JPS6124420A - Press-molding method of thermoplastic resin - Google Patents

Press-molding method of thermoplastic resin

Info

Publication number
JPS6124420A
JPS6124420A JP14577684A JP14577684A JPS6124420A JP S6124420 A JPS6124420 A JP S6124420A JP 14577684 A JP14577684 A JP 14577684A JP 14577684 A JP14577684 A JP 14577684A JP S6124420 A JPS6124420 A JP S6124420A
Authority
JP
Japan
Prior art keywords
mold
molded
resin
molten resin
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14577684A
Other languages
Japanese (ja)
Other versions
JPH0586327B2 (en
Inventor
Shohei Masui
桝井 捷平
Kanemitsu Oishi
大石 金光
Kiyoshi Mitsui
三井 清志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP14577684A priority Critical patent/JPS6124420A/en
Publication of JPS6124420A publication Critical patent/JPS6124420A/en
Publication of JPH0586327B2 publication Critical patent/JPH0586327B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a molded part excellent in electromagnetic shielding effect at high speed cycle by a method wherein a metal gauze, on one surface of which thermoplastic resin molding resin layer has been placed and on the other surface of which molten resin has been supplied, is put between vertically openable forces in order to be molded after the closing of the forces. CONSTITUTION:A metal plate perforated with a large number of small holes or a metal gauze 115, on one surface of which thermoplastic resin molding resin layer 114 has been placed and on the other surface of which thermoplastic resin molten body 116 has been placed, is put between vertically openable forces 111 and 112 in order to be molded after the closing of the upper and lower forces 111 and 112. Consequently, the molding resin layer and the molten resin are joined through the perforated metal plate of the metal gauze with each other, resulting in obtaining an integral molded part.

Description

【発明の詳細な説明】 本発明は電磁波反射およびt!遮蔽効果のすぐれ1こ成
形品をハイサイクルで安価に成形する方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides electromagnetic wave reflection and t! The present invention relates to a method of molding a molded product with excellent shielding effect at a high cycle rate and at low cost.

近年、デジタル電子機器が普及し、これらに使用されて
いるICなどから発生する電磁波がデジタル機器同志の
電磁波障害による誤動作や通信などへの障害となってお
り、これらに対する対策として電磁波遮蔽効果のすぐれ
た成形品が求められており、各種の方法が検討されてい
る。
In recent years, digital electronic devices have become widespread, and the electromagnetic waves generated by the ICs used in these devices are causing electromagnetic interference between digital devices, causing malfunctions and communication problems. There is a demand for molded products with a high degree of flexibility, and various methods are being considered.

他方で、通信衛生、放送衛生の打−ヒげに対応して受信
用のりフレフタ−形アンテナのアンテナ板(μ下すフレ
クター形アンテナ板と称する)としてia電磁波反射効
果すぐれた成形品が求められている。
On the other hand, molded products with excellent IA electromagnetic wave reflection effects are required as antenna plates (referred to as flexor-type antenna plates under μ) for receiving glue flexor-type antennas in response to damage in communications and broadcasting sanitary systems. .

%、電磁波金属等の高導電性材料に入射すると、境界面
での反射(R)、内部での吸収(A)、内部での反射を
繰返す多重反射(B)が起こり、電磁波は反射(几)さ
れるとともに遮蔽(且十A、 + B 、)もされろ。
%, when an electromagnetic wave is incident on a highly conductive material such as a metal, multiple reflections (B) occur in which reflection at the interface (R), absorption inside (A), and internal reflection are repeated; ) and be shielded (and 10A, +B,).

一般には反射損失の方が吸収損失より大きく、支配的で
ある。すなわち、電磁波反射効果のすぐれたものはまた
電磁波遮蔽効果も大きい。
Generally, reflection loss is larger than absorption loss and is dominant. That is, materials with excellent electromagnetic wave reflection effects also have high electromagnetic wave shielding effects.

