JPS61223540A - Lighting system for optical type printed circuit board - Google Patents

Lighting system for optical type printed circuit board

Info

Publication number
JPS61223540A
JPS61223540A JP60063803A JP6380385A JPS61223540A JP S61223540 A JPS61223540 A JP S61223540A JP 60063803 A JP60063803 A JP 60063803A JP 6380385 A JP6380385 A JP 6380385A JP S61223540 A JPS61223540 A JP S61223540A
Authority
JP
Japan
Prior art keywords
light
camera
circuit board
printed circuit
illumination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60063803A
Other languages
Japanese (ja)
Inventor
Shingo Sekiguchi
関口 眞吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60063803A priority Critical patent/JPS61223540A/en
Publication of JPS61223540A publication Critical patent/JPS61223540A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Abstract

PURPOSE:To obtain a quality image pickup output easy to binary code, by preventing direct entry of an illumination light passing through a through hole of a printed circuit board into a camera. CONSTITUTION:A lighting unit 20 forms a linear light source as a whole and is arranged parallel with the scanning direction of a lien sensor camera 10. The tip of a light shielding plate 28 sticks out by a proper length from an emission end face 26b of a photoconductive plate 26 and the radial expanse of the emission light from the end face 26b in regulated with the light shielding plate 28. Light from the lighting device 20 exists on the left from a limit line R and little on the right. The tilt angle alpha of the lighting device 20 is almost a half theta as much as the width-wise view angle 2theta of the camera 10 viewed from an object S. Thus, the light from the light unit 20 is prevented from the directly entering the view of the camera 10 even if traveling straight through the through hole 14c.

Description

【発明の詳細な説明】 [発明の技術分野] この発明は、プリント基板面をラインセンサカメラ(−
次元l1il像装置)を用いてl1ii像し、プリント
基板の導体パターンや実装部品の状態を検査する光学式
プリント基板検査装置に関し、特に、プリント基板をカ
メラと反対側の面から照明する方式の改良に関する。
[Detailed Description of the Invention] [Technical Field of the Invention] This invention provides a line sensor camera (-
Regarding an optical printed circuit board inspection device that inspects the condition of conductor patterns and mounted components on a printed circuit board by using a 11-dimensional (11-dimensional) image device), an improvement in the method of illuminating the printed circuit board from the side opposite to the camera. Regarding.

[発明の背景技術とその問題点] 第3図(A)(B)は従来の一般的な光学式プリント基
板検査装置の構成を示し、同図(C)はこの装置におけ
る撮像出力波形を示している。
[Background Art of the Invention and Problems thereof] Figures 3 (A) and 3 (B) show the configuration of a conventional general optical printed circuit board inspection device, and Figure 3 (C) shows the imaging output waveform of this device. ing.

10はラインセンサカメラで、COD等のラインセンサ
10aをmRレンズ系10bに組合せたものである。1
2は照明装置で、直管タイプの螢光灯ランプと反射板を
組合せた直線状の光源であり、カメラ10の正面側に一
定間隔をおき、カメラ10の走査方向と平行にして配置
されている。
10 is a line sensor camera, which combines a line sensor 10a such as COD with an mR lens system 10b. 1
Reference numeral 2 denotes an illumination device, which is a linear light source that combines a straight tube type fluorescent lamp and a reflector, and is placed in front of the camera 10 at regular intervals and parallel to the scanning direction of the camera 10. There is.

14は検査しようとするプリント基板であり、カメラ1
0と照明装置12との間の所定の撮影位置にカメラ10
の光軸と直交して配置されている。
14 is a printed circuit board to be inspected, and camera 1
The camera 10 is placed at a predetermined photographing position between the camera 10 and the illumination device 12.
is arranged perpendicular to the optical axis of the

このプリント基板14の下面側に照明装置12の光があ
たり、これの透過散乱光像がカメラ10でIi像される
The light from the illumination device 12 falls on the lower surface side of the printed circuit board 14, and a transmitted and scattered light image of the light is captured by the camera 10 as an image Ii.

