JPS61243912A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To produce a magnetic head having high accuracy and high efficiency by etching away a protective film of a rgion including a pattern for checking a cutting part and polishing position from a substrate formed thereon with magnetic poles, conductive coils and insulating layer prior to cutting of the substrate. CONSTITUTION:The lower protective film 2, the magnetic poles 3-6, the conductive coils 9, 10 and the insulating layer 11 are formed on the substrate 1 and after the upper protective film 8 is formed thereon, the substrate is cut and polished. The protective film 8 of the region including the pattern 13 for checking the cutting part and polishing position is preliminarily removed by etching prior to the cutting of the substrate, then a grinding wheel 12 and the film 8 do not contact with each other in the stage of cutting the substrate and therefore the exertion of the impact and distortion to the protective film is obviated. The high-speed cutting of the substrate is thus made possible and the reduction of area in each working stage is exactly known from the exposed check pattern 13. The control of the gap depth is thus made easy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing a magnetic head in which magnetic poles, conductive coils, insulating layers, etc. are formed using thin films.

[Summary of the invention]

The present invention relates to a method for manufacturing a magnetic head in which magnetic poles, conductive coils, insulating layers, etc. are formed using thin films. By removing the containing area and then performing the entire process of cutting the substrate, the cutting and grinding quality of the magnetic head is improved as described above, and the processing dimensional accuracy is also improved and stabilized by polishing.

[Prior art]

A cross-sectional view of a magnetic head according to the present invention is shown in FIG. A and others 5.4.5.6 and coils 9.10 are formed on the substrate 1 by thin film formation technology with the Iei edge layer 11 in between, and on top of that, the electric power protection #! In this situation, a film 8 is formed and the upper surface is polished and made flat.

Thereafter, the substrate is cut, shaped by grinding and grooving, and polished to a predetermined gear depth. Cutting, grinding, and grooving are performed using a grindstone, and polishing is performed using a polishing disk using free abrasive grains. The gap depth can be measured by separately forming a gold electrical resistance element and measuring its resistance and converting it, or by optically observing it with a special light source at °C.

[Problems and Objectives to be Solved by the Invention] However, the above-mentioned prior art has two problems. The first problem is that chitting and cranking are likely to occur in the protective film when cutting the root. In severe cases, the protective film may peel off, resulting in complete damage to other parts. Therefore, it is necessary to reduce processing efficiency by cutting at an extremely low cutting speed or by increasing the amount of polishing. Then the second
The problem with this method is the complexity of the gap depth measurement procedure. Since the protective film is 20 μm or more on the magnetic pole, it is impossible to achieve the measurement accuracy of ±0.5 μm required for normal optical measurement, and even if a special light source is used, the distance is quite large. Measurement systems using special light sources are also rather expensive and undesirable. In addition, with the method of forming an electrical resistor element in gold and measuring its resistance to determine the gap depth, it is impractical to measure a wide range of ±0.5 μm from before polishing to the end of polishing.
However, it requires a procedure for connecting the globe terminal, which is extremely inefficient.

The present invention is intended to solve these problems, and its purpose is to provide a highly accurate and highly efficient magnetic head processing technology.

[Means to solve the problem]

(1) In a magnetic head manufactured by a) forming @ poles, conductive coils, insulating layers, etc. on a substrate with thin films and cutting and polishing after protection, b) cutting before cutting the substrate. part and polishing position confirmation (maintenance of area including turns)
[Function] According to the present invention, there is no thin film left at the cutting part, or at least a small amount, so that the grinding wheel and the protective film are not removed when cutting the substrate. Since there is no contact, no mechanical shock or distortion is applied to the protective film. Therefore, the entire process can be carried out at the maximum speed that allows the substrate to be cut.

In addition, since the polishing position confirmation pattern is not under the protective film and is exposed, it cannot be detected by any optical measurement or during any processing process, that is, after grinding, before polishing, and during polishing. Depth measurements can be made and measurement accuracy can be maintained at high levels.

〔Example〕

Figure 1 is a cross-sectional view of the protective film at the tip of the head in an embodiment of the present invention after being etched. Reference numeral 12 denotes a grindstone for cutting the substrate, which does not come into contact with the protective film during cutting. Therefore, it is safe! JIIt - It won't hurt. Reference numeral 13 denotes a polishing position confirmation pattern, which is formed at the same time as forming the coil or magnetic pole. It is completely exposed and can be easily located. Since it is formed by photo-etching technology, the positional relationship between the polishing position confirmation pattern and the polishing end point can be determined with extremely high accuracy. Therefore, the amount of processing in each processing step can be accurately grasped by the polishing position confirmation pattern. Furthermore, by forming a complementary number of polishing position confirmation patterns, it is possible to measure the polishing inclination or the gap depth very close to the polishing end point.

The material of the protective film is usually S10. The film is At, O, film.

Both are generally formed by sputtering. In the case of a 5in2 film, it can be easily etched by dry etching using plasma using an OFx gas.

In the case of At, O, and films, they can be easily etched with a mixture of phosphoric acid and water. (!u, Ni, Ni-Fe, Co
, Co-based alloys and other metals are not subject to major corrosion by the above two etching methods, so there is no problem in using them as polishing position confirmation patterns.

In the case of At, os protective film, 50 to 80 when cut quickly
Chipping of 8 to 10 μm occurs even when cutting at low speed.
Chipping of m occurs. In the case of the present invention, this is chemical etching, and no chipping occurs at all. As a result, the cutting speed can be increased by selecting the grinding wheel optimally.
This can be more than doubled. Furthermore, since chipping does not occur, the amount of lapping before polishing can be significantly reduced, and processing efficiency can also be improved in this respect.

〔Effect of the invention〕

As described above, according to the present invention, since chipping of the protective film does not occur, it is possible to improve the cutting speed and reduce the amount of polishing, and it is possible to significantly improve production efficiency.

In addition, since the amount of grinding and polishing can be accurately measured at any step during processing, it is possible to easily manage the gap depth.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the tip of a magnetic head in the middle of processing, showing an example of the present invention. FIG. 2 is a sectional view of an example of a magnetic head to which the present invention relates. 1...Substrate 2...Lower protective film 5, 4.5.6...Magnetic pole 7...Gap nonmagnetic film 8... Upper purulent membrane 9.10... Conductive coil 11... Electrical insulating layer 12... Grindstone (for cutting the substrate) 15... Polishing position confirmation pattern. that's all

Claims (1)

[Claims] (1) a) In a magnetic head manufactured by forming thin films such as magnetic poles, conductive coils, insulating layers, etc. on a substrate and cutting and polishing after forming a protective film, b) cutting and polishing positions before cutting the substrate; A method of manufacturing a magnetic head, characterized in that a protective film in a region including a confirmation pattern is removed by etching.