本発明者らは鋭意検討の結果、ハイサイクルで又は金網
を上下に開閉する金型上に置き、該金属板又は金網の一
方の側に予め熱可塑性樹脂より成形されrs樹脂層(以
下に成形樹脂層と呼ぶ〕を置き、他方の側に溶融状態に
ある熱可塑性樹脂を供給して、上下金型を閉じ、加圧、
冷却して該金属板又は金網を介して、該成形樹脂層と溶
融樹脂を溶着一体化して電磁波反射おJび電磁波遮蔽効
果のすぐれた成形品を成形する方法を見出しγこ。
As a result of extensive studies, the inventors of the present invention found that a metal plate or wire mesh is placed on a mold that opens and closes up and down at a high cycle, and a rs resin layer (formed below) is formed on one side of the metal plate or wire mesh from a thermoplastic resin in advance. A thermoplastic resin in a molten state is placed on the other side, the upper and lower molds are closed, and pressure is applied.
We have discovered a method for molding a molded product with excellent electromagnetic wave reflection and electromagnetic wave shielding effects by welding and integrating the molded resin layer and the molten resin through the metal plate or wire mesh after cooling.

不発明では電磁波反射および遮蔽材として小孔を設けた
金属板又は金網を用いるが、金属板に小孔を設けてお(
のは、金属板の片側に供給した溶融樹脂がこの孔に入り
、金属板の他の側の熱可塑性樹脂の成形樹脂層と加圧、
冷却の成形過程で溶着一体化させる1こめである。孔の
大きさ、数は特に指定しないが、好ましくは1〜8膳φ
がよい。
In the invention, a metal plate or wire mesh with small holes is used as an electromagnetic wave reflection and shielding material, but it is also possible to use a metal plate with small holes in it (
The reason is that the molten resin supplied to one side of the metal plate enters this hole and presses against the molded resin layer of thermoplastic resin on the other side of the metal plate.
This is the first step to weld and integrate the parts during the cooling and molding process. The size and number of holes are not specified, but preferably 1 to 8 holes.
Good.

本発明では樹脂層と金属板を接着剤で貼合せたものと異
なり金属板の小孔、又は金網の網目を介して両側の樹脂
層が溶着しているので耐久性がよい。該成形方法によっ
て得られる成形品は電磁波反射効果がすぐれていること
を利用してパラボラアンテナ、オフセットアンテナ、カ
セグレインアンテナ等リフレクタ−形アンテナのアンテ
ナ板として応用できる。
In the present invention, unlike the case where a resin layer and a metal plate are bonded together with an adhesive, the resin layers on both sides are welded together through the small holes in the metal plate or the mesh of the wire mesh, so the durability is good. The molded product obtained by this molding method has an excellent electromagnetic wave reflection effect and can be used as an antenna plate for reflector-type antennas such as parabolic antennas, offset antennas, and Cassegrain antennas.

また、電磁波遮蔽効果がすぐれている事を利用してパソ
コン、ワープロ等デジタル電子機器のハウジングなど電
磁波シールド対策品として応用できる。該金属板又は金
網の両側に供給する成形樹脂層と溶融樹脂は溶着性のよ
い、部ち同類の熱可塑性樹脂を用いることが必要である
Additionally, due to its excellent electromagnetic shielding effect, it can be used as electromagnetic shielding products such as housings for digital electronic devices such as personal computers and word processors. The molded resin layer and the molten resin supplied on both sides of the metal plate or wire mesh must be thermoplastic resins of the same type that have good weldability.

なお、成形樹脂層は予熱しておく方が溶着上好ましい。Note that it is preferable to preheat the molded resin layer in terms of welding.

また、成形樹脂層は製品がりフレフタ−型アンテナ板の
様ζζ形状h=yfR絞りもなく簡単で平面に近い形状
の場合は単なるシートでよい。製品が深さのあるハウジ
ングの様な場合は、その形状に予め賦形しておき本成形
に用いるとよい。
In addition, if the molded resin layer has a simple shape similar to that of a leftover type antenna plate without a ζζ shape h=yfR and has a shape close to a flat surface, a simple sheet may be used. If the product is a deep housing, it is best to shape it into that shape in advance and use it for the main molding.

