JPS61218674A - Polyurethane adhesive having suppressed residual tackiness after curing - Google Patents

Polyurethane adhesive having suppressed residual tackiness after curing

Info

Publication number
JPS61218674A
JPS61218674A JP6157585A JP6157585A JPS61218674A JP S61218674 A JPS61218674 A JP S61218674A JP 6157585 A JP6157585 A JP 6157585A JP 6157585 A JP6157585 A JP 6157585A JP S61218674 A JPS61218674 A JP S61218674A
Authority
JP
Japan
Prior art keywords
curing
diisocyanate
polyurethane adhesive
organic solvent
derivative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6157585A
Other languages
Japanese (ja)
Other versions
JPH0133512B2 (en
Inventor
Yuzo Yokota
横田 雄三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Foil Manufacturing Co Ltd
Original Assignee
Nippon Foil Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Foil Manufacturing Co Ltd filed Critical Nippon Foil Manufacturing Co Ltd
Priority to JP6157585A priority Critical patent/JPS61218674A/en
Publication of JPS61218674A publication Critical patent/JPS61218674A/en
Publication of JPH0133512B2 publication Critical patent/JPH0133512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain the titled novel adhesive free from residual tackiness after hardening and useful for flexible printed circuit board, by compounding an organic solvent with a diisocyanate derivative and a cellulose derivative soluble in said solvent. CONSTITUTION:The objective adhesive can be produced by compounding (A) an organic solvent with (B) a diisocyanate derivative and (C) a cellulose derivative soluble in the component A. The component B is preferably the one produced by the polycondensation reaction of a diisocyanate and glycol, composed of the structural unit of formula (R1 and R2 are hydrocarbon residue) and having relatively high molecular weight.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は、接着硬化後に残留するタッキネスを防止した
新規なポリウレタン系接着剤に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a novel polyurethane adhesive that prevents tackiness remaining after adhesive curing.

(ロ)従来の技術及び発明が解決しようとする問題点 近年、ポリウレタン系接着剤はその性能の優秀さから種
々の物品の接着に応用されている。このような応用分野
の拡大によって、従来は全く問題とされていなかった接
着硬化後の残留タッキネスが問題とされるようになって
きた。この残留タッキネスは、ポリウレタン系接着剤の
主成分であるジイソシアネート誘導体の末端NC○基や
硬化剤であるトリイソシアネート化合物等のNGO基が
残存しているために生じると考えられる。
(b) Problems to be Solved by the Prior Art and the Invention In recent years, polyurethane adhesives have been used to bond various articles due to their excellent performance. With the expansion of such application fields, residual tackiness after adhesive curing has become a problem, which was not considered a problem at all in the past. This residual tackiness is thought to be caused by the residual terminal NC groups of the diisocyanate derivative that is the main component of the polyurethane adhesive and the NGO groups of the triisocyanate compound that is the curing agent.

この問題は、特に硬化後のポリウレタン系接着剤が露出
するフレキシブルプリント配線板の分野において重要視
されている。即ち、フレキシブルプリント配線板は、フ
ィルム等の支持体と金属箔とをポリウレタン系接着剤で
貼合し、その後配線部を残して非配線部となる金属箔を
エツチング除去して作成するものであるが、非配線部に
は接着硬化後のポリウレタン系接着剤が露出することに
なる。従って硬化後のポリウレタン系接着剤に残留タッ
キネスがあると、フレキシブルプリント配線板を積み重
ねて輸送している間に、配線板同士が付着してしまうと
いうことがある。この付着によってフレキシブルプリン
ト配線板の商品価値は低下するし、また付着が著しい場
合には、それを剥がす際配線部の剥離や配線板自体の破
れを惹起するという欠点があった。
This problem is particularly important in the field of flexible printed wiring boards where the polyurethane adhesive is exposed after curing. In other words, a flexible printed wiring board is created by laminating a support such as a film and metal foil with a polyurethane adhesive, and then etching away the metal foil that becomes the non-wiring area, leaving the wiring area. However, the polyurethane adhesive after curing will be exposed in the non-wiring areas. Therefore, if there is residual tackiness in the polyurethane adhesive after curing, the wiring boards may stick to each other while the flexible printed wiring boards are stacked and transported. This adhesion reduces the commercial value of the flexible printed wiring board, and if the adhesion is significant, the wiring portion may peel off or the wiring board itself may be torn when it is removed.

