JPS61245594A - Photoelectric hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an optical-electrical hybrid integrated circuit board, and particularly to an optical-electrical hybrid integrated circuit board suitable for mounting optical-electrical converters in high density.
The present invention relates to an electrical hybrid integrated circuit board.

[Background of the invention]

In recent years, the development of optical communication has been remarkable, and it has been used for future INS (Integrated Network Service) communication, electric power, building management, chemical plants, and computer data networks such as OA (Office Automation) and FA (Factory Automation). Furthermore, K is being applied in a wide variety of fields for communication within moving bodies such as aircraft and ships. However, the day when optical communications will be put into practical use is still young, and it is not necessarily the case that these devices have achieved sufficient miniaturization and productivity (low cost).

For this reason, the original excellent characteristics of optical communication can be fully demonstrated.
There are many parts that are not utilized.

For example, it is related to the implementation of a computer cabinet with a large number of signal lines, an interface with a terminal device, a transmission module for peripheral use of a digital exchange, and a line exchange for original communication that is expected to be used in INS communication in the near future.

In order to put optical communication systems into practical use in these fields, the following improvements are particularly required: ■ A transmission module that is sufficiently compact and easy to handle.

Neil: 1. Simplify the manufacturing process and reduce the number of man-hours; 2. Establish a practical means of producing INS optical signal line switching modules, which are absolutely necessary for the United Kingdom and the United States.

However, these optical signal transmission modules are complex and difficult to miniaturize, and since optical communication uses light as a signal transmission medium, it is especially important to integrate the 7 joules into the optical waveguide and the optical-to-electrical conversion elements in contact with it. It is necessary to improve the process at the joint. Furthermore, regarding the optical signal line switch mentioned in item 0, even the concept of a practically reliable switch is still in a weak state.

These problems are hindering the spread and development of practical application of optical transmission technology in the aforementioned data communication and INS communication fields such as FA and OA. Especially in narrow spaces such as airplanes? In the application of data optical communication in places, it is important to downsize the optical-to-electrical signal converter module (hereinafter abbreviated as 0/E) and at the same time to downsize the entire national system including the pure electric module. That is, the space occupied by optical communication equipment in a narrow space is reduced, and the weight occupied by the optical communication system is reduced.

For this reason, research into the so-called monolithic method, in which elements necessary for an optical transmission module are collectively formed on one chip, has been conducted for some time. However, although this method can form a simple optical waveguide (optical circuit) within the same chip, it is not possible to simultaneously form the currently required elements, and it has not yet been put to practical use.

For this reason, currently, for example, a light receiving circuit (0/E) module includes a photodiode (light receiving element for photo-electronic conversion, hereinafter abbreviated as PD), an amplifier circuit for demodulating an electric signal, and a timing extraction circuit.

The playback circuit elements are individually mounted and assembled.

Also, in the most advanced example, &″f, amplification in an electric element.

An IC that integrates only the timing and regeneration circuits into one chip.
Only a few have been prototyped or used on a trial basis.

Further, in parallel transmission using multi-core optical fibers that are often used in optical communications in this field, some efforts are being made to align (array) a plurality of light-receiving elements. However, the desired effect has not yet been sufficiently achieved. The reason for this is.

Even if only the light-receiving element is made into a play, its optical waveguide is a set.

This is because it takes a lot of effort to set up.

Efforts have been made to miniaturize the four-module model and simplify the process, but the effects that meet the objectives have not yet been achieved.

The reason why this conventional module was not sufficiently miniaturized is that the optical waveguide and the electric circuit of the electric element were considered separately.
This is because they were given separate spaces. That is, this is because the waveguide for the optical input signal from the original fiber and the electric circuit for the electric element are formed in different locations.

Therefore, in order to form these two circuits, two spaces are occupied.In addition, in the process of assembling these, we believe that these two processes are required separately, and we It was thought that it would be impossible to reduce the number.

Furthermore, if the practical application of optical communications progresses across the board (for example, the INS Optical Communications Nationwide Network).

Various data and information are transferred from subscriber to subscriber, and information is transferred from a particular information service pool to a subscriber.

When obtaining information, there are major problems such as how to switch optical signal lines and how to manufacture optical signal switching equipment. The problem of this optical switching system is particularly significant, and it also relates to the effects of the present patent, so below we will explain in some detail the current state of the art and practical methods that are expected to be adopted in the near future.

As is well known, switching in modern telephone systems is the connection of telephone lines from one subscriber to another. For this purpose, they are connected via a large number of electronic switch sections. Changing the number switch is easy because electronic switching methods are currently used. By the way, if this becomes optical communication, it would be ideal to use light for switching as well.

However, it is nearly impossible to switch using only light, both now and in the distant future. For example, the amount of attenuation of light in the optical switch is 0.5 (LB/Km
Even if optical switches with high flexibility are developed, there will be problems in coupling light to their countless lines, and furthermore, there will be problems in the amount of attenuation of optical signals that occur due to passing through many switches (10 original switches (The amount of attenuation of light would be 10 times greater if the light was transmitted through a switch.