例えば、実施例8に述べるように本成形法に類似の方法
で予備賦形してもよいし、射出成形その他の方法で予備
賦形してもよい。
For example, as described in Example 8, it may be pre-shaped by a method similar to this molding method, or it may be pre-shaped by injection molding or other methods.

次に該成形樹脂層は製品の表側に用いるか、裏側に用い
るかは自由であるが、特に製品がその電磁波反射効果を
利用するりフレフタ−型アンテナ板の場合は表側(製品
の凹面)に用いるのが好都合である。その理由は、製品
の中の該金属板又は金網によって反射された電磁波を効
率よくその焦点に集めるためには、上記電磁反射材が正
確な回転放物面を形成していることが重要で、そのため
には製品の表側の樹脂層の厚みが均一であることが重要
である。勿論製品の表側を成形する金型面を正確な回転
放物面にしておくことは容易である。この点でシート(
この場合は成形樹脂層としてシートを用いるとよい。)
は厚み精度のよいものが容易に得られるので、製品の表
(凹)(!lIに用いると好都合である。表側を溶融樹
脂で成形する場合、成形条件(溶融粘度が高い、プレス
圧力が小さい、プレス速度が小さい場合など)によって
は製品の中心部が周辺部に較べて厚くなることがあり、
そうなると製品中の電磁反射材は精度のよい回転放物面
を形成しなくなる。
Next, the molded resin layer can be used on the front side or the back side of the product, but if the product takes advantage of its electromagnetic wave reflection effect or is a flutter-type antenna plate, it can be placed on the front side (the concave side of the product). It is convenient to use. The reason is that in order to efficiently focus the electromagnetic waves reflected by the metal plate or wire mesh inside the product, it is important that the electromagnetic reflective material forms an accurate paraboloid of revolution. For this purpose, it is important that the thickness of the resin layer on the front side of the product is uniform. Of course, it is easy to make the surface of the mold for molding the front side of the product a precise paraboloid of revolution. At this point the sheet (
In this case, a sheet may be used as the molded resin layer. )
Since it is easy to obtain a product with good thickness accuracy, it is convenient to use it for the front (concave) (!lI) of the product.When molding the front side with molten resin, the molding conditions (high melt viscosity, low press pressure) , when the press speed is low, etc.), the center of the product may be thicker than the periphery.
If this happens, the electromagnetic reflective material in the product will no longer form a highly accurate paraboloid of revolution.

丈だアンテナ板の場合はその表側は屋外に設置されると
長期間直接太陽光線に曝されることになるので、耐候性
のよい樹脂処方とし、裏側はフィラーを添加するなどし
て剛性の大きい樹脂処方にしておくと補強効果が大きく
、肉厚も薄くてすむので合理的である。
In the case of long antenna plates, the front side will be exposed to direct sunlight for a long period of time when installed outdoors, so we use a resin formulation with good weather resistance, and the back side is made of a highly rigid resin by adding filler. It is reasonable to use a resin formulation because it has a large reinforcing effect and requires only a small wall thickness.

また本発明では上下に開閉する金型を使用するが、これ
は電磁波反射および遮蔽材を金型の定位置に確実、迅速
にセットし、ハイサイクルで成形するために必要である
Furthermore, the present invention uses a mold that opens and closes vertically, which is necessary to ensure and quickly set the electromagnetic wave reflecting and shielding material at a fixed position in the mold and to perform high-cycle molding.

また、当成形法では、射出成形法と異なり、溶融樹脂は
上下金型を開放状態或は半解放状態で、を磁波反射材に
接するように予め供給しておき(或は金型を閉じながら
供給してもよいが、少くとも金型が完全に閉じるまでに
は供給は完了しておく)金型を閉じながら賦形するので
(射出成形のまうにゲートから高圧の溶融樹脂が噴出す
るのではなく)、金型が閉しるに従って電磁波反射およ
び遮蔽材に接している溶融樹脂は電磁波反射および遮蔽
材の上を広がってゆくので、射出成形法で同様のことを
行なう場合に較べると、電磁波反射および遮蔽材に無理
な力がかからない1こめ、電磁波反射および遮蔽材を損
なうことなく成形することが出来る。
In addition, in this molding method, unlike the injection molding method, the molten resin is supplied in advance so that the upper and lower molds are in contact with the magnetic wave reflecting material in an open or semi-open state (or the molten resin is supplied while the molds are closed). (However, the supply should be completed at least before the mold is completely closed.) Because the mold is shaped while the mold is closed (high-pressure molten resin is ejected from the gate around the injection molding) As the mold closes, the molten resin in contact with the electromagnetic wave reflecting and shielding material spreads over the electromagnetic wave reflecting and shielding material, so compared to when the same thing is done with injection molding, Since no excessive force is applied to the electromagnetic wave reflection and shielding material, it is possible to mold the electromagnetic wave reflection and shielding material without damaging it.

