JPS61241713A - Substrate for electrical and optical circuit element - Google Patents

Abstract

PURPOSE:To permit the easy connection of a light emitting element and photodetector as well as fibers and to provide the reduction in the size of an optical transmission module, the improvement in productivity, the simplification of assembly and the reduction of a cost by embedding an optical waveguide part into a substrate consisting of an org. material and providing an electrical wiring part to the substrate. CONSTITUTION:The substrate 1 consisting of the org. material is provided with the optical waveguide part consisting of a face plate 2, the optical fibers, light transmittable flat plate and rod or spherical lens and the electrical wiring circuit part 3 consisting of metallic conductors. The connection and coupling between the optical fibers and the light emitting element 7 and photodetector 8 are thereby made easy and the coupling efficiency of light between both is improved. The reduction in the size of the optical transmission module, the improvement in the productivity, the simplification of the assembly and the reduction of the cost are eventually realized.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention connects a light receiving/emitting element of an optical transmission module and an optical transmission fiber with high optical coupling efficiency, and also connects the receiving/emitting element of an optical transmission module 1- with a signal receiving/emitting element. Efficient and compact electrical elements required for
The present invention relates to a substrate for electrical and optical circuit elements suitable for high-density packaging.

[Background of the invention]

In recent years, the development of optical communications using optical fibers as transmission routes has been remarkable, and it has been widely used in communication trunk lines, electric power, plants, office automation (OA), and factory automation (OA).
FA), local area networks (LAN), etc. are being applied.

In the future application of optical communications to these communication fields, the important points will be to reduce the cost of the nine components that make up the system, to reduce the size of modules, to simplify assembly, and to establish mass production technology.

Conventionally, to connect the light receiving and emitting elements of these transmission modules and the fiber, a ball lens and a rod lens were placed separately.
A method was used to form an optical path. However, with this method, it is difficult to align the lens and fiber or light receiving and emitting elements! A lot of time and man-hours are required for adjustment. Furthermore, this method requires strict installation tolerances among the light receiving and emitting elements, lenses, and fibers, making assembly work extremely difficult.

Furthermore, since this method requires a constant connection interval that matches the focal length of the lens, there is naturally a limit to the shortening in the optical axis direction.

Furthermore, a separate space is required for the electrical wiring section for mounting the light receiving and emitting elements and their control ICs.

Therefore, in the conventional method, the assembly process of the optical transmission module is complicated and varied, making it difficult to mass-produce it, and also preventing miniaturization and cost reduction.

As a publicly known example related to the field of the present invention, Japanese Patent Application Laid-open No. 1983-
No. 117114 is mentioned.

[Purpose of the invention]

The purpose of the present invention is to facilitate the connection between light receiving and emitting elements and fibers, and to downsize the optical transmission module.

Improved Productivity 2. The object of the present invention is to provide a substrate for electrical and optical circuit elements that can simplify assembly and reduce costs.

[Summary of the invention]

The present invention is characterized by an organic material substrate and an optical waveguide consisting of a face plate, an optical fiber, a transparent flat plate, a rod lens, a ball lens, etc.

The feature is that an electric wiring circuit section made of a metal conductor is provided, which facilitates the connection and coupling between the optical fiber and the light receiving/emitting element, and also increases the coupling efficiency of light between the two. In order to reduce the size and productivity of optical transmission modules,
The aim is to simplify assembly and reduce costs.

[Embodiments of the invention]

(Light waveguide section and materials thereof) The following five materials can be cited as materials for the optical waveguide section, which is one of the important features of the substrate according to the present invention.

1. Face plate, 2-light 7-eye, 51-light a-plane IE
,4. Rod lens, 51 ball lens.

A 1.0 face plate is made by bundling a large number of glass or plastic fibers each having a core diameter of several tens of micrometers or less and fusing or bonding them using low-melting glass or an organic adhesive.

Normally, when using this method, the bundle of glass or plastic fibers is cut into rings and the cut surfaces are polished to a mirror finish. By embedding such a face plate in the board, it is possible to easily connect the light receiving/emitting element and the optical transmission fiber directly through this board to combine the light coming from people, without using a ball lens or rod lens like in the past. can.

Further, as another waveguide material of the present invention, optical fiber.

A translucent flat plate, a rod lens, or a ball lens can be used.

(Substrate materials/adhesives) For organic material substrates, thermosetting plastics such as phenolic resins, epoxy resins, polyimides, pps
, ppo, thermoplastics such as polysulfnan,
In addition, polyamideimide, polycarbonate, etc. can be used. Even if these products are made into molded products containing inorganic or organic fibers, or made into laminated products using glass, fiber, paper, etc., they smell bad.

Adhesives include epoxy and polyurethane.

Polyimide etc. can be used.