That is, it is practically impossible to exchange optical signals transmitted through the original fiber using an optical-only switch.

For this reason, the trap only needs to first convert the original signal into electrons, exchange them with electrons, and then convert this into light and transmit it. With this method, current electronic exchange technology can be easily used, and a large amount of optical communication signals can be exchanged. In other words, the basic transmission medium route for the information is 鈥→S(exchange) F,
10 → O/E. Here, E indicates electrons, 0 indicates light, and α4 indicates conversion from light to electrons. However, the problem here is how to implement the 4 or Elo conversion elements, which must be integrated in large numbers around the exchange.

The implementation method of the VE or Ruth (hereinafter referred to as OA) module in this part is still quite simple, and only involves O/E conversion of one or several original fibers. Further, a method for integrating these and packaging them at high density has not yet been devised. For this reason, for the reasons mentioned above, in the near future INS, or currently in many areas of optical communication such as optical data communication, a board that can mount a large number of our conversion elements at high density, that is, a hybrid of original and electrical circuits, will be used.
A board for mounting the A element is required. However, nothing like this has been proposed at present. [Object of the Invention] The object of the present invention is to provide an optical-electrical hybrid integrated circuit board on which a large number and high density of optical-electrical conversion elements are required for optical transmission modules or optical signal exchange in optical communications. The goal is to provide the following.

[Summary of the invention]

As mentioned above, the feature of the present invention is the optical waveguide (.

circuits) and electrical system conductor circuits spatially (three-dimensionally) on the same board.

Therefore, by directly mounting the light-receiving element and pure electric element on the substrate, downsizing the entire module, and using such a substrate, the assembly process of the 7 Joule can be simplified.

[Embodiments of the invention]: 1. In order to facilitate understanding of the configuration of the present invention, FIG. 1 is a conceptual diagram of the assembly of an optical-electrical conversion module, and FIG. 2 is a conceptual diagram of the assembly of an optical-electrical conversion module according to the present invention. Illustrated in the diagram. Here the second
The feature of the present invention shown in the figure is that the module shown in Figure 1 has an optical waveguide section and an electronic circuit that were separate, but they are integrated (three-dimensionally) into one, thereby reducing the overall size of the module. . A cross section of this three-dimensional configuration is shown in FIG. By doing this, the size of the trap is approximately 8° compared to the conventional module construction method.

It can be reduced to 1/2. These compact conversion modules are convenient for OA conversion from multi-core optical 7-iper 1 to OA conversion, and can be used for many optical parallel transmission modules such as OA and FA.

In addition, FIGS. 4 to 6 show many more of these configurations.
This is an example of a high-density structure in which optical waveguides and electrical conductors are arranged vertically and horizontally in a thick (multilayer) glass-ceramic substrate. Optical-electrical interface requiring a converter 1. .

It is convenient for use.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

Embodiment 1: Light-receiving module circuit board for parallel transmission A module circuit board for parallel transmission according to the present invention is shown in FIGS. 1 to 5.

The light (signal) transmitted by the mass, 8-core (ribbon type) optical fiber 1 is guided to the light receiving element mounting part 5 on which the light receiving element (PP) is mounted (by trapping, another quartz fiber is connected to a length of about 4 Qmm). Cut them into lengths and arrange 8 of them on a quartz glass guide plate with a V-groove.Next, on top of this, a small amount of glass ceramic powder (SiO, -8On -z
& 01-My.

+ quartz glass) and then quartz glass on top.

A plate was placed and fired in a batch furnace at a temperature of 790°C to solidify the eight guide fibers and guide broad. This results in approximately 20 mmL, 1 (1 m
mW, 4mmt multi-core (8-core) waveguide section (plate)
Create 4. 1. .

Separately, a conductor (A!i-Pd system) is printed on a green sheet (green sheet) of glass ceramics of the same quality as described above using a normal thick film printing technique. At this time, if necessary, one through hole is made in the green sheet at the point where the board traps are to be wired vertically, and a conductor is filled and printed in this hole. These various printed sheets are stacked one on top of the other. In order to create a room (space) for mounting electrical elements on this upper layer, a thick sheet punched out into a frame shape is placed on top of the upper layer, and is temporarily pressed using a hot press (17 layers at 120° C., 20 m'') to form multiple layers. This was fired at approximately 850°C to produce an electrical circuit section.The size of the multilayer board on which this electrical element was mounted was 20 mm L, 25 mm W, and 5 mr.
nt. In this manner, two boards each having pads for mounting electrical system conductors 8 and electrical elements are prepared in accordance with the design wiring diagram of the entire module. Next, these are stacked in a sandwich shape with the optical waveguide plate prepared earlier in the center, and both are bonded with low melting point glass (580°C) to form a multi-core waveguide 4 as shown in FIG. An optical-electrical hybrid circuit board consisting of an electrical element mount, a 1° mounting part 6, and a light receiving element mounting part 5 is prepared. Using this substrate, a multi-core optical fiber 1 shown in FIG.
, its original connector 2 and electrical signal output connector (output outlet) 7 are attached to manufacture our small 8-core module for optical parallel transmission. Note that the end face of the multi-core waveguide section 4 of this board should be mirror-finished, and a matching liquid should be used at the joint in order to increase the bonding efficiency with the multi-core optical connector 2 and the photodetector (PD). uses a technique similar to the joining method of other element relations.