次に本発明の実施に適する金型につき図で説明する。Next, a mold suitable for carrying out the present invention will be explained using figures.

第1図は射出成形に用いられている通常の金型で、これ
で成形すると不具合か生じることを先づ述べる。第1図
は下金型上に溶融樹脂を供給して金製が完全に閉じる少
し前の状態を示したもので、(1ンは上金型、(2)は
下金型、(3)は下金型上に供給した溶融樹脂が、金型
空間を流動してほぼ製品に近い形に賦形された状態を示
す。(3)は溶融樹脂が上下金型のパーティング面に流
れ込んだ部分を示す。このようなタイプの金型を用いる
と金型が閉じるに従って溶融樹脂が最初に金型空間の端
に達したところでは、まだ金型が完全に閉じていないの
で、(3)′が生じることになり、これが生じると金型
が完全に閉じなくなるので、製品にパリが生じるのみな
らず製品の厚みを一定にすることが困難となる。
Figure 1 shows a normal mold used for injection molding, and I will first explain that some problems may occur when molding with this mold. Figure 1 shows the state just before the molten resin is supplied onto the lower mold and the metal is completely closed. (1) is the upper mold, (2) is the lower mold, (3) (3) shows the state in which the molten resin supplied onto the lower mold flows through the mold space and is shaped into a shape almost similar to the product. (3) shows the state in which the molten resin has flowed into the parting surface of the upper and lower molds. When using this type of mold, as the mold closes, the part where the molten resin first reaches the end of the mold space is not yet completely closed, so (3)' If this occurs, the mold will not close completely, which will not only cause cracks in the product but also make it difficult to make the thickness of the product constant.

第2図は本発明の実施に適する金型を示したもので、O
j)は上金型(2)は下金型、(至)は金型空間、04
は製品の厚さを決めるTこめのスペーサー、(2)はシ
ャーエツジで、上下金型の合せ部が上下に数μの間、金
型の開閉方向(垂直)に平行に、且つこの間隙を小さく
加工してあり、ここがら溶融樹脂が流れ出さない様にし
1とものである。
Figure 2 shows a mold suitable for implementing the present invention.
j) is the upper mold (2) is the lower mold, (to) is the mold space, 04
(2) is a T-shaped spacer that determines the thickness of the product, and (2) is a shear edge that allows the mating parts of the upper and lower molds to be parallel to the mold opening/closing direction (perpendicular) by several μ vertically, and to reduce this gap. It has been processed to prevent the molten resin from flowing out.

このタイプの型を用いて成形すると、金型が閉じるに従
い溶融樹脂が金W2間の端に達しても、上下金型のシャ
ーエツジ部はすでに閉じているので、ここから溶融樹脂
の流出はないγこめ、更に金型を面内を流動して賦形さ
れる故、パリの発生もなく、所望厚みの製品を得ること
が出来る。またスペーサーの厚みを変更することにより
製品の肉厚も容易に変えることが出来る。
When molding is performed using this type of mold, even if the molten resin reaches the end between the gold W2 as the mold closes, the shear edge portions of the upper and lower molds are already closed, so the molten resin will not flow out from there. Since the product is shaped by pouring the material and then flowing it through the surface of the mold, it is possible to obtain a product with the desired thickness without the occurrence of flakes. Furthermore, by changing the thickness of the spacer, the thickness of the product can be easily changed.

金型の開閉、加圧はプレス機で行なう。A press machine is used to open and close the mold and pressurize it.

