JPS61216343A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To realize a BTL connection in a stable operation by directly connecting the earth electrode with the earth bonding pad, and at the same time, to contrive to miniaturize the title circuit by stacking respectively the exclusive conductive path and the earth conductive path using a multilayer wiring. CONSTITUTION:An earth electrode 18, whereon an input signal to the inversion amplifier is impressed, is directly connected with an earth bonding pad 20 through an exclusive conductive path 19, and an earth conductive path 21 and the exclusive conductive path 19 and respectively stacked using a multilayer wiring. As each earth electrode of the noninversion amplifier and the inversion amplifier is not connected to the exclusive conductive path 19, unnecessary current does not run through the exclusive conductive path 19. Therefore, the fluctuations of the potential due to the resistance, which is caused by forming the exclusive conductive path 19 using an evaporating aluminum, can be nearly removed and the earth electrode 18 of a split resistor 3 can be fixed in nearly the same earth potential as that of the earth bonding path 20. As a result, a ripple component can be prevented from being included in the input signal to the conversion amplifier.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to improvements in semiconductor integrated circuits, particularly semiconductor integrated circuits incorporating BTL-connected amplifier circuits.

(b) Due to the structure of conventional semiconductor integrated circuits, it is difficult to form high voltage transistors.
It is often used to increase output through TL connection.

In general, BTL connections are of the output split type (man2
There are two types: the NF70-Ting type (Fig. 1) and the NF70-Ting type (Fig.
An NK input signal is applied, a feedback terminal NF is grounded via a capacitor, and an output signal is obtained from an output terminal OUT.

On the other hand, the input terminal IN of the inverting amplifier (2) is grounded, and the feedback terminal NFK connects the output signal of the non-inverting amplifier (1) to the dividing resistor (
3) and is fed back via a capacitor. A load R1 is connected between the output terminals of both amplifiers (1) and (2) to obtain twice the output signal.

The BTL connection of the NF floating shop uses a non-inverting amplifier (1
], apply the input terminal INK input of 1 inverting amplifier (2), ground the input terminal IN of 1 inverting amplifier (2), connect the feedback terminal NF of 1 amplifier (1 bar 2) with a capacitor and a resistor, and connect both amplifiers (1 bar 2).
A load RL is connected between the output terminal OUT of the .

The BTL connection is well known, for example, in Stereo Reproduction Device, written by Ken Suzumoto, Nikkan Kogyo Shimbun, published November 1970, page 189.

In a semiconductor integrated circuit incorporating the above-mentioned BTL-connected amplifier circuit, the inverting amplifier (feedback terminal NF of 21
Since an input signal is applied to the feedback terminal NF, if an input signal containing a ripple component is applied to the feedback terminal NF, hum will be output from the output terminal OUT. To prevent this, output split type B
In the TL circuit, the dividing resistor (3) is externally connected, and the dividing resistor (
The ground electrode of 3) is directly connected to the ground line of the printed circuit board, and even in the NF70-Ting type BTL circuit, the ground electrode that serves as the reference for applying the input signal to the feedback terminal NF is also directly connected to the ground line of the printed circuit board. Was.

G/→ Problems to be Solved by the Invention However, although this method could achieve a stable BTL connection, it resulted in an increase in the number of external parts and external leads, which was not a desirable condition for incorporation into electronic equipment. .

2) Means for Solving the Problems The present invention was made in view of the discontinuity, and the input signal of the inverting amplifier is applied between the feedback terminal and the ground electrode, and the input signal of the inverting amplifier is applied between the feedback terminal and the ground electrode. Connect the ground electrode, which is the reference of the signal, to the earth bonding pad ■ through the dedicated conductive path σ9, and connect the dedicated conductive path a9 and the earth conductive path +
The present invention provides a semiconductor integrated circuit suitable for BTL connection in which 211 and 211 are overlapped with multilayer wiring.

(e) Function According to the present invention, the ground electrode to which the input signal of the inverting amplifier is applied is directly connected to the most stable ground bonding pad in the semiconductor integrated circuit, so that ripple components are not present in the input signal of the inverting amplifier. It is characterized by being able to minimize the risk of passengers getting on the ground, and by overlapping the dedicated conductive path r19 and the ground conductive path (211) with multilayer wiring to achieve miniaturization.

(F) Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 shows a top view of a chip of a semiconductor integrated circuit according to the present invention. There is a power line αυ in the left and right direction in the center of the chip.
is extended, vertically dividing the chip into a first region α2 and a second region α3. The upper first area az has the third
Circuit elements such as transistors, resistors, and capacitors constituting the non-inverting amplifier (1) shown in FIGS.
is formed. The pounding pads α to α4 are arranged around the first region α2 and the second region at appropriate intervals. Each bonding pad I...α 1 corresponding lead (151...a9 and bonding wire αe/
...(connected at 161, and external parts such as capacitors are connected to leads a9...a9.