プリント基板14において、14aはガラスエポキシ等
の基材が露出している基材部、14bは上記基材の表面
に銅などで形成された導体パターン部、14Cは上記基
材を表裏に貫通して形成された透孔部、14dは実装部
品をそれぞれ示している。第3図(C)はこれら各部1
4a〜14dを含んだ部分がカメラ10で撮像されたと
きの撮像出力を示している。
In the printed circuit board 14, 14a is a base material part where a base material such as glass epoxy is exposed, 14b is a conductor pattern part formed of copper or the like on the surface of the base material, and 14C is a part that penetrates the base material from the front and back. The through holes 14d each represent a mounted component. Figure 3 (C) shows each of these parts 1
The image output when the portion including 4a to 14d is imaged by the camera 10 is shown.

基材部14aは半透明なので、照明装置12からの光が
透過散乱してカメラ10に届き、明レベルと弁別される
高い出力が得られる(図中のAの部分)。導体パターン
部14bおよび実装部品14dは照明装置12からの光
をほぼ遮光するので、この部分のWi像出力は暗レベル
と弁別される低い出力になる(図中のBの部分)。また
、照明装置12からの光は透孔部14cを通り、カメラ
10に直接的に入射する。そのため透孔部14cに対応
した撮像出力は、極めて高レベルのパルス状の出力とな
る(図中のCで示す部分)。
Since the base member 14a is semitransparent, the light from the illumination device 12 is transmitted and scattered and reaches the camera 10, so that a high output that can be distinguished from a bright level is obtained (portion A in the figure). Since the conductive pattern portion 14b and the mounting component 14d substantially block the light from the illumination device 12, the Wi image output of this portion becomes a low output that can be distinguished from the dark level (portion B in the figure). Further, the light from the illumination device 12 passes through the through hole 14c and directly enters the camera 10. Therefore, the imaging output corresponding to the through-hole portion 14c becomes an extremely high-level pulse-like output (portion indicated by C in the figure).

カメラ10のwa像出力は、基材部14aに対応した暗
レベルと、導体パターン部14bおよび実装部品14d
に対応した暗レベルとに二値化すべくレベル弁別される
。撮像出力中の上記明レベルと暗レベルの差を大きくす
るには照明装置12の光量を大きくすることが有効であ
るが、そうすると透孔部14cに対応した直接入射光レ
ベルが極端に大きくなり、ラインセンサ10aの直接光
入射部分を飽和させてしまう。
The wa image output of the camera 10 has a dark level corresponding to the base material part 14a, a conductor pattern part 14b and a mounted component 14d.
Level discrimination is performed to binarize the dark level corresponding to the dark level. In order to increase the difference between the bright level and the dark level during image pickup output, it is effective to increase the amount of light from the illumination device 12, but in this case, the level of direct incident light corresponding to the through hole 14c becomes extremely large. This will saturate the direct light incident portion of the line sensor 10a.

CODなどの半導体イメージセンサにおいては、画素が
飽和してしまう程の強い光が極部的に入射すると、ブル
ーミング現象などによって周辺の画素に悪影響が及び、
画像データの解像度が劣化するという問題がある。した
がって透孔部14Cに対応した直接入射光レベルでもう
インセンサ10aの画素が飽和しないように、照明装置
12の光量をある程度低くしておかなければならない。
In a semiconductor image sensor such as a COD, if light strong enough to saturate a pixel is incident on a localized area, surrounding pixels will be adversely affected due to blooming phenomenon, etc.
There is a problem that the resolution of image data deteriorates. Therefore, the amount of light from the illumination device 12 must be kept low to some extent so that the pixels of the in-sensor 10a are no longer saturated at the level of direct incident light corresponding to the through-hole portion 14C.

そうすると今度は、基材N14aに対応した明レベルと
導体パターン部14bや実装部品14dに対応した暗レ
ベルとのレベル差が小さくなり、この明レベルと暗レベ
ルとを正確に弁別(二値化)するのが難しくなる。換言
すると、S/N比が低下する。
Then, the level difference between the bright level corresponding to the base material N14a and the dark level corresponding to the conductive pattern portion 14b and the mounted component 14d becomes smaller, and the bright level and dark level can be accurately discriminated (binarized). becomes difficult to do. In other words, the S/N ratio decreases.