次に実施例により、詳細に説明する、 実施例1 電a波反射材としては第3図のアルミ板を用いてリフレ
クタ−形アンテナ板を成形した。
EXAMPLE 1 A reflector-type antenna plate was molded using the aluminum plate shown in FIG. 3 as the radio wave reflecting material.

けである。N4図は成形中の金型断面模式図で、(Il
l)は上金戯、(112)は下金型、でよ金型(111
)と下金型(112)は第2図に示すようなシャーエッ
ヂ構造にしである。(tia)は下金1!4(112)
に設けγこ溶融樹脂通路で、図示シテないが溶融樹脂通
路(11B)の端シこは溶融樹脂のアキュムレーターに
接続してあり、下金型(112)の溶融樹脂通路(11
B)の周辺部は加熱、保温構造にしてあって、下金型(
112)の中央に溶融樹脂を任意に供給出来るようにし
である。(114)は厚み0.6鮎の熱可塑性樹脂シー
トで、第8図のアルミ板と同じく円形であるがアルミ板
(115)より少し大きく、切断しである。(115)
は第4図に示すアルミ板を示す。
That's it. Figure N4 is a schematic cross-sectional view of the mold during molding, (Il
l) is the upper mold, (112) is the lower mold, and the deyo mold (111) is the lower mold.
) and the lower mold (112) have a shear edge structure as shown in FIG. (tia) is Shimokin 1!4 (112)
Although not shown in the figure, the end of the molten resin passage (11B) is connected to a molten resin accumulator, and the molten resin passage (11B) of the lower mold (112) is
The peripheral area of B) has a heating and heat retention structure, and the lower mold (
112) so that molten resin can be arbitrarily supplied to the center of the tube. (114) is a thermoplastic resin sheet with a thickness of 0.6 mm, which is circular like the aluminum plate in Fig. 8, but slightly larger than the aluminum plate (115), and is cut. (115)
indicates the aluminum plate shown in FIG.

次に成形につき述べる。Next, let's talk about molding.

第4図は金型がやや閉じた状態を示しているが、まず金
型を完全に開き、下金型(112)上にアルミ板(11
5)をその上に樹脂シート(114)を置き、次に金型
を第4図の状態まで閉め、溶融樹脂通路(11B)から
溶融樹脂(116)を下金型(112)上に第4図の様
に供給する。次いで金型を完全に閉じ、加圧、冷却して
成形讐終る。
Although Figure 4 shows the mold in a slightly closed state, first open the mold completely and place the aluminum plate (112) on the lower mold (112).
5), place the resin sheet (114) on top of it, then close the mold to the state shown in Figure 4, and pour the molten resin (116) from the molten resin passageway (11B) onto the lower mold (112). Supply as shown. Then, the mold is completely closed, pressurized, and cooled to complete the molding process.

第6図はかくして得られた製品の中心断面模式図で(1
14’)は第4図の樹脂(成形樹脂1層′)シート、(
115’)はアルミ板、(116’、) 、(116’
l、(116)は溶融樹脂(116,)より賦形された
部分で、各々、要部、フランヂ部、リブ部を示す。、。
Figure 6 is a schematic diagram of the center cross section of the product thus obtained (1
14') is the resin (molded resin 1 layer') sheet shown in Fig. 4, (
115') is an aluminum plate, (116',), (116'
1 and (116) are parts shaped from the molten resin (116,), showing the main part, flange part, and rib part, respectively. ,.

/″ いてリフレクタ−形アンテナ板を成形した。/″ Then, a reflector-type antenna plate was formed.

第5図は成形中の金型断面模式図で、 (111)は上
金型、(112)は下金型で、上金′型(iti)と下
金型の合せ部は@2図に示す様なシャーエッヂ構造にし
である。(117)は溶融樹脂供給口で、上下金型間か
ら出し、入れ出来るよう構成されている。(114)は
実施例1で用い1このと同じシート、(115)はアル
ミ板、(116)は溶融樹脂供給口(117)より供給
された溶融樹脂を示す。
Figure 5 is a schematic cross-sectional view of the mold during molding, (111) is the upper mold, (112) is the lower mold, and the mating part of the upper mold (iti) and the lower mold is shown in Figure @2. It has a shear edge structure as shown. (117) is a molten resin supply port, which is configured so that it can be taken out and put in between the upper and lower molds. (114) is the same sheet used in Example 1, (115) is an aluminum plate, and (116) is the molten resin supplied from the molten resin supply port (117).

