JPS61237493A - Checking for mounting of part - Google Patents
Checking for mounting of partInfo
- Publication number
- JPS61237493A JPS61237493A JP60079781A JP7978185A JPS61237493A JP S61237493 A JPS61237493 A JP S61237493A JP 60079781 A JP60079781 A JP 60079781A JP 7978185 A JP7978185 A JP 7978185A JP S61237493 A JPS61237493 A JP S61237493A
- Authority
- JP
- Japan
- Prior art keywords
- board
- adhesive
- mounting
- parts
- confirmation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
部品を基板に実装する際に、その位置を規正するため接
着剤を用いて部品を基板に対して仮止めしてからハンダ
付は等Ｃ；よって固定するが、本発明の方法によればこ
の際における接着剤の付着状況、または部品の装着状況
を確認することが容易？二できるようになる。[Detailed Description of the Invention] [Summary] When mounting a component on a board, the component is temporarily fixed to the board using an adhesive to regulate its position, and then soldered. However, according to the method of the present invention, is it easy to check the adhesion status of adhesive or the installation status of parts? You will be able to do two things.
本発明は部品仮止め用接着剤の付着状況および部品の装
着状況を確認するための方法に係り、特にチップ部品や
フラットパックＩＣ等の面実装用部品を基板Ｃ：仮止め
する際に使用される接着剤の付着位置や量、および部品
の取付位置等を容易１；確認することができる部品装着
確認方法Ｃ：関するものである。The present invention relates to a method for checking the adhesion status of an adhesive for temporarily bonding components and the mounting status of components, and is particularly used when temporarily bonding surface mount components such as chip components and flat pack ICs to a board C. Component mounting confirmation method C: allows easy confirmation of the adhesion position and amount of adhesive and the mounting position of components.
チップ部品やフラットパックＩＣ（ＦＩＣ）等の面実装
用部品は、一般に自動装着機を用いて基板に実装される
。この際、これらの部品のハンダ付は作業を行う前に、
その取付位置を規正するため予め接着剤を用いて基板に
仮止めされる。Surface-mount components such as chip components and flat pack ICs (FICs) are generally mounted on a board using an automatic mounting machine. At this time, before soldering these parts,
In order to regulate its mounting position, it is temporarily fixed to the board using adhesive in advance.
この場合、仮止めに使用される接着剤は部品装着前に自
動機を用いて塗布されるが、この場合の塗°布量や塗布
位置は環境（特に温度）条件や塗布用ノズルの穴径のバ
ラツキ等によって変化する。In this case, the adhesive used for temporary fixing is applied using an automatic machine before mounting the parts, but the amount and position of application in this case depends on environmental (especially temperature) conditions and the hole diameter of the application nozzle. It changes depending on the variation in the
また部品の取付けに際しても、自動装着ａｌＩ：おいて
部品をセンタリングし装着位置を決定する爪の交換や調
整を行うたびに、部品の取付位置が変化したりまたは曲
りたりする等、その装着状況が変化する。In addition, when installing parts, automatic installation ALI: Each time the pawl that centers the part and determines the installation position is replaced or adjusted, the installation position of the part changes or bends, etc. Change.
そのため１部品仮止め用接着剤の付着状況や部品の装着
状況を、容易に確認できるようＣ二することが要望され
ている。Therefore, there is a demand for C2 so that it is possible to easily check the adhesion status of the adhesive for temporarily fixing one component and the mounting status of the component.
従来、部品仮止め用接着剤の付着状況や部品の装着状況
を容易に確認する方法はなく、部品取付は後またはハン
ダ付は後の基板の外観等から判断するほかなかった。Conventionally, there was no way to easily check the adhesion status of adhesive for temporarily fixing components or the mounting status of components, and the only way to determine whether components were to be attached later or soldered was determined from the appearance of the subsequent board.