The symbols used in FIG. 1 correspond to those in FIGS. 3 and 4.

In FIG. 1, the wiring shown by solid lines is the first layer wiring of the multilayer wiring, and the wiring shown by dotted lines is the second layer wiring. For insulation between the first layer wiring and the second layer wiring, an interlayer insulation film made of a well-known polyimide resin or the like is used.

The feature of the present invention is that the ground electrode u81 to which the input signal of the inverting amplifier (2) is applied is directly connected to the ground bonding pad ■ by a dedicated conductive path U9 indicated by a dotted line, and the ground conductive path C1
1 and the dedicated conductive path a9 are stacked in multilayer wiring. The feedback conductive path from the output terminal OUT of the non-inverting amplifier (2) to the feedback terminal NF of the inverting amplifier (1) is arranged along the periphery of the chip in order to minimize the influence with other circuits. The outer sides of the bonding pads α4...I are extended as layer electrodes. A ground conductive path aδ is extended along the inside of this feedback conductive path aη. The ground conductive path u8 is arranged around the chip and connects the non-inverting amplifier (1
) and each ground electrode of the inverting amplifier (2) (not shown)
are all connected to the earth bonding pad CI! G
K is being guided.

As is clear from Figure 2, the dedicated conductive path 0 is located on the semiconductor substrate 6υ
A ground conductive layer consisting of the first electrode layer provided on the oxide film Q (overlaid on the ground conductive layer 211 via an interlayer insulating film made of polyimide resin, etc.).A dedicated conductive path (
19 is connected only to the ground electrode aδ of the dividing resistor (3) that forms the input signal of the inverting amplifier (2).

According to the above structure, the ground electrodes of the non-inverting amplifier (17) and the inverting amplifier (2J) are not connected to the dedicated conductive path (2), so no unnecessary current flows through the dedicated conductive path α9.

Therefore, fluctuations in potential due to resistance due to the fact that the dedicated conductive path C19 is formed of vapor-deposited aluminum can be almost eliminated, and the ground electrode u81 of the divided resistor (3) can be fixed at substantially the same ground potential as the ground bonding pad (2). As a result, it is possible to prevent ripple components from being included in the input signal to the inverting amplifier (2).

Furthermore, since the dedicated conductive path a9 is overlapped with the ground conductive path (211) to form a multilayer wiring, even if two systems of ground lines are provided, no extra space is required.

In the case of the NF70-Ting type BTL connection, the ground electrode, which serves as a reference for the input signal applied to the feedback terminal NFK of the inverting amplifier (2), may be similarly connected to the ground bonding pad through a dedicated conductive path.

(G) Effects of the Invention According to the present invention, the inverting amplifier (2
), the feedback terminal NF and the ground electrode αδ act as input terminals.
Among them, earth electrode σe is earth bonding back) −′
By directly connecting to
It is possible to prevent ripple components from being applied to the input signal of the inverting amplifier (21) and realize a BTL connection with stable operation.

In addition, conventional external parts such as dividing resistors can be placed internally, so
External mounting reduces the number of parts and external leads, making it very easy to integrate.

Furthermore, since the dedicated conductive path α9 and the ground conductive path O1 are superimposed to form a multilayer wiring, no extra space is required, and a shielding effect can be obtained by extending the dedicated conductive path a9 onto the return conductive path aη.

[Brief explanation of drawings]

FIG. 1 is a top view illustrating a semiconductor integrated circuit in which a BTL-connected amplifier of the present invention is installed, and FIG. 2 is a top view of the semiconductor integrated circuit of the present invention, and FIG.
The line sectional view, W43 diagram, and FIG. 4 are circuit diagrams illustrating a general TL-connected amplifier circuit. Explanation of the main books (υ is a non-inverting amplifier, (2) is an inverting amplifier, (3) is a dividing resistor, (171 is a feedback conductive path, eel is a ground electrode, σ
9 is a dedicated conductive path, ■ is a ground bonding pad, (2
11 is a ground conductive path. Applicant Sanyo Electric Co., Ltd. and 1 other agent Patent attorney Masao Sano l/+1 Figure 2 Figure 4

Claims (1)

[Claims] (1) In a semiconductor integrated circuit that incorporates an amplifier circuit in which a non-inverting amplifier and an inverting amplifier are connected BTL, a dedicated conductor is used to connect only the ground electrode, which serves as the reference for the input signal to the feedback terminal of the inverting amplifier, to the ground bonding pad. and a ground conductive path connecting other ground electrodes of a non-inverting amplifier and an inverting amplifier to the ground bonding pad, the dedicated conductive path and the ground conductive path being multilayer wiring and overlapping each other. integrated circuit.