JPS61220351A - Sample holder - Google Patents
Sample holderInfo
- Publication number
- JPS61220351A JPS61220351A JP6062685A JP6062685A JPS61220351A JP S61220351 A JPS61220351 A JP S61220351A JP 6062685 A JP6062685 A JP 6062685A JP 6062685 A JP6062685 A JP 6062685A JP S61220351 A JPS61220351 A JP S61220351A
- Authority
- JP
- Japan
- Prior art keywords
- elastic plate
- pawls
- external force
- sample
- deformed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、試料保持装置に係り、特に半導体素子基板（
以下、基板と略）等の試料を機械的に保持するのに好適
な試料保持！ＪＷＬに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a sample holding device, and in particular to a semiconductor element substrate (
A sample holder suitable for mechanically holding samples such as substrates (hereinafter abbreviated as substrates)! This is related to JWL.
基板等の試料を機械的に保持する装置としては、例えば
、特開昭５６−１００４４０号公報に記載のような、４
木の独立した板バネでなる爪を有し各版バネの根本に設
けたブツシュロッドで各々の爪を独立に開閉作動させて
試料を保持するようなものが知られている。As a device for mechanically holding a sample such as a substrate, for example, a 4-type device as described in JP-A-56-100440 is used.
A device is known that has claws made of independent wooden leaf springs and holds the sample by opening and closing each claw independently using a bushing rod provided at the base of each plate spring.
このような装置では、複数の爪をそｊぞれ独立に開閉作
動するようになっているため、部品点数が多く機構が複
雑化し故障が生じゃずいといった問題がある。In such a device, since a plurality of claws are operated to open and close independently, there are problems such as a large number of parts, a complicated mechanism, and the risk of failure.
本発明の目的は、爪を同時に開閉作動させるようにする
ことで、部品点数を削減して機構を簡素化でき故障が生
じにくい試料保持装置を提供することにある。An object of the present invention is to provide a sample holding device in which the number of parts can be reduced, the mechanism can be simplified, and failures are less likely to occur by opening and closing the claws at the same time.
本発明は、凹面並びに凸面に外力により繰り返し変形可
能な弾性板と、該弾性板の変形ｔこよりラジアル方向會
こ開閉作動する爪とを具備したことを特徴とするもので
、弾性板の外力による変形により爪を同時に開閉作動さ
せるようｔこしたものである。The present invention is characterized in that the concave and convex surfaces are provided with an elastic plate that can be repeatedly deformed by external force, and a pawl that opens and closes in the radial direction due to the deformation of the elastic plate. The deformation allows the claws to open and close at the same time.
本発明の一実施例を第】図、′ｓ２図ｔこより説明する
。An embodiment of the present invention will be described with reference to Figures 1 and 2.
第１図、第２図で１弾性板５０は１例えば、円板状であ
り、その大きさは、試料２０の大とさよりも小さくなっ
ている。弾性板】０の外周縁端には、爪３０が、この場
合、４個９０度間隔で配設又は形成されている。爪３０
の自由ｍ部には、試料２０を保持する保持部３１が形成
さｊている。In FIGS. 1 and 2, each elastic plate 50 has a disk shape, for example, and its size is smaller than that of the sample 20. On the outer peripheral edge of the elastic plate 0, in this case, four claws 30 are arranged or formed at 90 degree intervals. nail 30
A holding part 31 for holding the sample 20 is formed in the free part m.
弾性板１０は、外力により凹面並びに凸面に繰り返し変
形可能であり、この変形により爪３０はラジアル方向に
開閉作動させらｎる。弾性板１０の底部には、薄板の弾
性材料で形成さｊた取付アーム４０が、この場労、爪３
０に対応した位置で設けらｎ、ている。取付アーム４０
は、支持部材５０にネジ等で固定されている。ロッド６
０は１禅性板ｌＯの裏面中心部に対応して往復動可能に
設けられている。The elastic plate 10 can be repeatedly deformed into a concave and convex surface by external force, and this deformation causes the claws 30 to open and close in the radial direction. At the bottom of the elastic plate 10, a mounting arm 40 formed of a thin plate of elastic material is attached to the claw 3.
n is provided at a position corresponding to 0. Mounting arm 40
is fixed to the support member 50 with screws or the like. rod 6
0 is provided so as to be reciprocally movable corresponding to the center of the back surface of the 1-piece plate 1O.
