担当することになり、第2図に
示すサーマルヘッドの基本構成と同様のパターン形成密
度でほぼ2倍のドツト数の発熱部分を形成することがで
き、高品質の記録を行うことができる。
The fbl prior art thermal head is basically constructed by connecting wiring layers 2 to both ends of each heating resistor layer 1 formed for each recording dot on an insulating substrate, as shown in FIG. By passing a current through the wiring layers 2 at both ends, each heat generating resistor layer 1 generates heat appropriately and records the heat on the thermal paper. However, since there is a limit to the precision of pattern formation for the heating resistor layer 1 and the wiring layer 2, conventionally, as shown in FIG.
The width of the comb-toothed tips of the combs is narrowed, and the tips are alternately overlapped in the opposite direction (vertical direction on the drawing) and horizontally (horizontal direction on the drawing) with respect to the opposing direction (vertical direction on the drawing). The invention of a thermal head in which the wiring is formed in an alternating manner with gaps at predetermined intervals, and the heating resistor layer 1 is continuously formed in a band shape in the lateral direction on the overlapped portion of the leading ends of the wiring layer 2. It had been done. According to this conventional thermal head, each part of the heating resistor layer 1 located in the gap between the wiring layers 2 can be made to generate heat independently by energizing the wiring layers 2 on both sides in appropriate combinations. It is responsible for the illumination of each part of the heating resistor layer 1 located on both sides of the wiring layer 2 or its tip, and has the same pattern formation density as the basic structure of the thermal head shown in FIG. It is possible to form a heat-generating portion in the number of dots, and high-quality recording can be performed.

しかしながら、このような従来のサーマルヘッドは、発
熱抵抗体層1が帯状に繋がって連続しているので、各部
分で発した熱がこの発熱抵抗体層1の発熱しない部分に
伝わって放出し易くなる。
However, in such a conventional thermal head, since the heating resistor layer 1 is connected in a continuous band shape, the heat generated in each part is easily transmitted to the non-heating parts of the heating resistor layer 1 and released. Become.

また、発熱抵抗体層1と配線層2との接触面積が広いの
で、熱がこの接触部分を介して配線層2にも伝わり放出
し易(なる。このため、従来のサーマルヘッドは、発熱
抵抗体層1の他の部分や配線層2を通じての放熱量が多
くなり、熱効率が悪くなるという欠点があった。
In addition, since the contact area between the heating resistor layer 1 and the wiring layer 2 is wide, heat is easily transmitted to the wiring layer 2 via this contact area and is easily released. This has the drawback that the amount of heat dissipated through other parts of the body layer 1 and the wiring layer 2 increases, resulting in poor thermal efficiency.

(C1発明の目的 この発明は、このような事情に鑑のなされたものであっ
て、配線層を交互配線形式に形成するとともに、発熱抵
抗体層を各配線層間ごとに独立して形成することにより
、熱効率の良いサーマルヘッドを提イバすることを目的
とする。
(C1 Purpose of the Invention This invention was made in view of the above circumstances, and it is an object of the present invention to form wiring layers in an alternate wiring format and to form heating resistor layers independently between each wiring layer. The purpose is to provide a thermal head with high thermal efficiency.