[発明の目的] この発明は上述した従来の問題点に鑑みなされたもので
あり、その目的は、プリント基板を背後からの照明によ
りラインセンサカメラで@像する゛   装置において
、プリント基板の透孔部を通った照明光がカメラに直接
入射するのを抑1.lJ L、 、ラインー センサが
飽和するのを防ぐとともに、二値化が容易なS/N比の
良好な撮像出力を得ることができるようにした光学式プ
リント基板検査装置の照明方式を提供することにある。
[Object of the Invention] This invention has been made in view of the above-mentioned conventional problems, and its purpose is to provide an apparatus for imaging a printed circuit board with a line sensor camera by illuminating it from behind. 1. Prevents the illumination light passing through the section from directly entering the camera. To provide an illumination method for an optical printed circuit board inspection device that can prevent a sensor from becoming saturated and can obtain an imaging output with a good S/N ratio that is easy to binarize. It is in.

[発明の概要] そこでこの発明では、照明装置として線状光源を用いて
、これをラインセンサカメラの走査ラインと平行状態に
配置し、かつ、上記線状光源の出射光の幅方向への拡が
りを少なくとも幅方向一方側について規制し、この規制
によって生じた出射方向限界線を上記カメラの光軸に対
して適宜角度傾斜させて、上記線状光源の出射光が上記
カメラの視野内に直接入射するのを抑制するようにした
[Summary of the Invention] Therefore, in this invention, a linear light source is used as an illumination device, and this is arranged in parallel with the scanning line of a line sensor camera, and the emitted light of the linear light source is spread in the width direction. is regulated at least on one side in the width direction, and the emission direction limit line created by this regulation is tilted at an appropriate angle with respect to the optical axis of the camera, so that the emitted light from the linear light source directly enters the field of view of the camera. I tried to suppress it.

[発明の実施例] 第2図(A)(B)はこの発明の照明方式を適用した光
学式プリント基板検査装置の構成の概略を示し、同図(
C)はこの装置における撮像出力波形を示す。また第1
図はこの装置における要部の構成と照明方式の詳細を示
している。なお第1・図および第2図において、先に説
明した第3図と同一部分は同一符号を付している。
[Embodiments of the Invention] FIGS. 2(A) and 2(B) schematically show the configuration of an optical printed circuit board inspection apparatus to which the illumination method of the present invention is applied.
C) shows the imaging output waveform in this device. Also the first
The figure shows the configuration of the main parts of this device and the details of the illumination method. Note that in FIGS. 1 and 2, the same parts as those in FIG. 3 described above are given the same reference numerals.

第2図において、14は検査しようとするプリント基板
で、これの上面側にはラインセンサカメラ10が配置さ
れ、これの下面側には照明装置20がSNされている。
In FIG. 2, reference numeral 14 denotes a printed circuit board to be inspected, a line sensor camera 10 is disposed on the upper surface thereof, and an illumination device 20 is installed on the lower surface thereof.

この照明装置20の構成と配置にこの発明の特徴がある
The structure and arrangement of this lighting device 20 are the features of the present invention.

第1図に示すように、照明装置20は、直管、タイプの
螢光灯ランプ22と、このランプ22を覆うように収納
した遮光箱24と、遮光箱24の上面スリット部分に取
付けられた導光板26と、導光板26の片面に張り合さ
れた遮光板28とから構成されている。
As shown in FIG. 1, the lighting device 20 includes a straight tube type fluorescent lamp 22, a light-shielding box 24 that is housed to cover the lamp 22, and a slit on the top surface of the light-shielding box 24. It is composed of a light guide plate 26 and a light shielding plate 28 attached to one side of the light guide plate 26.

遮光箱24の内側面には反射鏡25が形成され、ランプ
22からの光を効率的に導光板26に供給している。
A reflecting mirror 25 is formed on the inner surface of the light shielding box 24, and efficiently supplies light from the lamp 22 to the light guide plate 26.

導光板26は透明なプラスチックなどの長方形の板であ
り、その長さはランプ22とほぼ等しく、その一端面2
6aが遮光箱24の内部に臨み、ランプ22と近接して
対向している。ランプ22からの光はこの端面26aか
ら導光板26内に進入し、反対側の端面26bから外部
へ出射する。すなわち、この照明装置20は全体として
線状光源となっており、ラインセンサカメラ10の走査
方向と平行に配置されている。
The light guide plate 26 is a rectangular plate made of transparent plastic or the like, and its length is approximately equal to that of the lamp 22, and its one end surface 2
6a faces the inside of the light-shielding box 24 and faces the lamp 22 in close proximity. Light from the lamp 22 enters the light guide plate 26 from this end surface 26a and exits from the opposite end surface 26b. That is, the illumination device 20 as a whole is a linear light source, and is arranged parallel to the scanning direction of the line sensor camera 10.

