JPS61225784A - Manufacture of elastically electric circuit part - Google Patents

Manufacture of elastically electric circuit part

Info

Publication number
JPS61225784A
JPS61225784A JP6550285A JP6550285A JPS61225784A JP S61225784 A JPS61225784 A JP S61225784A JP 6550285 A JP6550285 A JP 6550285A JP 6550285 A JP6550285 A JP 6550285A JP S61225784 A JPS61225784 A JP S61225784A
Authority
JP
Japan
Prior art keywords
rubber
conductive
molded product
laser beam
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6550285A
Other languages
Japanese (ja)
Inventor
村田 昌彌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP6550285A priority Critical patent/JPS61225784A/en
Publication of JPS61225784A publication Critical patent/JPS61225784A/en
Pending legal-status Critical Current

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  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】[Detailed description of the invention]

(産業上の利用分野) 本発明は弾性電気回路部品の製造方法、特にはIC基板
間などに用いられるコネクター、可撓性基板、入力用接
点付基板1表示板などに有用とされる弾性電気回路部品
を高い精密度で工業的に容躬に製造する方法に関するも
のである。 (従来の技術) 弾性電気回路部品については絶縁性ゴム部材とカーボン
ブラックなどを配合した導電性部材とを組合せてなる入
力用押釦や導通用7ネクターなどが知られている。しか
し、これらは通常未加硫のゴム材料を金型に仕込んで加
硫するか、加硫ずみの絶縁性ゴムと未加硫の導電性ゴム
とを檀MI L金型内で成形し一体成形品とする方法で
作られているために2未加硫ゴムの加硫成形時における
収縮あるいは膨張によって成形品の寸法に狂いが生じる
という不利があ蚤】、これにはまた回路形状が複雑なも
のはその成形が困難で、全型代も嵩み、少h
(Industrial Application Field) The present invention relates to a method for manufacturing elastic electrical circuit components, and in particular to elastic electrical circuit components that are useful for connectors used between IC boards, flexible boards, boards with input contacts, display boards, etc. This invention relates to a method for industrially manufacturing circuit components with high precision. (Prior Art) As for elastic electric circuit parts, there are known input push buttons and conductive 7-nectars which are made by combining an insulating rubber member and a conductive member containing carbon black or the like. However, these are usually made by putting unvulcanized rubber material into a mold and vulcanizing it, or by molding vulcanized insulating rubber and unvulcanized conductive rubber in a Dan MI L mold. 2) Because the molded product is manufactured using a method that makes it difficult to mold, it has the disadvantage that the dimensions of the molded product may vary due to shrinkage or expansion during vulcanization molding of unvulcanized rubber. It is difficult to mold the product, the total mold cost is high, and the mold cost is small.