第２図は基板上における部品の実施例を示したものであ
って、基板１上Ｃ：接着剤２を用いてチップ部品５を接
着し、端子４Ａとパターンランド５４問および端子４Ｂ
とパターンランド５Ｂ間でハンダ付けを行おうとした場
合、接着剤の量が適当であれば６に示すように端子４Ａ
とパターンランド５Ａ間に跨ってへンダ６が付着するが
、接着剤の量が多丁、ぎたときは７に示すように端子４
Ｂとパターンランド５Ｂ間に接着剤のはみ出しを生じ、
このためへンダは端子部分８Ａとパターンランド部分８
Ｂとに分離し、破線で示されるような不着部９を生じる
。FIG. 2 shows an example of parts on a board.C on board 1: Chip parts 5 are bonded using adhesive 2, and terminals 4A, 54 pattern lands, and terminals 4B
When trying to solder between the terminal 4A and the pattern land 5B, if the amount of adhesive is appropriate,
The solder 6 is attached across the terminal and pattern land 5A, but if the amount of adhesive is too large, the terminal 4 is attached as shown in 7.
Adhesive protrusion occurs between B and pattern land 5B,
Therefore, the solder is the terminal part 8A and the pattern land part 8.
B, and a non-adherent portion 9 as shown by a broken line is generated.
また接着剤の量が少な丁ぎたときは、部品を取付は後に
おいて脱落することがある。Also, if the amount of adhesive is too small, parts may fall off after installation.
本発明はこのような従来技術の問題点を解決しようとす
るものであって、本発明の方法を用いることによって、
基板上における部品仮止め用接着剤の付着状況や部品の
装着状況を、容易に確認することができるようにしよう
とするものである。The present invention aims to solve the problems of the prior art, and by using the method of the present invention,
The purpose is to make it possible to easily check the adhesion status of adhesive for temporarily fixing parts on a board and the mounting status of parts.
本発明の部品装着確認方法は、接着剤を用いて基板に部
品を仮止めしてから実装する際に、第１図の実施例Ｃ：
示すようｇ二基板と同形の透明な確認用基板を使用し、
同一工程によって接着剤を用いて部品を固定することに
よって、接着剤の塗布状況および部品の装着状況を確認
するようにしたものである。The component mounting confirmation method of the present invention is performed by temporarily fixing components to a board using an adhesive and then mounting the components, according to the embodiment C shown in FIG.
Use a transparent confirmation substrate of the same shape as the g2 substrate as shown,
By fixing the parts using adhesive in the same process, it is possible to check the application status of the adhesive and the mounting status of the parts.
本発明の方法では部品を仮止めした確認用基板が透明な
ので、基板の裏面から観察することシ；よって、接着剤
の塗布状況や部品の装着状況を容易（＝確認することが
できる。この際基板面のけかき線を利用丁れば、位置の
確認がさらに容易（：なる。In the method of the present invention, since the confirmation board on which the parts are temporarily attached is transparent, it is possible to observe it from the back side of the board; therefore, it is possible to easily (= check) the adhesive application status and the mounting status of the parts. If you use the marking lines on the board surface, it will be easier to confirm the position.
第１図は本発明の一実施例を説明するものであって、１
１はアクリル板等の透明な材質からなる確認用基板であ
って、部品等を実装すべき基板と同形に作成されている
。FIG. 1 explains one embodiment of the present invention.
1 is a confirmation board made of a transparent material such as an acrylic plate, and is made to have the same shape as the board on which components and the like are to be mounted.
確認用基板１１ｔ−使用する際Ｃ：は、その上に設けら
れた位置決め用穴１２Ａ 、 １２Ｂを利用して自動装
着機にセットし、実際の場合と同一工程によって接着剤
’ｔ−＊布して部品を仮止め装着する。第１図において
１３は塗布された接着剤を示し、１４は接着剤１３シニ
よって仮止めされたチップ部品を 示している。When using the confirmation board 11t, set it on the automatic mounting machine using the positioning holes 12A and 12B provided on it, and apply the adhesive 't-* cloth using the same process as in the actual case. Attach the parts temporarily. In FIG. 1, reference numeral 13 indicates applied adhesive, and reference numeral 14 indicates a chip component temporarily fixed with adhesive 13.
