JPS61216110A - Formation of metallic pattern - Google Patents

Abstract

PURPOSE:To prevent the generation of heat when a metallic pattern is formed by laminating many metallic plated layers to increase the aspect ratio of a fine metallic pattern and also to reduce the resistance of a magnetic circuit. CONSTITUTION:Both a metallic film 3 and a contact film 2 are provided on a substrate 1, and a photoresist 4 is applied to these films. Then the 1st plated layer 5 and a photoresist 6 of the 2nd layer are applied on the exposed part of the film 3 excluding the mask 4. The photoresist on the layer 5 is removed by the exposure and development processes. The 2nd plated layer 7 is formed on the layer 5, and both photoresists 4 and 6 are removed. Then both films 2 and 3 held between both plated layers are removed. Thus a fine metallic pattern having 1:1 aspect ratio is obtained by setting the pattern space of the photoresist mask at 4mum.

Description

TECHNICAL FIELD The present invention relates to a method for forming a fine metal pattern, and more particularly to a method for forming a metal pattern for a winding in a thin film magnetic head.

In conventional thin-film magnetic heads, a relatively large current (
It is necessary to flow several tens of mA). Therefore, it is necessary to reduce the resistance of the magnetic circuit, and to do this, it is necessary to suppress the width of the metal pattern that forms the winding to about a few microns, and to prevent heat generation during writing, the aspect ratio of the metal pattern must be large. There must be. In order to increase the aspect ratio, there is a conventional method of electroplating a metal pattern using a photoresist mask (Japanese Patent Publication No. 57-337).
03).

To obtain thick metal patterns, it is necessary to thicken the photoresist mask. However, as the photoresist mask becomes thicker, the degree to which the ultraviolet rays used for exposure is absorbed and scattered by the photoresist itself increases, and a large difference appears in the pattern width of the photoresist mask near the substrate and near the photoresist surface. Therefore, in the conventional metal pattern forming method described above, the aspect ratio of the metal pattern is set to 1.
: It is difficult to increase the number of windings to 1 or more, which poses an obstacle when manufacturing a thin film magnetic head with a large number of windings.

The present invention has been made to solve the problems of the conventional art, and its purpose is to provide a fine metal pattern that can easily increase the aspect ratio of a fine metal pattern. The object of the present invention is to provide a method for forming a pattern.

Structure of the Invention According to the present invention, a step of depositing a metal film on a predetermined substrate-h and selectively applying a mask to the first layer resist 1 on the metal film; a step of depositing a first metal plating layer on the exposed portion of the metal film; and a step of further depositing a second layer photoresist mask on the selectively formed first layer photoresist mask. 2. A method for forming a metal pattern is obtained, which comprises: (1) depositing a second metal layer on the first metal plating layer.

Example Hereinafter, the present invention will be explained in detail using the drawings.

Figures 1 (A) to (1'') are cross-sectional views showing the first embodiment of the present invention in the order of manufacturing steps, and as shown in Figure 1 (△).
Inorganic insulators such as Al2O3 or hard-baked fu A! A metal film 3 for electroplating on a substrate 1 made of an inorganic insulator such as ~Regime 1~
The adhesive film 2 on the substrate 1 is attached by sputtering or the like. When the metal used for electroplating is CLJ, it is preferable that the metal film 3 is also Cu. In this case, the adhesive film 2
is preferably Cr.

Furthermore, 4 is applied to the entire surface of the metal film 3 on the surface A1-resist 1. When SiBrain 1 Microbodies 1 to 1300-37 are used as the photoresist 1-, a film thickness of 3 μm or more can be easily obtained by setting the spin code rotation speed to 250 rpm. Therefore, the following figure 1 (B)
The photoresist mask 4 after exposure and development that has been selectively removed as shown in FIG.

FIG. 1(C) shows the metal film 3 other than the photoresist mask 4.
A first plating layer 5 having a thickness of approximately 2 μm is deposited on the exposed portion of the substrate. In this embodiment, Cu plating is performed.

FIG. 1(D) shows a second layer of film A on top of the first plating layer 5.
1 to Resis 1-0 are coated. When the photoresist on the first plating layer 5 is removed by the exposure phenomenon, a second photoresist mask 4 with a thickness of about 3 μm is further formed on the photoresist mask 4 for the first plating, as shown in FIG. 1(F). A layer photoresist mask 6 is formed.

FIG. 1(F) shows a second plating layer 7 on the first plating layer 5.
is attached. FIG. 1(G) shows the state in which resists A1 to 4.6 have been removed using an organic solvent or a dedicated resist remover 77t1 to resist.

Figure 1 (1'') shows the adhesive film 2 between the plating layers and the metal film 3 formed by etching or dry etching.
Shows the state with removed. If the pattern spacing of the photoresist mask is set to 4 μm, a fine metal pattern with an aspect ratio of 1:1 can be obtained using the above manufacturing method. In addition, in the figure, the vertical direction is further enlarged.

FIG. 2 shows a second embodiment of the invention. In this example,
Continuing from the state shown in Figure 1 (1''), Fo 1~Regis 1~
By repeating the coating, exposure phenomenon, and plating, the third plating layer 8 is formed.
A fine metal pattern with an aspect ratio of 2:1 is obtained by forming the fourth plating layer 9. Note that this figure is also shown enlarged in the vertical direction.

By repeating the above process, it is possible to obtain a fine metal pattern with an even larger aspect ratio.

Effects of the Invention As described above, according to the present invention, by multilayering the metal plating layer, the aspect ratio of the fine metal pattern can be increased, and the resistance of the magnetic circuit can be reduced to prevent heat generation. It will be possible.

Therefore, it can be effectively used in thin film magnetic heads.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of one embodiment of the present invention in the order of manufacturing steps, and FIG. 2 is a diagram showing another embodiment of the present invention. Explanation of symbols of main parts

Claims (1)

[Claims] A step of depositing a metal film on a predetermined substrate and selectively depositing a first layer of photoresist mask on the metal film, and depositing a first metal plating layer on the exposed portion of the metal film. further depositing a second layer of photoresist mask on the selectively formed first layer of photoresist mask, and further forming a second metal layer on the first metal plating layer. A method for forming a metal pattern, comprising the step of depositing a metal pattern.