JPS61224284A - Connector and connection method using the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a connection device for connecting connection parts on two substrates on which electrode wiring is formed, and a connection method using the same. be.

Conventional technology In the past, the only methods to connect two boards were to pass thin metal wires one by one and use a flat cable if the electrodes on the board were wide apart. . Figure 3 shows a method using a flat cable. In FIG. 3, 21 is a first substrate, 22 is an electrode wiring group formed on the first substrate 21, 23 is a second substrate,
24 is a group of electrode wirings formed on the second substrate 23; 26;
2 is a resin film, and 26 is a flat cable wiring. In order to connect a large number of electrode wiring groups 22 and 24 in this way, conventionally a flat cable (consisting of 25 and 26) was first created with the wiring pitch matching the pitch of the electrode wiring groups on the board. Then, both ends of the wiring 26 of the flat cable 26 were connected to the electrode wiring group 22.24 on the substrate 21.23 in the arrangement shown in FIG.

Problems to be Solved by the Invention In such a conventional configuration, the wiring 26 of the flat cable 25 must be made to match the pitch of the electrode wiring groups 22 and 24 of the substrate 21 and 23, which complicates the manufacturing process. -1 It was necessary to create a new flat cable 25 each time the design of the board differed.

Further, since the flat cable 25 requires a film to hold the wiring 26, the wiring length cannot be shortened, and unnecessary areas have to be taken up at the ends of the substrate 21 and the substrate 23.

The present invention is intended to solve these problems, and aims to provide a device that is easy to manufacture and can be used even when the design of the board is changed.

Means for Solving the Problem In order to solve this problem, in the present invention, regardless of the electrode wiring pinch on the substrate, thin wires whose surfaces are conductive at least are arranged in parallel at approximately constant intervals, and the thin wires are It has a structure in which a portion is embedded in a sheet of solder.

Function: With this configuration, it can be treated as a sheet until it is used, and when two boards are connected using a connecting device, the thin wires are held together by the surface tension of the solder, each forming an independent conductive path.

Embodiment FIGS. 1 and 2 are diagrams showing a connecting device and a connecting method according to an embodiment of the present invention. In FIGS. 1 and 2, 1 is a metal wiring made of tin-plated copper wire, 2 is a sheet of solder, 3 is a first substrate, 4 is a first substrate 3'', second electrode wiring,
5 is a second substrate, and 6 is an electrode wiring on the second substrate 5.

As shown in FIG. 1, both ends of metal wires 1 arranged at a certain regular interval are embedded in a sheet of solder 2. The spacing between the metal wires 1 is 3,6'' on the substrate 2, and the electrode wire 4. It is necessary to keep the distance narrower than the distance between the two. However, the sheet-like solder 2 may be placed not only on the ends of the thin metal wire 1 but also on the entire surface. Further, instead of the thin metal wire 1, a glass fiber whose surface is coated with a metal film may be used.

FIG. 2 shows a state of connection between two substrates according to the present invention. The ends of the first substrate 3 and the second substrate 5, on which the electrode wirings 4 and 5 are formed substantially at the ends, are brought close to each other.

After the electrode wirings 4 and 5 on both substrates 3 and 5 are aligned, the connecting device shown in FIG. 1 is placed on the connecting portion of both substrates 3 and 5 and heated. The melted half s]2 by heating blends in with the electrode wirings 4 and 5, but is drawn toward the single metal thin wire electrode wirings 4 and 5 due to the surface tension of the solder 2 at that time. Therefore, as shown in FIG. 2, the electrode wirings 4 and 6 on the first and second substrates 3 and 6 are interconnected by the thin metal wire 1.

Effects of the Invention As described above, according to the present invention, thin wires 1, for example, thin metal wires with conductive surfaces, are arranged in a sheet shape and fixed with solder, so handling is easy, and furthermore, when making connections, the sheet-like All you have to do is place the connection structure on the connection part and heat it.

Furthermore, since the connection is made with a thin wire, the continuity strength is high.

Further, by using a metal wire as the thin wire, a connection with low resistance can be realized.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a connection device according to an embodiment of the present invention, Fig. 2 is a perspective view showing a connection method using the same device, and Fig. 3 is a perspective view showing a conventional connection method. 0 1...Metal thin wire, 2...Solder, 3...
...first substrate, 4...electrode wiring on the first substrate, 5...second substrate, 6...on the second substrate Electrode placement.

Claims (2)

[Claims] (1) A connection device characterized in that thin wires made of a conductive material whose surfaces are wetted with solder are arranged substantially parallel to each other, and solder is formed in a sheet shape so as to cover at least both ends of the thin wires. (2) After aligning the electrode wires to be connected to each other, thin wires made of a conductive material whose surfaces are wetted with solder are arranged approximately parallel to each other, and solder is formed into a sheet including at least both ends of the thin wires. A connection method characterized in that the electrode wirings on the substrate are connected by a thin wire by placing the connected device on the electrode wiring and then heating to melt the solder.