遮光板28の先端部分は導光板26の出射端面26bよ
り適宜長さ突出しており、この端面26bからの出射光
の幅方向への拡がりを遮光板28で規制する。第1図(
B)に示すように、導光板26の端面26bから出射す
る光のうち、図中の幅方向右側への出射方向が規制され
る。図中のRはこの規制によって生じた出射方向限界線
を示している。この限界線Rより左側に照明装置20か
らの光が存在し、右側にはほとんど存在しない。
The tip portion of the light shielding plate 28 protrudes by an appropriate length from the output end face 26b of the light guide plate 26, and the light shielding plate 28 restricts the spread of the emitted light from the end face 26b in the width direction. Figure 1 (
As shown in B), out of the light emitted from the end surface 26b of the light guide plate 26, the emission direction to the right in the width direction in the figure is restricted. R in the figure indicates the emission direction limit line created by this regulation. Light from the lighting device 20 exists on the left side of this limit line R, and almost no light exists on the right side.

上記のように構成された照明装置2oは、上記出射方向
限界線Rが被写体点Sを通りカメラ10の光軸Pと所定
角度αをなすように、図中の左方向へ傾けて設置されて
いる。
The illumination device 2o configured as described above is installed tilted to the left in the figure so that the emission direction limit line R passes through the subject point S and forms a predetermined angle α with the optical axis P of the camera 10. There is.

上記の傾斜角αは、被写体点Sから見たカメラ10の幅
方向の視野角2θの半分のθにほぼ等しい。この視野角
2θとは、被写体点Sから生じた光が撮像レンズ系10
bによってラインセンサ1Qaの受光部に集光される範
囲の角度である。これはラインセンサ10aの受光部の
幅とレンズ系10bの有効径りによって決まる。
The above-mentioned inclination angle α is approximately equal to half the viewing angle 2θ of the camera 10 in the width direction as viewed from the subject point S. This viewing angle 2θ means that the light generated from the object point S is
b is the angle of the range where light is focused on the light receiving section of the line sensor 1Qa. This is determined by the width of the light receiving section of the line sensor 10a and the effective diameter of the lens system 10b.

したがって、被写体点Sにプリント基板14が存在しな
い場合を想定すると、出射方向限界線Rが点Sを通って
α=θだけ左側へ傾けられているので、導光板26の端
面26bから出射した光はそのほとんどがカメラ10の
視野角2θの外にあり、出射端面26bからの光が直接
カメラ10に入射してラインセンサ10aに受光される
ことはない。これは完全でなくてもよく、カメラ10に
入射する直接光の光量が充分小さくなれば本発明の目的
は達成されるもので、したがって上記角度αは角度θよ
り大きいかあるいはほぼ等しければよいとともに、出射
方向限界線Rも完全に出射光の有無を区切る境界である
必要はない。
Therefore, assuming that the printed circuit board 14 does not exist at the subject point S, the emission direction limit line R passes through the point S and is tilted to the left by α=θ, so that the light emitted from the end surface 26b of the light guide plate 26 Most of the light is outside the viewing angle 2θ of the camera 10, and the light from the output end face 26b does not directly enter the camera 10 and is not received by the line sensor 10a. This does not have to be perfect; the object of the present invention is achieved as long as the amount of direct light incident on the camera 10 is sufficiently small. Therefore, the angle α needs only to be larger than or approximately equal to the angle θ. , the emission direction limit line R does not need to be a boundary that completely demarcates the presence or absence of emitted light.

このように照明装置20からカメラ10への直接入射光
歯は極めて少なくなるので、第1図(B)に示すように
、プリント基板14の透孔部14Cが被写体点Sに位置
し、照明装置20からの光がこの透孔部140を直進し
て透過しても、もちろんその光はカメラ10の視野内に
直接入射することはない。
In this way, the number of direct incident light beams from the illumination device 20 to the camera 10 is extremely reduced, so that the through hole 14C of the printed circuit board 14 is located at the object point S, and the illumination device Even if the light from 20 goes straight through this hole 140 and passes through, of course, the light will not directly enter the field of view of the camera 10.

