JPS61228636A - Transporting container for semiconductor device - Google Patents

Abstract

PURPOSE:To enable the measurement of the characteristics of a semiconductor device without removal from the container by arranging the measurement electrode electrically connected respectively to the electrodes of the semiconductor devices contained in the container for containing semiconductor devices, on the surface of this container. CONSTITUTION:An insulating member 2 and a metallic member 5 are united into one body by screw and the insulating member 2 is provided with an opening 8 in which a semiconductor device 9 enters by cutting or punching the insulating material such as Bakelite. On the surface of the insulating member 2, an electrode 3 is formed with an electrode 10 of the semiconductor device 9 in contact. A circuit wiring 4 is formed from those electrodes 3 and is led to the end of the container to be continuous to a socket-outlet. Under the insulating member 2, the metallic member 5 such as phosphor bronze is arranged and the insulating member 2 is inserted in a hole of the metallic member 5. Furthermore, a plate 6 of aluminum or the like, is provided with an electrode stopper 7 made of an insulating material such as Teflon attached with a spring, as a stopper of the electrode 10 of the semiconductor device 9, which fixes the semiconductor device 9 and the electrode of it surely and connects them from a socket-outlet to a specified measurement device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a container used for transporting semiconductor devices, and more particularly to a container for transporting semiconductor devices that is convenient for measuring characteristics of semiconductor devices.

[Conventional technology]

Conventionally, containers of various shapes have been used in ultra-high frequency semiconductor devices due to diversification. Since the shapes of containers are different from each other, it is necessary to use containers for transporting semiconductor devices that match the shape of each semiconductor device C0 before sending it to the next process.

FIG. 3 is a sectional view of a typical conventional transport container for ultra-high frequency semiconductor devices. Metal parts such as stainless steel 1.1' L
The DHLD has a two-layer structure in which these are screwed together. After a metal member 1 of a predetermined shape is formed from a metal plate by pressing or etching 7, it is fixed to the other metal member 1' with screws to complete the process.

When measuring the DC characteristics of semiconductor devices in such a current transport container, the individual semiconductor devices are removed from the transport container 9 and measured after being replaced with dedicated electrodes, and then placed back into the transport container. Alternatively, it is stored in a dedicated container. Therefore, problems arise in terms of man-hours due to replacement etc.

[Problem that the invention seeks to solve]

Therefore, in order to measure the characteristics of a semiconductor device, it is not possible to simply install the transport container in the characteristic measuring device; instead, it is necessary to take it out of the transport container and transfer it to the characteristic measuring device, which greatly hinders the automation of characteristic measurements. was.

[Means for solving problems]

According to the VC of the present invention, a container for transportation is obtained which has measurement electrodes electrically connected to respective electrodes of the semiconductor device housed on the surface of the container housing the semiconductor device.

〔Example〕

The present invention will be explained below with reference to the drawings.

Figure 53!1 is a cross-sectional view showing an embodiment of the present invention, and Figure 2 is an enlarged cross-sectional view when a semiconductor device is mounted, and the insulating member 2 and the metal member 5 are integrated by screwing. There is. The insulating member 2 is made by cutting or punching an insulating material such as Bakelite, and has an opening 8 into which the semiconductor device 9 is inserted. On the top surface of the insulating member 2, there is an etch knob L.
An O electrode 3 is formed so that the electrode 1o of the semiconductor device 9 comes into contact with it. Furthermore, circuit wiring 4 is formed from these wires &3 and runs to the edge of the container, so that it continues after the socket is inserted. A metal member 5 made of phosphorescent copper or the like is provided below the insulating member 2, and the insulating member 2t is fitted into a hole in the metal member 5.

Further, as a presser for the electrode 10 of the semiconductor device 9, an electrode presser 7, which is made of a light metal plate 6 such as aluminum 6 and a spring attached to an insulating material such as Teflon, is provided to securely hold the electrode 10 of the conductor device 9. The design is designed so that it can be connected to a characteristic measuring device by inserting a socket.

Many conventional transportation containers do not come with a top lid or the like, and there is a risk that semiconductor devices may fall during transportation, resulting in a decrease in quality. In addition, when measuring characteristics, it is necessary to take out each semiconductor device from the transport container, return it to the transport container again after measuring the characteristics, and repeat the process of measuring the next semiconductor device under test. .

The present invention can prevent semiconductor devices from falling during transportation by attaching a top lid t*v made of a light metal plate 6 to the transportation container.
It is possible to prevent quality deterioration of semiconductor devices that fall Vc. or,
By forming electrodes on the container, the transport container can be directly connected to the characteristic measuring device.

It becomes possible to measure the characteristics of all the semiconductor devices mounted on the transport container without taking them out from the transport container as in the past, and it is possible to reduce the number of man-hours for measuring characteristics.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to obtain a transport container for semiconductor devices which is very effective in compensating for the drawbacks of conventional transport containers and reducing the number of man-hours for measuring quality and characteristics.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention. Figure 2 is an enlarged sectional view of nine cases in which typical semiconductor devices are mounted. Figure @3 is a sectional view of a typical transport container for a conventional ultrahigh wave semiconductor device. 1.1'...Metal member, 2. Mountain...Insulating member,
3... Electrode, 4... Circuit wiring, 5... Mountain... Metal member, 6... Light metal plate, 7...
... Electrode holder, 8 ... Hole, 9 ... Semiconductor device, 10 ... Electrode.

Claims (1)

[Claims] The container has a plurality of electrodes that can be electrically connected to the electrode terminals of the semiconductor device to be accommodated, the plurality of electrodes are electrically wired to external lead-out terminals on the container, and the container has the A container for transporting semiconductor devices, characterized by having an upper lid for crimping and fixing electrode terminals of semiconductor devices.