次に成形につき述べる。上下金型を開き、下金型(11
2,)上に樹脂シート(114)を置き、その上にアル
ミ板(115)を置く、次に溶融樹脂供給口(117)
を図の様に上下金型間に入れ、溶融樹脂(116)を供
給し、供給後溶融樹脂供給口1(117)を上下金型間
外に移動し、上下金型を閉じ、加圧、冷却して成形を完
了する。
Next, let's talk about molding. Open the upper and lower molds and remove the lower mold (11
2.) Place the resin sheet (114) on top, place the aluminum plate (115) on top of it, then open the molten resin supply port (117).
is placed between the upper and lower molds as shown in the figure, molten resin (116) is supplied, and after supplying, the molten resin supply port 1 (117) is moved outside between the upper and lower molds, the upper and lower molds are closed, and pressure is applied. Cool and complete molding.

かくして得られた製品の中心断面を第6図に示す。FIG. 6 shows a central cross section of the product thus obtained.

記号も実施例1に同じである。The symbols are also the same as in Example 1.

実施例8 電磁遮蔽材として線径が0.27mの針金で20メツシ
ユの平織に編んだ金網(金網の開き目寸法が1.0Is
)を用いて電磁波遮蔽効果良好なハウジングを成形した
Example 8 As an electromagnetic shielding material, a wire mesh with a wire diameter of 0.27 m was woven into a plain weave of 20 meshes (the opening size of the wire mesh was 1.0 Is).
) was used to mold a housing with good electromagnetic shielding effect.

第(図は成形中の断面模式図で、(tti)は上金型(
実線)、(112)は下金型で、上金型<111)と金
型(112)の合せ部は第2図に示す様なシャーエッヂ
構造にしである。(11B、)は上下金型間に出し入れ
出来る様にした溶融樹脂供給口である。また(114.
)は下金型面に密着する様に予め成形した箱状(ハウジ
ング製前記金網で予備賦形した箱状の金網、(116)
は樹脂供給口(11B)から供給された溶融樹脂である
(Figure 1) is a schematic cross-sectional view during molding, (tti) is the upper mold (
The solid line) and (112) are the lower mold, and the mating part of the upper mold <111) and the mold (112) has a shear edge structure as shown in FIG. (11B,) is a molten resin supply port that can be taken in and out between the upper and lower molds. Also (114.
) is a box-shaped wire mesh preformed in advance so as to be in close contact with the lower mold surface (a box-shaped wire mesh pre-shaped with the aforementioned wire mesh made of housing, (116)
is the molten resin supplied from the resin supply port (11B).

次に成形につき述べると、第7図の様に金型−全開き、
下金型上に成形樹脂層(−114)を4置き、更にその
上に予備賦形した金網(115)を置き、その上に樹脂
供給口(11B)より溶融樹脂(116)を供給し、供
給が完了すると、樹脂供給口(11B)を上下金型間よ
り外に移動させ、金型を閉じ、加圧、冷却して製品を得
た。
Next, regarding molding, as shown in Figure 7, the mold is fully opened.
Place four molding resin layers (-114) on the lower mold, further place a pre-shaped wire mesh (115) on top of it, supply molten resin (116) from the resin supply port (11B) on top of it, When the supply was completed, the resin supply port (11B) was moved out from between the upper and lower molds, the molds were closed, and the resin was pressurized and cooled to obtain a product.

第8図はかくして得られた製品の断面模式図で、(11
4’)、(115)は各々第7図の(114)の成形樹
脂層(製品の外側面を構成) 、(115)の金網で、
(116’)は第7図の溶融樹脂(116)より成形さ
れた樹脂層であり、樹脂の層(114)と(116’)
は金網(115’)を介して溶着されている。
Figure 8 is a schematic cross-sectional view of the product thus obtained.
4') and (115) are the molded resin layer (114) (constituting the outer surface of the product) and the wire mesh (115) in Fig. 7, respectively.
(116') is a resin layer molded from the molten resin (116) in Figure 7, and the resin layers (114) and (116')
are welded together via a wire mesh (115').

