JPS61224336A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To perform correctly, and at the same time, easily and swiftly the confirmation of the position of a conductive post by an ITV camera by a method wherein inclined planes are provided in the vicinity of the peripheral edge of the upper surface of the conductive post. CONSTITUTION:The part of the peripheral edge of the upper surface of a conductive post 4 is chamfered. When light is irradiated from the top over the conductive post 4 and the position of the post 4 is confirmed by the ITV camera, no reflected light is incident form a chamfering part 4b whatever and a bright- black part is formed on the peripheral edge of the white part, which shows an upper face flat part 4a. Hereby, a binary picture signal constituting the contrast between the bright black and white colors is obtained and the confirmation of the position of the post 4 is performed correctly, and at the same time, easily and swiftly. The conductive post 4 is generally formed of a metal flat plate, whereon a punching work is performed. Incidentally, the set positions of markers m1, m2, l1 and l2 are put on the boundary region between the white part and the black stripped part. According to this constitution, the work of the wiring connection is largely speeded up.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention places an electronic component including a semiconductor element and a conductive post on a conductive land formed on a substrate, and connects the electronic component and the conductive post. The present invention relates to a hybrid integrated circuit device electrically connected by thin metal wires.

Prior Art ・' In a conventional hybrid integrated circuit device, as shown in FIG. 14, conductive lands b are formed in a predetermined pattern on an insulating substrate a made of ceramic or the like, A semiconductor integrated circuit element C is soldered on the conductive land bl, and a conductive boss ) d is soldered on the other conductive land b2,
Between these semiconductor integrated circuit elements 0 and conductive boss) d,
a? A circuit was constructed by electrically connecting the semiconductor integrated circuit element C and the conductive boss (d) by bonding thin metal wires such as reminium or gold.

During the above-mentioned bonding, the reason why the conductive boss (d) is interposed when bonding is directly performed to the conductive land b2 on the side of the conductive post d is to improve the bonding strength and to solve thermal problems caused by large current operation. It is from.

Here, when bonding the thin metal wire to the conductive post d side, confirming the position of the conductive boss) d on the substrate a is as follows:
This was carried out using an industrial TV camera, and nine video signals were obtained according to the brightness as shown in Fig. 15, and the signals were binarized at the level p shown by the two-dot chain line in Fig. 15, and the signals were converted into white or black as shown in Fig. 16. 2
Get the value video signal. As shown in FIG. 17, there are a pair of vertical and horizontal markers in the boundary area between the white marking I on the top surface of the conductive post d and the black marking in the surrounding area (the soldering part)! The position of the conductive post was confirmed by superimposing 1111 m ma e 11s 6t.

The markers m*+ma*Is*7g can be moved while maintaining their relative positions, and each marker! DIs”!
When t '1 * 't is located in the boundary area between white and black as shown in FIG. 17, each marker "i s "R
The center of the area surrounded by e 11 s It is the conductive boss)
It is determined that it is the center of d, but as shown in Figure 18, 4
If one marker is off the boundary area, determine which of the black and white level areas each marker is in and adjust the black and white level. Each marker is moved by t so that each marker is located in the border area.

Problems to be Solved by the Invention However, is the conductive post d generally a? Since a reminium material is used, the image will be white when illuminated with direct light, but the solder 1 protruding from the conductive post d on the conductive land b2 also has a reflectance close to that of reminium. Therefore, when the image is replaced with a t-2 billion image, the white level may appear, and the boundary area with the conductive post may not be clearly distinguished.

In such a case, the marker fill e! Ell
*'l I'R cannot all be located at the same time in the boundary area between black and white level r, and the position a of conductive boss) d
First approval would have been impossible.

Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to make it possible to always accurately, easily and quickly confirm the position of a conductive post using an industrial TV camera. The conductive post is characterized in that an inclined surface is formed near the periphery of the upper surface of the conductive post.

In addition to the slope with a straight cross-sectional shape,
It also includes arc-shaped ones.

Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings. 1 is an insulating substrate made of ceramic or the like, 2...
are conductive lands formed in a predetermined pattern on this insulating substrate 1, and a semiconductor integrated circuit element 3 is located at a predetermined location on a certain conductive land 2a among these conductive lands 2.
In addition, conductive bosses 4 are soldered to predetermined locations on other conductive lands 2b.

A large number of bonding pad portions 3a are formed on the semiconductor integrated circuit element 3, and in order to electrically connect one of the bonding pad portions 3a to the conductive post 4, a? A thin metal wire 5 made of reminium or gold is bonded between these members 3a and 4. 6 is solder protruding from the conductive post 4 on the conductive land 2b.