そこで本発明は、ポリウレタン系接着剤の応用分野の拡
大に伴って生じた欠点を解決しようという従来には存在
しなかった目的意識を持ってなされたものであり、ポリ
ウレタン系接着剤の接着硬化後の残留タッキネスを防止
せんとするものである。
Therefore, the present invention has been made with the aim of solving the drawbacks that have arisen with the expansion of the field of application of polyurethane adhesives, which did not exist in the past. The purpose is to prevent residual tackiness.

(ハ)問題点を解決するための手段及び作用即ち、本発
明は、有機溶媒と、該有機溶媒に可溶のジイソシアネー
ト系誘導体およびセルロース誘導体とよりなる、硬化後
の残留タッキネスを防止したポリウレタン系接着剤に係
るものである。
(c) Means and action for solving the problem, that is, the present invention provides a polyurethane system which prevents residual tackiness after curing and is made of an organic solvent and a diisocyanate derivative and a cellulose derivative that are soluble in the organic solvent. This relates to adhesives.

本発明に係るポリウレタン系接着剤は常温又は加熱硬化
型のものであって、溶剤である有機溶媒の揮発と共に硬
化の進むものである。
The polyurethane adhesive according to the present invention is of a room temperature or heat curing type, and hardens as the organic solvent evaporates.

本発明に用いる有機溶媒としては、トルエン。The organic solvent used in the present invention is toluene.

酢酸エチル、酢酸アミル、ブタノール、エタノール等の
所望のものが単独または混合して用いられるが、これは
ジイソシアネート系誘導体及びセルロース誘導体の両者
を溶解するものでなければならない。従って、用いたジ
イソシアネート系誘導体及びセルロース誘導体の種類に
よって、それを良く熔解するよう有機溶媒を適宜採択又
は混合する必要がある。
Ethyl acetate, amyl acetate, butanol, ethanol, etc., as desired, may be used alone or in combination, and must be capable of dissolving both the diisocyanate derivative and the cellulose derivative. Therefore, depending on the type of diisocyanate derivative and cellulose derivative used, it is necessary to appropriately select or mix an organic solvent to dissolve them well.

ジイソシアネート系誘導体というのは、主としてジイソ
シアネートとグリコールの重付加反応で生成する、下記
のごとき構成単位を持つ比較的高分子量のものをいう。
Diisocyanate derivatives refer to relatively high-molecular-weight derivatives having the following structural units, which are mainly produced by the polyaddition reaction of diisocyanates and glycols.

(但し、R,、R,は炭化水素基) しかしこれに限られず、その他の方法で生成するウレタ
ン結合+NHCOO+を持っ比較的高分子量のものも本
発明でいうジイソシアネート系誘導体に含まれる。
(However, R, and R are hydrocarbon groups.) However, the diisocyanate derivatives referred to in the present invention also include those having a urethane bond +NHCOO+ and having a relatively high molecular weight and produced by other methods.

セルロース誘導体としては、エチルセルロース。Ethyl cellulose is a cellulose derivative.

ニトロセルロース、酢酸セルロース、メチルセルロース
、カルボキシメチルセルロース、ヒドロキシエチルセル
ロース等が用いられる。この種のセルロース誘導体は有
機溶剤に熔かして単独で接着剤として用いられるが、本
発明ではこの物質は接着防止剤として使用されている点
に特徴がある。
Nitrocellulose, cellulose acetate, methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, etc. are used. This type of cellulose derivative is used alone as an adhesive by dissolving it in an organic solvent, but the present invention is characterized in that this substance is used as an anti-adhesion agent.

即ち、ジイソシアネート系誘導体の硬化後、残存するN
GO基を封鎖して、そのタッキネスを防止する作用を果
たすのである。
That is, after curing the diisocyanate derivative, the remaining N
It functions to block the GO group and prevent its tackiness.