As described above, an electrical and optical circuit element board can be obtained by mounting electrical and optical circuit elements using the materials and structure according to the present invention and connecting them with optical fibers necessary for optical transmission. Furthermore, since the substrate of the present invention uses an organic material, it has excellent mass productivity, processability, and electrical wiring properties. These characteristics are important for putting the substrate of the present invention into practical use.

Hereinafter, in order to obtain the features described above, a method for manufacturing a substrate according to the present invention will be described using examples.

(Example 1) The copper plates on the five phenol substrates numbered 41 in Table 2 were etched to form the electrical wiring portions shown in (α) in FIG.

Next, insert the face plate shown in the first table 1142145 into the through holes of each board, and seal it with epoxy resin for 200 tons! The face plate was fixed by solidifying with water.

The five types of substrates of the present invention thus obtained can serve as mounting substrates for optical transmission modules for optical communication using optical fibers, for example.

Table 1 Waveguide material Table 2 Substrate material * Hole (through hole) in which the waveguide material is embedded This will be discussed later.

(Example 2) The copper plates on the two phenol substrates shown in 2H41 were each etched to form the electrical wiring portion shown in (α) in FIG.

Next, insert the flat plates made of glass and transparent plastic shown in Table 1 A6 into the through holes of the substrate, respectively.
This was solidified using epoxy resin at 20 pt to fix each light-transmitting flat plate.

In this way, two types of substrates of the present invention were created.

(Example S) The copper plates on the two phenol substrates shown in 2nd = A2 were etched, respectively, to form the electrical wiring part shown in (α) in FIG.

Next, the rod lenses and ball lenses shown in Table 1 A4 and Ale were respectively inserted into the through holes of the substrate, and each lens was fixed by hardening with epoxy resin at 200°C.

In this way, two types of substrates of the present invention were created.

(Example 4) Copper plate on phenolic substrate shown in Table 2 A5.

was etched to form the electrical wiring portion shown in (α) in FIG.

Next, the fiber shown in Table 1, 45VC, was inserted into the through hole of the substrate, and this was hardened with epoxy resin at 200° C. to fix the fiber.

In this way, the substrate of the present invention was created.

(Example 5) The copper plate on the glass epoxy substrate shown in Table 2 A4 to A6 was etched to form the electrical wiring part shown in (α) in FIG.

Next, the waveguide materials shown in Table 1 At to 7 were inserted into the through holes of the substrate, and as in Examples 1 to 4, this was solidified using epoxy resin at 200 °C to fix the waveguide materials. .

In this way, the substrate of the present invention was created.

(Example 6) On the polysulfone substrate of Table 2 A7, (α) of FIG.
The electrical wiring shown in Figure 1 was created using aluminum vapor deposition. Next, the face plate shown in Table 1 A1 was inserted into the through hole of the board, and as in Example 1, this was solidified using epoxy resin at 200 Te to fix the face plate. In this way, the substrate of the present invention was created.

(Example 7) The copper plate on the polyimide substrate shown in Table 2 was etched to form the electrical wiring portion shown in FIG. 1(α)k.

Next, the face plate shown in JI61 in Table 1 was inserted into the through hole of the substrate, and as in Example 1, this was solidified using epoxy resin at 200 t to fix the face plate. In this way, the substrate of the present invention was created.

Using the electrical and optical circuit boards of the present invention manufactured in Examples 1 to 7, as shown in FIG. , 9 necessary for controlling the electrical elements 10,
7 was mounted and the whole was molded and sealed.

〔Effect of the invention〕

By using the substrate of the present invention shown in Fig. 2, a bidirectional optical communication module having the following effects can be obtained, which is extremely convenient. (1) Miniaturization of module dimensions (2) Optical Improving coupling efficiency (5) Reducing module assembly man-hours (4) Lowering module costs

[Brief explanation of drawings]

FIG. 1 is a diagram showing an electrical and optical circuit board of the present invention, and FIG.
The figure shows a bidirectional optical communication module using the substrate of the present invention. 1... Organic material substrate 2... Face plate 5... Electric wiring section 4... Electric element mounting section 5... Electric terminal pin connection section 6... Optical transmission fiber □ 7... Light emitting element IC for light receiving element 8...Light receiving element 9...Light emitting element 10...IC for light receiving element 11:...Electric terminal pin 12...Mold cover 1 (Figure 2)

Claims (1)

[Scope of Claims] 1. A substrate for electrical and optical circuit elements, characterized in that an optical waveguide section is embedded in an organic material substrate, and an electrical wiring section is provided on at least one side of the substrate. 2. The waveguide includes a face plate, a rod lens,
2. A substrate for electrical and optical circuit elements according to claim 1, characterized in that it is composed of a transparent flat plate, an optical fiber, or a spherical lens.