【生産が極
めて難しいという欠点がある・他方、最近の工C基板な
どは精密小型化の方向にあり、これには写真印刷法によ
って極めて精巧な構造も作られているため1弾性状のコ
ネクターなどについても精密で複雑な回路を簡単な方法
で製造する方法が望まれている。 (発明の構成) 本発明は従来法におけるこのような不利を解決した弾性
電気回路部品の製造方法忙関するものであり、これは加
硫された絶縁性または導電性のゴム成形品にレーザー光
+181″に照射して回路部を切り抜き、この切り抜き
部に未加硫の導電性または絶縁性のゴム材料を押し込み
、ついでこの未加硫ゴムを加熱硬化して一体成形品とす
ることを特徴とするものである。 すなわち1本発明者は弾性電気回路部品の簡易な製造方
法について種々検討した結果、すでに加硫硬化した各種
ゴム材料にレーザー光線を照射すせることができるとい
うことに注目し、予じめ準備された絶縁性の加硫成形品
にレーザー光線を照射して成形品に″4.気回路図を描
画し−このレーザー光線で切り抜かれた電気(ロ)路図
部分に導電性ゴム部材を充填すれば所望の導電性回路!
もつ成形品を容易にかつ寸法変化もなく精度高く得るこ
とができるということを見出し、このゴム材料の種類−
レーザー加工方法などについての研究を進めて本発明を
完成させた。 本発明の方法において母材とされるゴム部材としては天
然ゴム−エチレン−プロピレン系、88R,NBR,シ
リコーンゴムなどの合成ゴムが例示されるが、電気絶縁
性−耐熱性、耐寒性、耐候性などの点からシリコーンゴ
ムとすることが好ましい。この母材は通宮電気絶縁性ゴ
ムで作られたものとされるが−これ&1目的に応じてカ
ーボンブラックなどのような導電性物質を配合した導電
性のものであってもよく、これらは予じめ所望の形状に
成形し、加熱などの手段で加硫硬化させたものとすれば
よい。 本発明の方法はこの加硫されたゴム成形品母材にレーザ
ー光線を照射して所定部分をそのエネルギーで切り抜く
のであるが、このレーザー光線としては炭酸ガス−ネオ
ン、ヘリウム、アルゴンなどのガスによる長波長のレー
ザーが適しており。 ゴムへの吸収効率がよいということからは炭酸ガスレー
ザー光線とすることがよいが−これらは数W−数10W
のエネルギーをもつものとすればよ(1゜ このレーザー光線による加工は上記したゴム成形品母材
に形成すべき回路図に応じた図形をレーザー光線で描く
ようにすればよく−これは例えば予じめこれ75t1M
、子N、C!、制御装置に記憶させておけば自動的に同
一形状のものを何枚でも製造すると)−f1イ→ス1 
、νの撥叫び百L−出17F 9伊、^ことができるの
で−この省力化は容易に達成することができる。また、
この場合の照射時間1作動時間は成形品の厚さ、成形品
上に描くべき回路図の深さによって制御すればよいが−
例えば厚さ2翼宵のシリコーンゴム成形品に回路図を切
り抜くためには炭酸ガスレーザー光線vo、os〜0.
 S ms宛順次に照射すればよい。 レーザー光線照射によって成形品母材表面には所望の回
路図が初冬】抜かれるが、この切り抜き部にはついで導
電性ゴムが埋め込まれる。これにはこの切り抜き部に導
電性ゴム材料を押圧し、圧入するようにすればよいが、
これは切優】抜き部に液状の導電性ゴム材を注入するよ
うにしてもよく。 この導電性ゴム材を圧入ないし注加したのち、この導電
性ゴム材を加熱などの手段で硬化させればこれが絶縁性
部材と一体成形されるので目的とする電気回路をもつ弾
性電気部品が容易に、かつ正RK m fi r J−
fdでさス 訃七 シバ(イ)z1仕藩叡Aのゴム材料
の圧入、注入に当っては、この切り抜き部にレーザー光
線による焼成残渣(灰)が残ることがあり、これが残っ
ているとゴム材料との接着が妨げられるので、これは例
えばエタノールなどのように表面張力が低くてゴムに悪
影御を与えないよつrx溶剤中に浸漬し、超晋波洗浄し
ておくことがよい。 本発明の方法によれば回路図の相異した部品もその設計
原図を記憶した制御板をと幻かえるだけで容易に飽造す
ることができるので、これは小量多品種生産に特に効果
を発揮するが、b種のものを大量生産する一合には母材
とされる成形品を厚みの大きいものとするか、あるいは
同一の回路図を切I)抜いた多数の成形品を作ってこれ
らを積層し、この切り抜き部に41[性部材を充填し、
硬化させてから、これを平行にスライスするという方法
を適用すればよい。なお、上記では絶縁性ゴム成形品に
切I)抜き部7作り、こ\に導電性ゴムな充填する方法
を説明したが、これは導電性ゴム成形品をレーザー光線
で加工し、こ\に絶縁性ゴムを充填してもよい。 つぎに本発明の方法ン添付の図面にもとづいて説明する
。、第1図〜第5図は本発明の方法をその作業順序にし
たがって図示したもので、第1図はゴム成形品母材のレ
ーザー光MKよる加工方法を示す斜視図、第2図〜第4
図は明番)抜き加工された成形品母材のM層、導電性ゴ
ムの充填−切断工程を示す縦断面図−箱5図は目的とす
る弾性電気回路部品の斜視図を示したものである。K1
図には予じめプレス成形されたゴム成形品母材1に炭酸
ガスレーザー光線のようなレーザー光線の放射器2から
レーザー光線3を照射して回路図穴4を作る方法が示さ
れているが、この加工はレーザー光線!その図16にし
たがって順次照射していけばよく、この作業は回路図を
記憶した自動NCt制御装置Rw使用すれば全自動で行
なわせることができる。 この回路図穴4を切り抜かれた母材5はついで第2図に
示したように穴加工ずみの2枚の母材5の間に導電性ゴ
ム材料6tはさみ−これらを多孔J(7)7’ラスチツ
ク板7を介して積み重ね、上下に抑圧板8を当て\プレ
スすると一導電性ゴム材料6が回路図穴4の切り抜き部
に電気を排除して導入され、切I)抜き部内の空気は多
孔質プラスチック板715r−通って脱気されて、第3
図に示したようなブロック体9が形成されるので一つい
でこれを適宜の温度に加熱すればこの導電性ゴム材料6
が加硫されて母材lの回路図穴4が導電性ゴム材料6で
充填された一体成形品とされる。 つぎに、このブロック状成形品を解体し、プラスチック
板7 yra t3除けば目的とする弾性電気回路部品
が得られるが、これを薄膜状として得るためには導電性
ゴム材料6でbI層された2枚の成形の方向でスライシ
ング刃10でスライスすれば第5図に示したよりな薄層
の目的物11を得ることができる。なお、この弾性電気
回路部品11はそのま一使用してもよいが、これはpi
16図、w、7図に示したように導電性ゴム板12.絶
縁性ゴム板′13で躾打ちしたものとしてもよい。なお
、この成形品母材1が相互に接着し難いものであるとき
にはこれらの表面!プライマー処理してxくか2適宜の
接着剤を介して積層一体させるようにしてもよい。 つぎに本発明の実施例をあげるが4例中の部は重量部を
示したものである。 実施例1゜ シリコーンゴム・KE951U[信越化学工業(株)製
商品名]100部にジクミルパーオキサイド2部を添加
したシリコーンゴムフンバウンドル仝IFJ力fλ柄 
10バーy Q n 1F−/ −J ^々ia−〒で
3分間熱圧成形して300X300X2mの加硫された
母材ゴム板を作った。 つぎKこの母材ゴム板に2〜20Wの炭酸ガスレーザー
光myxパルス時間0.2nsで照射しながら50〜5
00m/秒の早さで電気回路図穴を切す抜いたのち、こ
の上に導電性シリコーンゴム・KE1942[信越化学
工業(株)1!!商品名〕を首ね0.5に4/−dで押
圧して導電性シリコーンゴムコンパウンドを上記の切り
抜き孔に充填し、ついでこれを150℃で20分間加熱
して導電性シリコーンゴムを加硫硬化させたところ、上
記した切り抜き部が導電性とされたシリコーンゴム製の
弾4゜ 性電気回路部品が得られた。 実施例2゜ 実施例1の方法において作られたシリコーンゴム−KE
951U″4r−主材とする300X300X2m11
の母材ゴム板に実施例1と同様に炭酸ガスレーザー光線
でこれに回路図を切り抜いたものを10枚作り、ついで
この2枚の間に導電性シリコーンゴム・KE1942を
はさみ、これらを通気性のあるプラスチック板を介して
積み重ね、上下に抑圧板を重ねてIK9/cWtに押圧
して切り抜かれた回路図に導電性ゴムを充填させたのち
、150℃に加熱してこの導電性シリコーンゴムを加硫
硬化させ、これを高速度鋼製のカッターで厚さ0.3關
にスライスしたところ、上記切11抜き部が導電性とさ
れたシリコーンゴム製の弾性電気回路部品50枚が得ら
れた。
[The drawback is that it is extremely difficult to produce.On the other hand, recent engineering C boards are trending towards precision miniaturization, and this includes extremely sophisticated structures made using photo printing methods, such as flexible connectors, etc. There is also a need for a method for manufacturing precise and complex circuits in a simple manner. (Structure of the Invention) The present invention relates to a method for manufacturing an elastic electrical circuit component that overcomes the disadvantages of the conventional methods. '' to cut out a circuit section, press an unvulcanized conductive or insulating rubber material into the cutout, and then heat and cure the unvulcanized rubber to form an integrally molded product. Namely, as a result of various studies on simple manufacturing methods for elastic electric circuit components, the present inventor noticed that it is possible to irradiate laser beams onto various rubber materials that have already been vulcanized and hardened. The prepared insulating vulcanized molded product is irradiated with a laser beam to give the molded product “4. If you draw an electric circuit diagram and fill the electrical circuit diagram cut out with this laser beam with a conductive rubber material, you can create the desired conductive circuit!
