JPS61232699A - Charge dynamo controller for vehicle - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a control device for a vehicle charging generator that controls the output voltage of an alternator that charges an on-board battery to a predetermined value using an internal combustion engine or the like as a drive source. It's about structure.

(Conventional technology) The overall circuit of this type of conventional device is shown in FIG.

FIG. 3 is an external view of the semiconductor voltage regulator shown in FIG. 2. First, in Fig. 2, 1 is an armature coil, 2 is a field coil, 3 is a full-wave rectifier diode bridge for rectifying the alternating current output generated in the armature coil 4, and a battery 4.
It is connected to the. 5. A semiconductor voltage regulator for controlling the output voltage of the generator to a predetermined value, which is comprised of the following components. 6 is a flywheel diode for surge absorption connected in parallel with the field coil via external connection terminals 40a and 40b, and 7 is the output voltage of the generator described in 1. a constant voltage diode that detects the output voltage of the generator and becomes conductive when the output voltage reaches a predetermined value; Reference numeral 8 denotes a Heath resistance of the power transistor 12, and the power transistor 12 is turned on when the transistor 13 is turned off, that is, when the output voltage of the generator is below a predetermined value. 14 is a key switch.

The operation of the conventional device configured as described below will be briefly explained. First, when the key switch 14 is closed, current is supplied from the battery 4 to the semiconductor voltage adjustment circuit, but the terminal voltage of the battery 4 is low and the voltage regulator diode 1''7 is turned off.
maintain the condition. Therefore, since the transistor 13 is also in the cut-off state, the power 1 - transistor 12 is supplied with the Hass current via the Hayss resistor 8, so it is turned on, and the field current is supplied to the field coil 2. When the generator starts generating electricity, an AC output is induced in the armature 1 and 2, and the AC outputs 1 and 2 are rectified by the full-wave rectifier diode 1 Brinow 3 to charge the battery 14.

When this generator is charged, ζ,1, the output voltage of the generator reaches a predetermined value, and the hesoteri 4 is sufficiently charged, and the voltage dividing resistor 9.1
The tap voltage of 0 continues until the constant voltage diode 7 is turned on.

When the output voltage of the generator reaches a predetermined value, the voltage regulator diode I-7 turns on, the transistor 13 also becomes conductive, and the power transistor 12 shifts to the cut-off state to cut off the field current of the field coil 2. The power is cut off to stop power generation and reduce the output voltage of the generator.

When the output voltage of this generator drops to a predetermined value, the voltage regulator diode 1'7 is turned off again, and as a result, the power transistor 12 is made conductive, restarting power generation and increasing its output voltage by l-. .

The output voltage of the generator is maintained at a predetermined value by the switching operation of the power transistor 12 mentioned above.The assembly structure of the conventional device mentioned above is shown in FIG. In FIG. 4, 30 is a resin case integrally molded with external connection terminals 40a for connection with field coil 2, etc., and 50 is a resin case with a thickness for mounting IC circuit components of a semiconductor voltage regulator. This is a semiconductor circuit board (ceramic board) for membrane hybrid IC.

42 is a terminal, which is soldered onto the printed conductor provided on the semiconductor circuit board 50 and serves as an external connection terminal 40a.
This is to facilitate electrical connection between the IC circuit parts on the semiconductor circuit board 50 and the IC circuit components on the semiconductor circuit board 50.

This terminal 42 is connected to the external connection terminal 40a through the lead 41 by soldering, welding, or the like. Note that wire bonding may be used for the leads 41 in consideration of automation of assembly.

Reference numeral 12 denotes a power transistor 12 which constitutes one of the semiconductor elements of the aforementioned semiconductor voltage regulator. 20 is a heat sink for promoting heat dissipation from the semiconductor circuit board 50 to which the power transistor 12 is soldered;
An adhesive 60 connects the heat sink 20 and the semiconductor circuit board 50.

(Problems to be Solved by the Invention) However, in the configuration of the conventional device described above, the adhesive 6
The semiconductor circuit board 50 and the heat sink 20 are used as adhesives such as epoxy, which is highly viscous and difficult to apply to the adhesive surface with a uniform thickness.
The thermal resistance between the two may be non-uniform even within the same semiconductor circuit board.

In addition, the thermal conductivity of this type of adhesive 60 is generally half-heavy times M.
Compared to the ceramic substrate of the B'A board 50 and the good thermal conductor material such as copper used for the heat sink 20, its thermal conductivity is more than an order of magnitude lower, so insufficient adhesion and thickness variations are likely to occur. This structure leads to an excessive temperature rise of the power transistor 12, etc., and has a reliability problem. Furthermore, if there are adhesion holes directly under or around the semiconductor circuit board 50 to which the power transistor 12, which is a semiconductor element, is soldered, the reliability will further deteriorate.