Eight light receiving elements and 12 electrical system elements can be mounted on this original parallel transmission receiving module board. Furthermore, the conventional process of arranging and fixing the optical waveguides one by one can be omitted, and the space where the electrical circuit section spreads secondarily can be reduced.

In the figure, 3 is a multicore waveguide lens stopper, and 9 is a 7 joule cover.

Example 2 Mosier substrate for high-density conversion 1° The outline of this example is shown in FIGS. 4 to 6.

First, as mentioned above, the glass-ceramic sheet) 10
Uses 0 x 100 m square and is required for the module board.

Print the required conductors. At this time, the use of through holes for the vertical wiring is the same as in the first embodiment.

Furthermore, the multi-core waveguide section 4 has a through hole perpendicularly penetrated through the substrate so that an optical fiber having approximately the same diameter can be inserted into the through hole. The conductor-printed sheets stacked in multiple layers (20 layers) in this way are temporarily adhered using a hot press, and holes K and light are inserted into the empty through holes.

Sixty-four fibers (one hole per hole) were inserted and fired at 780°C. As a result, optical-electrical hybrid circuit boards shown in FIGS. 4 to 6 were produced. On this board, one OA conversion light-receiving element was mounted on the 5rILWL angle, and the necessary wiring was laid around the waveguide.

After firing the above-mentioned board, one end of the fiber of the waveguide section was mirror-finished, and the board was then fitted with 7 langes for the original connector and for electrical signals.

Attach output (Ilo) pin etc.

The substrate thus produced has 64 light-receiving elements mounted one after another in a continuous process, and all of its optical and electrical signal input/output terminals are located on the back side. Therefore, it was possible to efficiently assemble a compact q conversion module having a large number of light receiving elements.

In the figure, 11 is an electrical system conductor pad, 12 is an optical waveguide end face, 16 is a light receiving element fixing stand, 14 is an electrical system output conductor pin, 15 is an optical waveguide connector 7 flange, and 16.17 is an internal conductor wiring. , 18 is a cap for the light receiving element.

〔Effect of the invention〕

As described above, in the optical parallel transmission multi-core module board of Example 1 of the present invention, the size of the 25 x 25 mm x 1
8 light receiving elements on a 5mm size board.

A small O/B conversion module equipped with 12 electric elements can be formed.

Furthermore, in the optical-electrical hybrid integrated circuit board of Example 2, 1
00 x 1QQ7JL1n square board with 64 O/
E...

Can be equipped with a conversion photodetector. This is an exchange system for optical communication lines that requires OA conversion for high-density data communication.
It is extremely effective for the 0-E interface of the /E module.

[Brief explanation of the drawing]

Figure 1 is an O/E conversion module, Figure 2 is a top view of the O/E conversion module board according to the present invention, Figure 5 is a sectional view of Figure 2, and Figures 4 to 6 are our conversion according to the present invention. FIG. 1 is a plan view, a partial distribution view, and a sectional view showing a Mosier optical-electrical hybrid integrated circuit board. 1... Multi-core optical fiber 2... Multi-core optical connector 5... Multi-core waveguide lens stopper 4... Multi-core waveguide section 5... Light receiving element mounting section 6... Electrical system element mounting part 7... Electrical system output connector (outlet part) 8...
Electrical system element 9... Module cover 11... Electrical system conductor pad 12... Optical waveguide end face 15... Light receiving element fixing base 14... Electrical system output conductor pin 15... Light guide Wave connector flange 16.17...Inner conductor wiring 18...Light receiving confectionery cap 3rd Tf! J Fig. 4 r @ -cho・-r r 7 HD G bottom "■" 1 "・ 1 .21+-"-to square・ "6,5""': l l
l: ijl+ ” ” t, l-, -ichiyo,,,, j D G: -"-ichisun--→--4---1L----J1 l
1 1 1 11←--μm -μ-- II, Il 1 I I I I 11 z 111 Shi-Lh-IJ Kotobuki 34 8z 圀

Claims (2)

[Claims] (1) An optical device characterized by forming a circuit of an optical waveguide and an electrical conductor in the same substrate, thereby mounting a large number of optical-to-electrical conversion elements at high density. -Electrical hybrid integrated circuit boards. (2) The optical-electronic device according to claim 1, wherein the substrate material is glass ceramic, the optical waveguide is quartz glass fiber, and the glass ceramic of the substrate is composed of multiple layers. Hybrid integrated circuit board.