We discovered that it is possible to easily and accurately obtain molded products with no dimensional changes, and we have developed a new type of rubber material.
The present invention was completed by progressing research on laser processing methods. Examples of the rubber member used as the base material in the method of the present invention include synthetic rubber such as natural rubber-ethylene-propylene, 88R, NBR, silicone rubber, etc. From these points of view, it is preferable to use silicone rubber. This base material is said to be made of electrically insulating rubber, but depending on the purpose, it may be made of a conductive material containing a conductive substance such as carbon black. It may be formed in advance into a desired shape and vulcanized and hardened by means such as heating. The method of the present invention irradiates the base material of the vulcanized rubber molded product with a laser beam and uses the energy to cut out a predetermined portion. laser is suitable. It is better to use carbon dioxide laser beams because they have good absorption efficiency into rubber, but these are several watts to several tens of watts.
(1°) This laser beam processing can be done by drawing a figure corresponding to the circuit diagram to be formed on the base material of the rubber molded product with the laser beam. This is 75t1M
, Child N, C! , if you store it in the control device, it will automatically produce as many pieces of the same shape as you like) - f1 A → S1
, ν can be repelled 100 L-out 17F 9 I, ^, so this labor saving can be easily achieved. Also,
In this case, the irradiation time and operating time can be controlled depending on the thickness of the molded product and the depth of the circuit diagram to be drawn on the molded product.
For example, in order to cut out a circuit diagram on a silicone rubber molded product with a thickness of two wings, a carbon dioxide laser beam of vo, os ~ 0.
It is sufficient to irradiate the SMS address sequentially. A desired circuit diagram is cut out on the surface of the molded product base material by laser beam irradiation, and conductive rubber is then embedded in this cutout. This can be done by pressing a conductive rubber material into the cutout, but
[This is a good idea] A liquid conductive rubber material may be injected into the cutout. After press-fitting or pouring this conductive rubber material, if the conductive rubber material is cured by heating or other means, it can be integrally molded with the insulating member, making it easy to create elastic electrical parts with the desired electrical circuit. and positive RK m fi r J-
When press-fitting or injecting the rubber material of fddesassu 訃7 Shiba (I) Z1 Shihanei A, firing residue (ash) from the laser beam may remain in the cut-out part, and if this remains, the rubber Since adhesion with the material is hindered, it is recommended that the rubber be immersed in an RX solvent, such as ethanol, which has a low surface tension and does not adversely affect the rubber, and then subjected to ultra-high frequency cleaning. According to the method of the present invention, parts with different circuit diagrams can be easily manufactured by simply changing the control board that stores the original design drawings, so this is particularly effective for small-lot, high-mix production. However, in order to mass-produce type B products, it is necessary to use a thicker molded product as the base material, or to make multiple molded products by cutting out the same circuit diagram. These are stacked, and the cutout is filled with 41 [sexual material].
After hardening, it may be sliced in parallel. In addition, above, we explained the method of cutting an insulating rubber molded product to create a cutout 7 and filling this with conductive rubber. However, this method involves processing a conductive rubber molded product with a laser beam and filling this with insulating rubber. It may be filled with rubber. Next, the method of the present invention will be explained based on the attached drawings. , FIGS. 1 to 5 illustrate the method of the present invention according to its working order, and FIG. 1 is a perspective view showing the method of processing a base material of a rubber molded product using a laser beam MK, and FIGS. 4
The figure is a vertical sectional view showing the M layer of the blanked molded product base material and the filling and cutting process of conductive rubber. Box 5 shows a perspective view of the intended elastic electric circuit component. be. K1