尚、箱状の成形樹脂層(114)は上述の成形と同様に
して予備成形した。即ちこの場合は、下金型は第7図と
同一のものを用い、上金型の下部が点線の如くやや大き
い(第8図で金網(l15′)と樹脂層(116’)の
厚みだけ)金型を用い、同様にして樹脂を供給、加圧、
冷却して予備賦形を行なった。
Note that the box-shaped molded resin layer (114) was preformed in the same manner as the above molding. That is, in this case, the lower mold is the same as shown in Fig. 7, and the lower part of the upper mold is slightly larger as shown by the dotted line (in Fig. 8, only the thickness of the wire mesh (115') and the resin layer (116') is ) Using a mold, supply resin in the same way, pressurize,
It was cooled and preformed.

4、図面簡単な説明 第1図は射出成形に常用されているタイプの金型の断面
模式図を示す。
4. Brief description of the drawings Figure 1 shows a schematic cross-sectional view of a type of mold commonly used in injection molding.

(1):上金型、(2):下金型、(3):賦形された
樹脂、(3)  ’賦形された樹脂で金型パーティング
部に入った部分 第2図は本発明の実施に適する金型の断面模式%式% 04;スペーサー、(至):シャーエッヂ部第8図は小
孔を設けたアルミ板の説明図である。
(1): Upper mold, (2): Lower mold, (3): Shaped resin, (3) 'The part of the molded resin that entered the mold parting part Figure 2 is the main mold. Cross-sectional schematic diagram of a mold suitable for carrying out the invention % 04: Spacer, (to): Shear edge portion FIG. 8 is an explanatory diagram of an aluminum plate provided with small holes.

(115) ニアルミ板、(118) :小孔第4図は
実施例1の成形中の金型の断面模式図である。
(115) Ni-aluminum plate, (118): small hole FIG. 4 is a schematic cross-sectional view of the mold during molding of Example 1.

(111) :上金型、(112) :下金型、(11
B) :溶融樹脂通路、(114) :樹脂シート、(
115)ニアルミ板、(116) :溶融樹脂、第5図
は実施例2の成形中の金型断面模式図である。
(111): Upper mold, (112): Lower mold, (11
B): Molten resin passage, (114): Resin sheet, (
115) Ni-aluminum plate, (116): Molten resin, FIG. 5 is a schematic cross-sectional view of a mold during molding in Example 2.

(111) :上金型、(112) :下金型、(11
4) :樹脂シート、(115) ニアルミ板、(11
6) :溶融樹脂、(117) :溶融樹脂供給口、第
6図は実施例1.2の製品の中心断面模式図である。
(111): Upper mold, (112): Lower mold, (11
4): Resin sheet, (115) Ni-aluminum plate, (11
6) : Molten resin, (117) : Molten resin supply port, FIG. 6 is a schematic cross-sectional view of the center of the product of Example 1.2.

(114’) :第4.5図の(114)の樹脂シート
、(115’) :第4.5図の(115)のアルミ板
、(116’)、(116’)、(116’″):第4
.5図の(116)溶融樹脂から賦形されたもので各々
要部、フランヂ部、リブ部、 第7図は実施例8の成形中の金型断面模式図である。
(114'): Resin sheet (114) in Figure 4.5, (115'): Aluminum plate (115) in Figure 4.5, (116'), (116'), (116''' ): 4th
.. (116) in Fig. 5 is the main part, flange part, and rib part formed from the molten resin. Fig. 7 is a schematic cross-sectional view of the mold during molding of Example 8.

(111) :上金型、(112) :下金型、(11
B) :溶融樹脂供給口、(114) :予備賦形した
成形樹脂層(箱状)、(115) :予備賦形した金網
、(116) :溶融樹脂、 第8図は実施例8の製品の断面模式図である。
(111): Upper mold, (112): Lower mold, (11
B): Molten resin supply port, (114): Pre-shaped molded resin layer (box shape), (115): Pre-shaped wire mesh, (116): Molten resin, Figure 8 shows the product of Example 8 FIG.