′！Ｊ１図、第図面第２図ッド６０は１禅性板ｌＯの裏
面に向って移動させらｊる。この移動過程でロッド６０
の先端は、弾性板ＪＯの裏面に当接し、これによ０禅性
板ｌＯには外力が付与さｒる。この外力により弾性板】
０は、第２図に破線で示すように凸面に変形させられる
。この弾性板ＪＯの変形により爪３０はラジアル方向に
同時をこ開作動させらｒ、て第２図に破線で示すような
状！！になる。′! In Figure J1 and Figure 2, the pad 60 is moved toward the back surface of the 1-piece board 10. During this movement process, the rod 60
The tip of the elastic plate JO comes into contact with the back surface of the elastic plate JO, thereby applying an external force to the elastic plate IO. Due to this external force, the elastic plate]
0 is deformed into a convex surface as shown by the dashed line in FIG. Due to this deformation of the elastic plate JO, the pawls 30 are simultaneously operated to pry open in the radial direction, resulting in a state shown by the broken line in FIG. ! become.
また、取付アーム４０は、第２図に破線で示すように内
側に変形する。この状態で、試料２０は。The mounting arm 40 also deforms inwardly as shown by the dashed line in FIG. In this state, sample 20.
公知の搬送手段（図示省略）により爪３０で保持可能な
位置に搬送される。その後、ａラド６０を前記方向と逆
方向に移動させることで、弾性板】０への外力の付与は
解除さｒ５、こｎ、ｃより弾性板】０は第２図に実線で
示すように凹面に変形させらｎる。この弾性板】Ｏの変
形により爪３０はラジアル方向に同時に閉作動させられ
て第２図に実線で示すような状態になる。この状態で試
料２０は爪３０の保持部３】で保持さｎることになる。It is transported to a position where it can be held by the claws 30 by a known transporting means (not shown). Thereafter, by moving the a-rad 60 in the opposite direction to the above-mentioned direction, the application of external force to the elastic plate 0 is released. It is deformed into a concave surface. Due to the deformation of the elastic plate O, the pawls 30 are simultaneously closed in the radial direction, resulting in the state shown by the solid line in FIG. In this state, the sample 20 is held by the holding portion 3 of the claw 30.
また、取付アーム４０は、第２図に実線で示すように変
形する。このようにして試料２０を爪３０に渡した搬送
手段は池の場所へ移動させられる。The mounting arm 40 also deforms as shown by the solid line in FIG. The conveying means that has transferred the sample 20 to the claw 30 in this manner is moved to the pond.
尚、爪３０＃ｃ保持された試料２０を搬送手段に渡す操
作は１禅性板ｌＯＣ外力を付与し凸面に良形させること
で実施さｊる。The operation of transferring the sample 20 held by the claw 30#c to the conveying means is carried out by applying an external force to the sample plate 1OC to shape it into a convex surface.
本実施例では次のような効果を得ることができる。In this embodiment, the following effects can be obtained.
（］） 爪を同時に開閉作動できるようにしているた
め、部品点数を削減できて機構を簡素化でき故障が生じ
１こくくなる。(]) Since the claws can be opened and closed at the same time, the number of parts can be reduced and the mechanism can be simplified, reducing the risk of failure.
本発明は、以上説明したようｒこ、爪を同時に開閉作動
できるようにしたことで１部品点数を削減できて機構を
簡素化できるので、故障が生じにくい試料保持！ｊｔｌ
ｌ？提供できるという効果がある。As explained above, the present invention allows the claws to open and close at the same time, thereby reducing the number of parts and simplifying the mechanism, making it possible to hold samples with less trouble. jtl
l? It has the effect of being able to provide
第】図は、未発明心よる試料保持装置の一実施例を示す
要部斜視外観図、！Ｊ２図は、同じく縦断面図である。
オ１図
第２図Figure 1 is a perspective external view of the main parts of an embodiment of the sample holding device according to the uninvented spirit. Figure J2 is also a longitudinal sectional view. Figure 1 Figure 2
Claims (1)
性板と、該弾性板の変形によりラジアル方向に開閉作動
する爪とを具備したことを特徴とする試料保持装置。1. A sample holding device comprising an elastic plate that can be repeatedly deformed by external force on concave and convex surfaces, and claws that open and close in the radial direction by deformation of the elastic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6062685A JPS61220351A (en) | 1985-03-27 | 1985-03-27 | Sample holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6062685A JPS61220351A (en) | 1985-03-27 | 1985-03-27 | Sample holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61220351A true JPS61220351A (en) | 1986-09-30 |
Family
ID=13147695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6062685A Pending JPS61220351A (en) | 1985-03-27 | 1985-03-27 | Sample holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61220351A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570866U (en) * | 1992-02-26 | 1993-09-24 | スズキ株式会社 | Work holding device |
| WO1999018599A2 (en) * | 1997-10-03 | 1999-04-15 | Koninklijke Philips Electronics N.V. | Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
-
1985
- 1985-03-27 JP JP6062685A patent/JPS61220351A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570866U (en) * | 1992-02-26 | 1993-09-24 | スズキ株式会社 | Work holding device |
| WO1999018599A2 (en) * | 1997-10-03 | 1999-04-15 | Koninklijke Philips Electronics N.V. | Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
| US6328296B2 (en) | 1997-10-03 | 2001-12-11 | U.S. Philips Corporation | Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
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