The figure shows a method for making a circuit diagram hole 4 by irradiating a laser beam 3 from a laser beam radiator 2 such as a carbon dioxide gas laser beam onto a rubber molded base material 1 that has been press-molded in advance. Processing is done using laser beams! The irradiation can be carried out sequentially according to FIG. 16, and this work can be carried out fully automatically by using the automatic NCt control device Rw in which the circuit diagram is stored. The base material 5 with the circuit diagram holes 4 cut out is then sandwiched between the two base materials 5 with the holes cut out with conductive rubber material 6t, as shown in FIG. By stacking the plastic plates 7 through each other and applying and pressing the suppression plates 8 on the top and bottom, the conductive rubber material 6 is introduced into the cutout of the circuit diagram hole 4 while excluding electricity, and the air inside the cutout is porous plastic plate 715r - degassed through the third
A block body 9 as shown in the figure is formed, and by heating it to an appropriate temperature, this conductive rubber material 6 is formed.
is vulcanized to form an integrally molded product in which the circuit diagram hole 4 of the base material 1 is filled with a conductive rubber material 6. Next, this block-shaped molded product is dismantled and the plastic plate 7 is removed to obtain the desired elastic electric circuit component, but in order to obtain this in the form of a thin film, a layer of conductive rubber material 6 is applied. By slicing the two sheets with the slicing blade 10 in the forming direction, a thinner object 11 shown in FIG. 5 can be obtained. Note that this elastic electric circuit component 11 may be used as is, but this
As shown in Fig. 16, W, and Fig. 7, conductive rubber plate 12. It may also be tamped with an insulating rubber plate '13. In addition, when the molded product base material 1 is difficult to adhere to each other, these surfaces! They may be treated with a primer and then laminated together using a suitable adhesive. Next, Examples of the present invention will be given, and the parts in the four examples indicate parts by weight. Example 1 Silicone rubber KE951U [trade name manufactured by Shin-Etsu Chemical Co., Ltd.] 100 parts with 2 parts of dicumyl peroxide added to it. Silicone rubber foam bound to IFJ force fλ pattern.
A vulcanized base rubber plate of 300 x 300 x 2 m was made by hot pressing at 10 bar y Q n 1 F-/ -J ^^ia- for 3 minutes. Next, while irradiating this base material rubber plate with a 2-20 W carbon dioxide laser beam myx pulse time 0.2 ns,
After cutting out the electrical circuit diagram hole at a speed of 00 m/sec, conductive silicone rubber KE1942 [Shin-Etsu Chemical Co., Ltd. 1! ! The conductive silicone rubber compound was filled into the cutout hole by pressing the product [trade name] with a neck of 0.5 and 4/-d, and then heated at 150°C for 20 minutes to vulcanize the conductive silicone rubber. When cured, an elastic 4° electrical circuit component made of silicone rubber in which the cutout portion was made conductive was obtained. Example 2゜Silicone rubber-KE made according to the method of Example 1
951U″4r-Main material 300X300X2m11
10 circuit diagrams were cut out from the base rubber plate using a carbon dioxide laser beam in the same manner as in Example 1, conductive silicone rubber KE1942 was sandwiched between these two sheets, and these were made into a breathable material. They were stacked with plastic plates interposed between them, suppressing plates were stacked on top and bottom, and the cutout circuit diagram was filled with conductive rubber by pressing it against IK9/cWt, and then the conductive silicone rubber was heated to 150°C. This was cured with sulfur and sliced into 0.3-thick pieces using a cutter made of high-speed steel, yielding 50 elastic electrical circuit parts made of silicone rubber in which the cutout portions 11 were made electrically conductive.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法によるゴム成形品母材のレーザー
光線による加工方法を示す斜視図、第2図は切蔭)抜き
加工されたゴム成形品母材積層体の縦断面図、第3図は
導電性ゴムの充填された積層体の縦断面図、第4図はそ
の切断工程を示す縦断面図、第5図〜第7図は弾性電気
回路部品の斜視図を示したものである。 1・・・ゴム成形品母材。 2・・・レーザー光線放射器。 3・・・レーザー光線。 4・・・回路図穴。 6・・・導電性ゴム材料− 7・・・プラスチック板。 8・・・抑圧板。 9・・・ブロック体。 10・・・スライスイング刃。 11・・・弾性電気回路部品。
Fig. 1 is a perspective view showing a method of processing a rubber molded product base material using a laser beam according to the method of the present invention, Fig. 2 is a longitudinal cross-sectional view of a rubber molded product base material laminate that has been punched out (inside the cut), and Fig. 3 4 is a longitudinal sectional view of the laminate filled with conductive rubber, FIG. 4 is a longitudinal sectional view showing the cutting process, and FIGS. 5 to 7 are perspective views of the elastic electric circuit component. 1...Rubber molded product base material. 2...Laser beam emitter. 3...Laser beam. 4...Schematic diagram hole. 6... Conductive rubber material - 7... Plastic plate. 8... Suppression board. 9...Block letters. 10...Slicing blade. 11...Elastic electric circuit component.