基板１１に対して部品１４等の仮止め装着の工程が終了
したのち、基板１１ ｔ’自動装：ｉ１機から収外し、
各部品の取付状況を観察Ｔる。この際基板１１は透明な
ので裏面から観察することＣ：よって、表面からは見る
ことができない部品の下側における接着剤の付着量や付
着位置’ｔ−ｄ察し、良否を判断することができる。After the process of temporarily attaching parts 14, etc. to the board 11 is completed, the board 11 is removed from the t' automatic mounting: i1 machine,
Observe the installation status of each part. At this time, since the substrate 11 is transparent, it must be observed from the back side C: Therefore, it is possible to judge the quality of the product by observing the amount and position of the adhesive on the underside of the component, which cannot be seen from the front surface.
さらに基板１１ にはけかき線１５が任意の間隔で縦横
に設けられており、これを利用して部品の取付位置およ
びこれＩ：対応する仮止め用接着剤の付着位置の関係を
観察し、その良否を判断することができる。Furthermore, marking lines 15 are provided vertically and horizontally on the board 11 at arbitrary intervals, and these are used to observe the relationship between the attachment position of the parts and the attachment position of the corresponding temporary adhesive. You can judge whether it is good or bad.
従ってこれらの観察結果Ｃ二基づいて試行的に調整を行
うことによって、実際の基板を使用した際における仮止
め用接着剤の付着量、付着位置を適正化するとともに、
部品の取付位置を規正することが可能になる。Therefore, by making trial adjustments based on these observation results C2, we can optimize the adhesion amount and adhesion position of the temporary adhesive when using the actual board, and
It becomes possible to regulate the mounting position of parts.
以上説明したように本発明の確認用基板によれば、基板
上に部品を実装する際Ｃ二おける部品仮止め用接着剤の
塗布量と塗布位置を確認することができるので、接着剤
の適量塗布、定位置塗布を行うことができるようになる
とともに、部品取付位置を適正化することができる。As explained above, according to the confirmation board of the present invention, it is possible to check the application amount and application position of the adhesive for temporarily fixing components in C2 when mounting components on the board, so that the appropriate amount of adhesive can be applied. It becomes possible to perform coating and fixed-position coating, and it is also possible to optimize the parts mounting position.
第１図は本発明の一実施例の説明図。 第２図は基板上における部品の実装例を示す図である。 １１・・・確認用基板 １２Ａ、 １２Ｂ・・・位置決め用穴 １３・・・接着剤 １４・・・チップ部品 １５・・・けがき線 FIG. 1 is an explanatory diagram of an embodiment of the present invention. FIG. 2 is a diagram showing an example of mounting components on a board. 11...Confirmation board 12A, 12B...Positioning hole 13...Adhesive 14...Chip parts 15...Scribbling line
Claims (2)
する工程において、 該基板と同形の透明材質からなる確認用基板を用い、 該確認用基板に接着剤を用いて部品を固定することによ
つて、接着剤の塗布状況および部品の装着状況を確認す
ることを特徴とする部品装着確認方法。(1) In the process of temporarily fixing components to a board using adhesive and then mounting, a confirmation board made of a transparent material with the same shape as the board is used, and the components are fixed to the confirmation board using adhesive. A component attachment confirmation method characterized by confirming adhesive application status and component attachment status by checking.
徴とする特許請求の範囲第１項記載の部品装着確認方法
。(2) The component mounting confirmation method according to claim 1, characterized in that a marking line is provided on the confirmation board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60079781A JPS61237493A (en) | 1985-04-15 | 1985-04-15 | Checking for mounting of part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60079781A JPS61237493A (en) | 1985-04-15 | 1985-04-15 | Checking for mounting of part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61237493A true JPS61237493A (en) | 1986-10-22 |
| JPH0365920B2 JPH0365920B2 (en) | 1991-10-15 |
Family
ID=13699745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60079781A Granted JPS61237493A (en) | 1985-04-15 | 1985-04-15 | Checking for mounting of part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61237493A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103555A (en) * | 1978-01-31 | 1979-08-15 | Nippon Electric Co | Method of inspecting glazed position for hybrid integrated circuit board |
-
1985
- 1985-04-15 JP JP60079781A patent/JPS61237493A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103555A (en) * | 1978-01-31 | 1979-08-15 | Nippon Electric Co | Method of inspecting glazed position for hybrid integrated circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365920B2 (en) | 1991-10-15 |
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