したがって第2図(C)に示すように、透孔部14cに
対応した搬像出力レベルは従来のものより大幅に低下す
る(図中のCの部分)。透孔部14Cに対応した撮像出
力レベルは、上記傾斜角αを大きくするとさらに低くな
るので、この出力レベルをどの程度にするかによって角
度αを決めてもよい。
Therefore, as shown in FIG. 2(C), the image carrier output level corresponding to the through hole 14c is significantly lower than that of the conventional one (portion C in the figure). Since the imaging output level corresponding to the through-hole portion 14C becomes lower as the inclination angle α is increased, the angle α may be determined depending on the level of this output level.

また被写体点Sにプリント基板14の基材部14aが存
在すると、照明袋@20からの光が基材部14aに入射
して散乱屈折し、その散乱屈折光がカメラ10に入射す
る。その結果第2図(C)に示すように、基材部14a
に対応した搬像出力レベルは明レベルとして弁別される
べき高い値になる(図中のAの部分)。
Further, when the base portion 14a of the printed circuit board 14 exists at the object point S, the light from the illumination bag @20 enters the base portion 14a and is scattered and refracted, and the scattered and refracted light enters the camera 10. As a result, as shown in FIG. 2(C), the base material portion 14a
The image carrier output level corresponding to is a high value that should be discriminated as a bright level (portion A in the figure).

また被写体点Sにプリント埜板14の導体パターン部1
4bあるいは実装部品14dが存在すると、それより下
面側の基材部分での散乱屈折光が導体パターン部14b
や実装部品14dで遮光されて上面側に出てこない。そ
の結果第2図(C)に示すように、導体パターン部14
bや実装部品14dに対応した層像出力レベルは暗レベ
ルとして認識されるべきごく低い値になる(図中のBの
部分)。
Also, the conductor pattern portion 1 of the printed plate 14 is placed at the subject point S.
4b or the mounted component 14d, the scattered and refracted light at the base material portion on the lower surface side is reflected by the conductor pattern portion 14b.
The light is blocked by the mounting components 14d and does not come out on the upper surface side. As a result, as shown in FIG. 2(C), the conductor pattern portion 14
The layer image output level corresponding to b and the mounted component 14d is a very low value that should be recognized as a dark level (portion B in the figure).

ここで、透孔部14cを通過してカメラ10に直接入射
する光量は非常に少ないので、照明装置20からの照明
光mを充分大きくしてもうインセンサ10aが飽和しな
くなり、しかも基板部14aに対応した明レベルを高く
することができ、暗レベルと明レベルの差へEを大きく
することができる。したがって撮像出力の二値化処理が
非常に容易で、正確に行なえるようになる。
Here, since the amount of light that passes through the through hole 14c and directly enters the camera 10 is very small, if the illumination light m from the illumination device 20 is made sufficiently large, the in-sensor 10a will no longer be saturated. The corresponding bright level can be increased, and E can be increased to the difference between the dark level and the bright level. Therefore, the binarization process of the image pickup output can be performed very easily and accurately.

[発明の効果] 以上詳細に説明したように、この発明に係る光学式プリ
ント基板検査装置の照明方式によれば、プリント基板の
透孔部を通して照明光がカメラに直接入射し、過大なレ
ベルのIi像出力を生じるという従来の不都合点を解消
し、ラインセンサの飽和現象をなくすとともに、明暗レ
ベル差の大きな二値化処理しやすい良質の撮像出力が得
られる。
[Effects of the Invention] As explained in detail above, according to the illumination method of the optical printed circuit board inspection device according to the present invention, the illumination light directly enters the camera through the through hole of the printed circuit board, resulting in an excessive level of illumination. This eliminates the conventional disadvantage of producing an Ii image output, eliminates the saturation phenomenon of the line sensor, and provides high-quality imaging output that is easy to perform binarization processing with a large difference in brightness and darkness.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(A)(B)はこの発明の一実施例による照明装
置の詳細な構成と照明方式を示す図、第2図(A)(B
)はこの発明を適用した検査装置の概略構成を示す正面
図と側面図、第2図(C)はこの装置における撮像出力
波形を示す図、第3図(A)(B)は従来の検査装置の
概略構成を示す正面図と側面図、第3図(C)はこの従
来装置における撮像出力の波形図である。 10 ・・・ラインセンサカメラ 12 ・・・照明装置(従来) 14 ・・・プリント基板   14a・・・基材部1
4b・・・導体パターン部  14G・・・透孔部14
d・・・実装部品 20 ・・・照明装置(本発明) 22 ・・・ランプ      24 ・・・遮光箱2
6 ・・・導光板      28・・・遮光板P ・
・・光軸 R・・・出射方向限界線 第1図 第2図 (Aン                   (8,
)(C) 第3 (A) (B)
FIGS. 1A and 1B are diagrams showing the detailed configuration and illumination method of a lighting device according to an embodiment of the present invention, and FIGS.
) are a front view and a side view showing a schematic configuration of an inspection device to which this invention is applied, FIG. 2(C) is a diagram showing an imaging output waveform in this device, and FIGS. 3(A) and (B) are a diagram showing a conventional inspection device. A front view and a side view showing a schematic configuration of the device, and FIG. 3(C) are waveform diagrams of imaging output in this conventional device. 10...Line sensor camera 12...Lighting device (conventional) 14...Printed circuit board 14a...Base material part 1
4b...Conductor pattern part 14G...Through hole part 14
d... Mounted component 20... Lighting device (present invention) 22... Lamp 24... Light shielding box 2
6...Light guide plate 28...Light shielding plate P・
...Optical axis R... Output direction limit line Fig. 1 Fig. 2 (A) (8,
) (C) 3rd (A) (B)