Claims (1)

【特許請求の範囲】 1、加硫された絶縁性または導電性のゴム成形品にレー
ザー光線を照射して回路部を切り抜き、この切り抜き部
に未加硫の導電性または絶縁性ゴム材料を押し込み、つ
いでこの未加硫ゴムを加熱硬化して一体成形品とするこ
とを特徴とする弾性電気回路部品の製造方法。 2、ゴム成形品およびゴム材料がシリコーンゴムからな
るものである特許請求の範囲第1項記載の弾性電気回路
部品の製造方法。
[Claims] 1. A circuit section is cut out by irradiating a vulcanized insulating or conductive rubber molded product with a laser beam, and an unvulcanized conductive or insulating rubber material is pushed into the cutout, A method of manufacturing an elastic electric circuit component, which comprises then heating and curing the unvulcanized rubber to form an integrally molded product. 2. The method for manufacturing an elastic electric circuit component according to claim 1, wherein the rubber molded article and the rubber material are made of silicone rubber.
JP6550285A 1985-03-29 1985-03-29 Manufacture of elastically electric circuit part Pending JPS61225784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6550285A JPS61225784A (en) 1985-03-29 1985-03-29 Manufacture of elastically electric circuit part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6550285A JPS61225784A (en) 1985-03-29 1985-03-29 Manufacture of elastically electric circuit part