セルロース誘導体の配合量はジイソシアネート系誘導体
100重量部に対して0.5〜3重量部皿部の少量でよ
い。これはそもそも残存するNGO基の量が少ないから
である。
The amount of the cellulose derivative to be blended may be as small as 0.5 to 3 parts by weight per 100 parts by weight of the diisocyanate derivative. This is because the amount of remaining NGO groups is small in the first place.

本発明のポリウレタン系接着剤中には、従来と同様、ジ
イソシアネート化合物又はトリイソシアネート化合物等
の硬化剤が配合される。
In the polyurethane adhesive of the present invention, a curing agent such as a diisocyanate compound or a triisocyanate compound is blended, as in conventional adhesives.

(ニ)発明の効果 以上の説明から明らかなように、本発明に係るポリウレ
タン系接着剤を用いれば、硬化後の接着剤が持つタッキ
ネスを防止することができるという効果を奏する。
(d) Effects of the Invention As is clear from the above description, the use of the polyurethane adhesive according to the present invention has the effect of preventing tackiness of the adhesive after curing.

特に、本発明に係るポリウレタン系接着剤をフレキシブ
ルプリント配線基板のフィルムと金属箔との接着に用い
れば、非配線部の金属箔をエツチング除去して作成した
フレキシブルプリント配線板を直ちに積み重ねて、製品
として出荷できるという効果を奏する。これが従来のポ
リウレタン系接着剤であると直ちに積み重ねることがで
きず、高温で10日以上も熟成した後、積み重ねて出荷
している。このことから判るように本発明は産業経済上
非常に有益なものである。
In particular, if the polyurethane adhesive according to the present invention is used to bond the film and metal foil of a flexible printed wiring board, the flexible printed wiring boards created by etching away the metal foil in the non-wiring areas can be immediately stacked and manufactured. This has the effect that it can be shipped as If this is a conventional polyurethane adhesive, it cannot be stacked immediately, so it is aged at high temperatures for more than 10 days before being stacked and shipped. As can be seen from this, the present invention is extremely useful from an industrial and economic perspective.

Claims (1)

【特許請求の範囲】[Claims] 有機溶媒と、該有機溶媒に可溶のジイソシアネート系誘
導体およびセルロース誘導体とよりなる、硬化後の残留
タッキネスを防止したポリウレタン系接着剤。
A polyurethane adhesive that prevents residual tackiness after curing and is made of an organic solvent and a diisocyanate derivative and a cellulose derivative that are soluble in the organic solvent.
JP6157585A 1985-03-25 1985-03-25 Polyurethane adhesive having suppressed residual tackiness after curing Granted JPS61218674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6157585A JPS61218674A (en) 1985-03-25 1985-03-25 Polyurethane adhesive having suppressed residual tackiness after curing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6157585A JPS61218674A (en) 1985-03-25 1985-03-25 Polyurethane adhesive having suppressed residual tackiness after curing

Publications (2)

Publication Number Publication Date
JPS61218674A true JPS61218674A (en) 1986-09-29
JPH0133512B2 JPH0133512B2 (en) 1989-07-13

Family

ID=13175055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6157585A Granted JPS61218674A (en) 1985-03-25 1985-03-25 Polyurethane adhesive having suppressed residual tackiness after curing

Country Status (1)

Country Link
JP (1) JPS61218674A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532542A (en) * 1976-06-30 1978-01-11 Koyo Sangyo Co Adhesive composition
JPS5443299A (en) * 1977-09-13 1979-04-05 Ota Toshuki Preparation of urethane resin
JPS54102334A (en) * 1978-01-30 1979-08-11 Koyo Sangyo Co Adhesives

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532542A (en) * 1976-06-30 1978-01-11 Koyo Sangyo Co Adhesive composition
JPS5443299A (en) * 1977-09-13 1979-04-05 Ota Toshuki Preparation of urethane resin
JPS54102334A (en) * 1978-01-30 1979-08-11 Koyo Sangyo Co Adhesives

Also Published As

Publication number Publication date
JPH0133512B2 (en) 1989-07-13

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