Claims (1)

【特許請求の範囲】[Claims] (1)ラインセンサカメラと照明装置との間の所定位置
に検査しようとするプリント基板を上記カメラの光軸と
直交して配置し、このプリント基板の透過散乱光像を上
記カメラで撮像し、このプリント基板における半透明な
基材のみの明部分と、導体パターンや実装部品で遮光さ
れた暗部分とを分離した画像データを得る光学式プリン
ト基板検査装置において; 上記照明装置として線状光源を用いて、これを上記カメ
ラの走査ラインと平行状態に配置し、かつ、上記線状光
源の出射光の幅方向への拡がりを少なくとも幅方向一方
側について規制し、この規制によって生じた出射方向限
界線を上記カメラの光軸に対して適宜角度傾斜させて、
上記線状光源の出射光が上記カメラの視野内に直接入射
するのを抑制することを特徴とする光学式プリント基板
検査装置の照明方式。
(1) A printed circuit board to be inspected is placed at a predetermined position between a line sensor camera and an illumination device, perpendicular to the optical axis of the camera, and a transmitted and scattered light image of the printed circuit board is captured by the camera; In this optical printed circuit board inspection device that obtains image data that separates the bright part of the semi-transparent base material of the printed circuit board and the dark part that is shielded from light by the conductor pattern or mounted components, a linear light source is used as the lighting device. This is arranged parallel to the scanning line of the camera, and the spread of the emitted light from the linear light source in the width direction is regulated at least on one side in the width direction, and the limit in the emission direction caused by this regulation is Tilt the line at an appropriate angle with respect to the optical axis of the camera,
An illumination method for an optical printed circuit board inspection apparatus, characterized in that the emitted light from the linear light source is suppressed from directly entering the field of view of the camera.
JP60063803A 1985-03-29 1985-03-29 Lighting system for optical type printed circuit board Pending JPS61223540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60063803A JPS61223540A (en) 1985-03-29 1985-03-29 Lighting system for optical type printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60063803A JPS61223540A (en) 1985-03-29 1985-03-29 Lighting system for optical type printed circuit board

Publications (1)

Publication Number Publication Date
JPS61223540A true JPS61223540A (en) 1986-10-04

Family

ID=13239893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60063803A Pending JPS61223540A (en) 1985-03-29 1985-03-29 Lighting system for optical type printed circuit board

Country Status (1)

Country Link
JP (1) JPS61223540A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235010A (en) * 1990-02-13 1991-10-21 Iwaki Denshi Kk Visually inspecting instrument and illuminator for use in the same
JP2007017379A (en) * 2005-07-11 2007-01-25 Gen Tec:Kk Surface shape measuring device
CN111337169A (en) * 2020-03-16 2020-06-26 清华大学 Tactile sensing device based on coding hole imaging technology

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235010A (en) * 1990-02-13 1991-10-21 Iwaki Denshi Kk Visually inspecting instrument and illuminator for use in the same
JP2007017379A (en) * 2005-07-11 2007-01-25 Gen Tec:Kk Surface shape measuring device
CN111337169A (en) * 2020-03-16 2020-06-26 清华大学 Tactile sensing device based on coding hole imaging technology
CN111337169B (en) * 2020-03-16 2021-04-16 清华大学 Tactile sensing device based on coding hole imaging technology

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