Publications (1)

Publication Number Publication Date
JPS61225784A true JPS61225784A (en) 1986-10-07

Family

ID=13288914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6550285A Pending JPS61225784A (en) 1985-03-29 1985-03-29 Manufacture of elastically electric circuit part

Country Status (1)

Country Link
JP (1) JPS61225784A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005510618A (en) * 2001-11-28 2005-04-21 東レ・ダウコーニング・シリコーン株式会社 Anisotropic conductive adhesive film, method for producing the same, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851485A (en) * 1981-09-22 1983-03-26 セイコーインスツルメンツ株式会社 Method of producing anisotropic ultrafine conductive rubber connector
JPS58188077A (en) * 1982-04-28 1983-11-02 セイコーインスツルメンツ株式会社 Method of producing anisotropic ultrafine conductive rubber connector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851485A (en) * 1981-09-22 1983-03-26 セイコーインスツルメンツ株式会社 Method of producing anisotropic ultrafine conductive rubber connector
JPS58188077A (en) * 1982-04-28 1983-11-02 セイコーインスツルメンツ株式会社 Method of producing anisotropic ultrafine conductive rubber connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005510618A (en) * 2001-11-28 2005-04-21 東レ・ダウコーニング・シリコーン株式会社 Anisotropic conductive adhesive film, method for producing the same, and semiconductor device

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