(114’) :第7図の(114)の成形樹脂層、(
115’) ?第7図(115)の金網、(116’)
 :第7図の(116)の溶融樹脂より賦形された層 第3図 第5図 第7図 第8図 +15’
(114'): Molding resin layer (114) in Fig. 7, (
115')? Figure 7 (115) wire mesh, (116')
: Layer shaped from the molten resin (116) in Fig. 7 Fig. 3 Fig. 5 Fig. 7 Fig. 8 +15'

Claims (3)

【特許請求の範囲】[Claims] (1)小孔を設けた金属板又は金鋼を上下に開閉する金
型上に置き、該金属板又は金網の一方の側に予め熱可塑
性樹脂より成形された成形樹脂層を置き、他方の側に溶
融状態にある熱可塑性樹脂を供給して上下金型を閉じ、
加圧、冷却して該金属板又は金網を介して該成形樹脂層
と溶融樹脂を溶着一体化してなることを特徴とする電磁
波反射および電磁波遮蔽効果のすぐれた成形品の製造方
法。
(1) Place a metal plate or metal steel with small holes on a mold that opens and closes vertically, place a molded resin layer pre-molded from thermoplastic resin on one side of the metal plate or wire mesh, and Close the upper and lower molds by supplying molten thermoplastic resin to the sides,
A method for producing a molded article with excellent electromagnetic wave reflection and electromagnetic wave shielding effects, characterized in that the molded resin layer and the molten resin are welded and integrated through the metal plate or wire mesh by pressurizing and cooling.
(2)該成形品が電磁波遮蔽対策品である特許請求の範
囲第1項に記載の製造方法。
(2) The manufacturing method according to claim 1, wherein the molded product is an electromagnetic wave shielding product.
(3)該成形品がリフレクター形アンテナ板である特許
請求の範囲第1項に記載の製造方法。
(3) The manufacturing method according to claim 1, wherein the molded product is a reflector type antenna plate.
JP14577684A 1984-07-12 1984-07-12 Press-molding method of thermoplastic resin Granted JPS6124420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14577684A JPS6124420A (en) 1984-07-12 1984-07-12 Press-molding method of thermoplastic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14577684A JPS6124420A (en) 1984-07-12 1984-07-12 Press-molding method of thermoplastic resin

Publications (2)

Publication Number Publication Date
JPS6124420A true JPS6124420A (en) 1986-02-03
JPH0586327B2 JPH0586327B2 (en) 1993-12-10

Family

ID=15392898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14577684A Granted JPS6124420A (en) 1984-07-12 1984-07-12 Press-molding method of thermoplastic resin

Country Status (1)

Country Link
JP (1) JPS6124420A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531950A (en) * 1993-09-07 1996-07-02 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947463A (en) * 1972-06-08 1974-05-08
JPS51109953A (en) * 1975-03-24 1976-09-29 Fudo Sangyo Kk AMIIRIPURASUCHITSUKUPUREETONOSEIHO
JPS56104015A (en) * 1980-01-24 1981-08-19 Idemitsu Petrochem Co Ltd Press forming method
JPS59101322A (en) * 1982-12-02 1984-06-11 Sumitomo Chem Co Ltd Method of press molding thermoplastic resin

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947463A (en) * 1972-06-08 1974-05-08
JPS51109953A (en) * 1975-03-24 1976-09-29 Fudo Sangyo Kk AMIIRIPURASUCHITSUKUPUREETONOSEIHO
JPS56104015A (en) * 1980-01-24 1981-08-19 Idemitsu Petrochem Co Ltd Press forming method
JPS59101322A (en) * 1982-12-02 1984-06-11 Sumitomo Chem Co Ltd Method of press molding thermoplastic resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531950A (en) * 1993-09-07 1996-07-02 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus

Also Published As

Publication number Publication date
JPH0586327B2 (en) 1993-12-10

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