fd+発明の構成および効果 この発明のザーマルヘッド番才、絶8!基板上に配線層
の櫛の歯状の先端を両側から向かい合ねセに配置して、
この両側の配線層の先端が、向がい合う方向に互い違い
となって重なり、向かい合う方向に対して横方向には所
定の間隔の隙間を開りる交互配線形式となるように形成
し、発熱抵抗体層を、この配線層の先端における横方向
の各隙間ごとにそれぞれ独立して形成したことを特徴と
するこの発明のサーマルヘッドを」二記のように構成す
ると、発熱抵抗体層が各ドア1〜ごとに独立して形成さ
れるので、熱が発熱抵抗体層の発熱しない他の部分に直
接伝わるということがなくなる。また、各発熱抵抗体層
と配線層との接触面積も必要以上に広くする必要がない
ので、配線層を伝って熱が大量に放出するということも
なくなる。このため、この発明のサーマルヘッドは、発
熱抵抗体層の発熱部分からの放熱量が少なくなるので、
熱効率が改善され、しかも、交互配線形式による記録ド
ツトの高密度形成の長所は保持される。
Structure and effect of the fd+ invention The thermal head of this invention is outstanding! The comb-like tips of the wiring layer are placed facing each other from both sides on the board.
The tips of the wiring layers on both sides are alternately overlapped in the opposite direction, and a gap of a predetermined interval is left in the lateral direction with respect to the opposite direction, forming an alternate wiring format. When the thermal head of the present invention, which is characterized in that the body layer is formed independently for each lateral gap at the tip of the wiring layer, is configured as described in ``2'', the heating resistor layer is formed separately for each door. Since each heat generating resistor layer is formed independently, heat is not directly transmitted to other parts of the heat generating resistor layer that do not generate heat. Further, since there is no need to make the contact area between each heating resistor layer and the wiring layer larger than necessary, there is no need for a large amount of heat to be released through the wiring layer. Therefore, in the thermal head of the present invention, the amount of heat radiated from the heat generating portion of the heat generating resistor layer is reduced.
Thermal efficiency is improved, yet the advantages of high density formation of recording dots in an alternating wiring format are retained.

(81実施例 第1図は、この発明の実施例であるサーマルヘッドの絶
縁基板上の部分平面図である。
(Embodiment 81 FIG. 1 is a partial plan view of an insulating substrate of a thermal head according to an embodiment of the present invention.

この実施例のサーマルヘッドは、絶縁基板上に交互配線
形式となるように配線層2を形成し、発熱抵抗体層1を
各ドツトごとに独立して形成することにより構成されて
いる。絶縁基板は、アルミナ基板等からなる絶縁性の基
板である。配線層2は、フォトレジスト処理法により、
櫛の歯状の先端が両側から向かい合わせとなるようなパ
ターンに形成されている。この配線層2の向かい合わせ
となった先端は、向かい合う方向(図面の上下方向)に
互い違いとなって重なり、向かい合う方向に対して横方
向(図面の左右方向)に所定の間隔゛の隙間を開ける交
互配線形式となるように形成されている。また、この配
線層2の各先端は、それぞれ、重なり合う部分で幅が細
くなるように形成されている。発熱抵抗体層1は、この
配線層2の先端における横方向の各隙間ごとにそれぞれ
独立して形成され、横方向の両端部が配線層2の先端側
部に乗り」−げて接触することにより接続されている。
The thermal head of this embodiment is constructed by forming wiring layers 2 on an insulating substrate in an alternate wiring format, and forming heating resistor layers 1 independently for each dot. The insulating substrate is an insulating substrate made of an alumina substrate or the like. The wiring layer 2 is formed by photoresist processing method.
It is formed in a pattern in which the tooth-like tips of the comb face each other from both sides. The opposing ends of the wiring layer 2 overlap in an alternating manner in the opposing direction (vertical direction in the drawing), and leave a gap of a predetermined distance in the lateral direction (horizontal direction in the drawing) with respect to the opposing direction. They are formed in an alternate wiring format. Further, each tip of the wiring layer 2 is formed so that the width becomes narrower at the overlapping portion. The heating resistor layer 1 is formed independently in each lateral gap at the tip of the wiring layer 2, and both lateral ends ride on and contact the side of the tip of the wiring layer 2. connected by.

この配線層2のパターンは、メソシュタイプスクリーン
またはメタルスクリーンと称される繰り抜きスクリーン
によって印刷される。なお、この印刷の際、印刷にじみ
が発生しないようにする。
The pattern of this wiring layer 2 is printed by a cut-out screen called a mesotype screen or a metal screen. Note that during this printing, care should be taken to prevent printing blur from occurring.