In addition, as one method to solve the above-mentioned problems, adhesion)
For example, in order to ensure uniform spread and thickness of the semiconductor circuit 2. (The plate 50 may be adhesively fixed using an assembly jig for adhesion that applies pressure between the heat sink 20 and the case when adhering the heat sink and the case. However, it is necessary to place the jig on the ceramic substrate, which is fragile against mechanical distortion, and on the soldered side of the semiconductor element 12, which also poses a problem in reliability. It becomes a structure.

Therefore, the present invention provides a semiconductor circuit board 50 and a heat sink 2.
It is an object of the present invention to provide a structure of a control device for a vehicle charging generator in which no adhesive layer is formed between G and 0, and the thickness of the adhesive layer is uniform.

(Means for Solving the Problems) In view of the problems of the conventional device described in -11, the present invention provides a device that is molded integrally with the external connection terminal (40a) and protects the semiconductor circuit board (50). There is a protrusion (3) on the case (31).
1a), place two C4 semiconductor circuit boards (50) on the protrusion (31a), stack the heat sink (20) on one of them, and connect the heat sink (20) and the semiconductor circuit board. (50), between the semiconductor circuit board (50) and the case (31), and between the heat sink (20) and the case (
31) This is a control device for a vehicle charging generator that has a structure that allows for simultaneous bonding, fixing, and insulation between the parts.

(Effects of the Invention) The present invention provides a case (31) for protecting a semiconductor circuit board (50) formed in a body with a connecting end (40a).
) for holding the semiconductor circuit board (50) on the protrusion (
31), further place a heat sink (20) on the semiconductor F11 circuit board (50), and by the bonding force between the P1-sink (20) and the case (31), the case (31) , '4''! Since the circuit board (50) and the heat sink (20) are bonded, fixed, and insulated at the same time, the heat sink ( Since the adhesive material (60) between the semiconductor circuit board (50) and the semiconductor circuit board (50) is sufficiently pressurized, the control device for the vehicle charging generator has excellent adhesiveness, uniform thermal resistance, and excellent reliability. The effect is that it can be provided.

(Example) An example of the present invention will be described below with reference to FIG. The electric circuit and external appearance are the same as those in FIGS. 2 and 3, so their explanation will be omitted. In the figure, 31 is an external connection terminal 40a
The protective case for the semiconductor circuit board 50 is molded integrally with the heat sink 20, but it is the same as the conventional example described above.
When a semiconductor circuit board 5o to which a semiconductor element such as the above is soldered is stored, and the semiconductor circuit board 50 is stored, the case surface 31b and the back surface 50a of the semiconductor circuit board 50 are approximately the same.
It has a protrusion 31a that increases the height. The case 31 having such a protrusion 3]a is placed so that the protrusion 31a is on the upper side as shown in FIG.
-U on the protrusion 31a so that the kissed side is facing downward.
Then, the heat sink 20 coated with the adhesive 60 is placed on the aluminum case 1- and the sink 20, which is large in both size and weight, has its own weight or the hiss between the heat sink 2b and the case 31, etc. Tighten by [1
The force promotes the uniform spread of the adhesive +4'60 and reliable adhesion, resulting in a structure as simple as an assembly T with no variation in thermal resistance directly under the semiconductor circuit board. Note that the lead 4I is soldered with solder 4=1. It is connected to the external connection terminal 40a and the terminal 42 by welding or the like. ”
- According to the above configuration, it is possible to bond semiconductor elements such as the power transistor 12 which are easily damaged during the bonding process upside down as shown in FIG. At the same time, protection can be provided from foreign matter contamination and falling objects, which have an unavoidable negative effect on the product.

Furthermore, with improved single-stick adhesion, it is possible not only to improve reliability but also to downsize the semiconductor circuit board +1Q, power transistor, and heat sink.

[Brief explanation of the drawing]

FIG. 1 is a partial sectional view showing one embodiment of the vehicle charging generator control device according to the present invention, and FIG. 2 is an electric circuit diagram of the first embodiment and the conventional vehicle charging generator control device. Figure 3 shows the above embodiment and the conventional semiconductor type voltage, 1lil.
FIG. 4 is a partial sectional view showing an example of a conventional device. 2... Field coil, 12... Power 1 to transistor forming one of the semiconductor elements, 20... Heat sink, 3
1...Case, 3]a...Protrusion, 40a...External connection terminal.

Claims (1)

[Claims] a case made of an insulator that is connected to the field coil and has an external connection terminal that supplies the field current to the field coil, and that holds the external connection terminal; In the vehicle charging generator control device, the control device includes a semiconductor circuit board having a semiconductor element for controlling and adjusting the output voltage of the generator to a predetermined value, and a heat sink for dissipating heat of the semiconductor circuit board. The case has a protrusion that protrudes into the case, and the semiconductor circuit board is housed on the protrusion, and the heat sink is placed on the semiconductor circuit board via an adhesive, thereby forming the case. A vehicle charging generator characterized in that the heat sinks, the case and the semiconductor circuit board, and the semiconductor circuit board and the heat sink are simultaneously adhesively fixed and insulated by the bonding force between the heat sink and the case. control device.