In this embodiment, however, the upper peripheral edge of the conductive post 4 is chamfered as shown in FIG. Conductive post 4f: With this configuration, when the position of the conductive post 4 is to be confirmed using an industrial TV camera by irradiating light from the top surface, the top flat surface 4a1 can be illuminated as shown in FIG. A bright black part of the chamfered part 4b, which reflects no irradiated light, is formed around the periphery of the hail white part. In other words, the irradiated light is reflected at the chamfered portion 4b as shown in FIG.
This means that no reflected light from the chamfered portion 4b and the turtle k positioned above the lens enters. Therefore, when setting the binarization leveler, is this chamfered portion 4b a black level? It is also easy to solder the other parts, including part 6, to the white level I, as shown by the two-dot chain line in Fig. gg6, and the result is as shown in Fig. 7. A binarized video signal is obtained in which the white portion of the central portion 4a of the conductive post and the black portion of the chamfered portion 4b at the periphery constitute a vivid contrast.

The marker, which was conventionally set at the boundary area between the conductive post 4 and the solder 6, is now set at the boundary area between the conductive post central portion 4m and the chamfered portion 4b, as shown in FIG. The position confirmation operation can be performed based on the contrast, and the markers ml, m2 . The position of the conductive post 4 according to jl, /2? i! recognition is extremely accurate,
Moreover, it can be done quickly, and therefore the bonding work can be speeded up. Moreover, chamfering of the conductive post 4 can be easily performed without adding any special process.

That is, these conductive posts 4 are generally manufactured by punching out a flat metal plate, and in this punching process, the receiver should have a chamfered shape on the part 7 side as shown in FIG. 8. Chamfering can be performed at the same time during the punching process, and no special process is required.

In other embodiments, as shown in FIG.
A structure may be adopted in which a flat portion 4c is further formed on the outside of the chamfered surface, and in another embodiment, a structure in which a KV groove 4d is formed near the outer periphery of the conductive post 4 as shown in FIG. It is acceptable to do nothing.

When the conductive post 4 of these embodiments is used, as shown in FIG. 11, the outer side K of the black band-shaped part and the white part are scoured, but in this case, the markers ml, m2,
The setting positions of I 1 and 12 may be set in the boundary area between the inner white part and the black band-shaped part, or may be set in the boundary area between the black band-shaped part and the outer white part.

In addition, in order to manufacture the conductive post 4 having the structure shown in FIG. 9, as in the case of the above-mentioned embodiment, the shape of the receiving part during punching is changed to the shape of the chamfered part as shown in FIG. 12. It is sufficient to have a cross-sectional shape with a flat part formed on the outside of the conductive post.
As shown in FIG. 413, by forming a protrusion 8af with a triangular cross-sectional shape on the side of the punch 8 to be punched, it can be easily manufactured without adding any special process.

Effects of the Invention As is clear from the above explanation, according to the hybrid integrated circuit device of the IJK of the present invention, it is possible to accurately and quickly confirm the position of the conductive post on the substrate when performing thin metal wire T-mending. ], thereby greatly speeding up the bonding work.

[Brief explanation of the drawing]

Fig. 1 is a partial plan view showing an embodiment of the present invention, Fig. 2 is a vertical sectional view, Fig. 3 is a perspective view of a conductive post, Fig. 4 is an explanatory diagram showing a binary video signal, and Fig. 5 is an explanatory diagram showing the shape of light reflection WAt, wIG diagram is an explanatory diagram showing the video signal before binarization, Fig. 7 is an explanatory diagram showing the video signal after binarization, and Fig. 8 is an explanatory diagram showing the video signal after binarization. l! FIG. 9 is a perspective view showing a conductive post according to another embodiment, FIG. 10 is a perspective view showing a conductive post according to another embodiment, and FIG. 11 is a binarized image. An explanatory diagram showing the marker superimposed on the signal, Fig. 12 is a longitudinal cross-sectional view of the receiving part, Fig. 13 is a longitudinal cross-sectional view of the punch side,
Figure 4 is a plan view showing a conventional example, Figure 15 is an explanatory diagram showing a video signal before binarization, Figure 16 is an explanatory diagram showing a binarized video signal, and Figures 917 and 18 are video signals. FIG. 3 is an explanatory diagram showing markers superimposed on each other. DESCRIPTION OF SYMBOLS 1... Substrate, 2..., 2a, 2b... Conductive land, 3... Semiconductor integrated circuit element, 4... Conductive post,
5.-Thin metal wire. Figure 13 Figure 17 Figure 18

Claims (1)

[Claims] An electronic component including a semiconductor element and a conductive post are placed on a conductive land formed on a substrate, and the electronic component and the conductive post are electrically connected by a thin metal wire, in the vicinity of the periphery of the upper surface of the conductive post. A hybrid integrated circuit device characterized in that a sloped surface is formed on the surface.