上記のように構成されたこの実施例のサーマルヘッドは
、発熱抵抗体層1が各ドツトごとに独立して形成されて
いるので、熱が発熱抵抗体層1の発熱しない他の部分に
直接伝わるということがなくなる。また、各発熱抵抗体
層1と配線層2との接触面積も必要以上に広くする必要
がないので、配線層2を伝って熱が大量に放出されると
いうこともなくなる。このため、発熱抵抗体層1からの
放熱量が少なくなるので、サーマルヘッドの熱効率が改
善される。
In the thermal head of this embodiment configured as described above, the heating resistor layer 1 is formed independently for each dot, so that heat is directly transmitted to other parts of the heating resistor layer 1 that do not generate heat. This will no longer be the case. Further, since the contact area between each heating resistor layer 1 and the wiring layer 2 does not need to be made larger than necessary, a large amount of heat is not released through the wiring layer 2. Therefore, the amount of heat radiated from the heat generating resistor layer 1 is reduced, so that the thermal efficiency of the thermal head is improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この発明の実施例であるザーマルヘソFの絶
縁基板上の部分平面図、第2図は、す゛−マルヘッドの
基本構成を示すための絶縁基板−にの部分平面図、第3
図は、従来の・す゛−マルヘソトの絶縁基板上の部分平
面図である。 1−発熱抵抗体層、2−配線層。
FIG. 1 is a partial plan view of an insulating substrate of a thermal head F according to an embodiment of the present invention, FIG. 2 is a partial plan view of an insulating substrate showing the basic structure of a thermal head, and FIG.
The figure is a partial plan view of the insulating substrate of a conventional Sumaruhesoto. 1-heating resistor layer, 2-wiring layer.

Claims (1)

【特許請求の範囲】[Claims] (1)絶縁基板上に配線層の櫛の歯状の先端を両側から
向かい合わせに配置して、この両側の配線層の先端が、
向かい合う方向に互い違いとなつて重なり、向かい合う
方向に対して横方向には所定の間隔の隙間を開ける交互
配線形式となるように形成し、発熱抵抗体層を、この配
線層の先端における横方向の各隙間ごとにそれぞれ独立
して形成したことを特徴とするサーマルヘッド。
(1) The comb-like tips of the wiring layers are placed facing each other on both sides on the insulating substrate, and the tips of the wiring layers on both sides are
The heating resistor layers are formed in such a way that they are alternately overlapped in opposing directions and have gaps at a predetermined interval in the lateral direction with respect to the opposing directions. A thermal head characterized by being formed independently for each gap.
JP8788885A 1985-04-23 1985-04-23 Thermal head Pending JPS61244566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8788885A JPS61244566A (en) 1985-04-23 1985-04-23 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8788885A JPS61244566A (en) 1985-04-23 1985-04-23 Thermal head

Publications (1)

Publication Number Publication Date
JPS61244566A true JPS61244566A (en) 1986-10-30

Family

ID=13927414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8788885A Pending JPS61244566A (en) 1985-04-23 1985-04-23 Thermal head

Country Status (1)

Country Link
JP (1) JPS61244566A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5158958A (en) * 1974-11-20 1976-05-22 Hitachi Ltd
JPS5466850A (en) * 1977-11-08 1979-05-29 Hitachi Chemical Co Ltd Thermosensitive recording head

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5158958A (en) * 1974-11-20 1976-05-22 Hitachi Ltd
JPS5466850A (en) * 1977-11-08 1979-05-29 Hitachi Chemical Co Ltd Thermosensitive recording head

Similar Documents

Publication Publication Date Title
JPS61244566A (en) Thermal head
EP0867288A3 (en) Recording head
JPS61211058A (en) Thermal printing head
JPH0369311B2 (en)
JP2951178B2 (en) Structure of line type thermal print head
JP2002002005A (en) Thick film type thermal printing head
JP3470824B2 (en) Thermal print head
JP2703033B2 (en) Thermal head
JPH04319448A (en) Thermal head
JPH07290738A (en) Thermal head
JPH03158254A (en) Thermal head
JPH0518144Y2 (en)
JPS61192566A (en) Thermal printing head for gradation recording
JP2605729B2 (en) Thermal head
JPH03158252A (en) Thick film type thermal head
JP3348927B2 (en) Method of manufacturing thick film type thermal print head
JP2554556B2 (en) Thermal print head
JPH07178945A (en) Thick film thermal printing head and its production
JPH03272867A (en) Thermal head
JPS61272169A (en) Thermal head
JPS63307966A (en) Thermal head
JPS59171672A (en) Thermal printing head
JPH0671793B2 (en) Method for manufacturing thermal print head
JPS6250948U (en)
JPS58211469A (en) Thermal head and preparation thereof